{"id":"https://openalex.org/W2303722505","doi":"https://doi.org/10.1109/tvlsi.2015.2453192","title":"An Offset-Tolerant Dual-Reference-Voltage Sensing Scheme for Deep Submicrometer STT-RAM","display_name":"An Offset-Tolerant Dual-Reference-Voltage Sensing Scheme for Deep Submicrometer STT-RAM","publication_year":2015,"publication_date":"2015-08-14","ids":{"openalex":"https://openalex.org/W2303722505","doi":"https://doi.org/10.1109/tvlsi.2015.2453192","mag":"2303722505"},"language":"en","primary_location":{"id":"doi:10.1109/tvlsi.2015.2453192","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2015.2453192","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5089907396","display_name":"Taehui Na","orcid":"https://orcid.org/0000-0001-8823-0625"},"institutions":[{"id":"https://openalex.org/I193775966","display_name":"Yonsei University","ror":"https://ror.org/01wjejq96","country_code":"KR","type":"education","lineage":["https://openalex.org/I193775966"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Taehui Na","raw_affiliation_strings":["School of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea","institution_ids":["https://openalex.org/I193775966"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100451466","display_name":"Jisu Kim","orcid":"https://orcid.org/0000-0001-7019-3475"},"institutions":[{"id":"https://openalex.org/I193775966","display_name":"Yonsei University","ror":"https://ror.org/01wjejq96","country_code":"KR","type":"education","lineage":["https://openalex.org/I193775966"]},{"id":"https://openalex.org/I4210111675","display_name":"Market Matters","ror":"https://ror.org/021yan307","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I4210111675"]},{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["KR","US"],"is_corresponding":false,"raw_author_name":"Jisu Kim","raw_affiliation_strings":["Qualcomm Inc., San Diego, CA, USA","School of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea"],"affiliations":[{"raw_affiliation_string":"Qualcomm Inc., San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596","https://openalex.org/I4210111675"]},{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea","institution_ids":["https://openalex.org/I193775966"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113847642","display_name":"Byungkyu Song","orcid":null},"institutions":[{"id":"https://openalex.org/I193775966","display_name":"Yonsei University","ror":"https://ror.org/01wjejq96","country_code":"KR","type":"education","lineage":["https://openalex.org/I193775966"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Byungkyu Song","raw_affiliation_strings":["School of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea","institution_ids":["https://openalex.org/I193775966"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064984422","display_name":"Jung Pill Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I193775966","display_name":"Yonsei University","ror":"https://ror.org/01wjejq96","country_code":"KR","type":"education","lineage":["https://openalex.org/I193775966"]},{"id":"https://openalex.org/I4210111675","display_name":"Market Matters","ror":"https://ror.org/021yan307","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I4210111675"]},{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["KR","US"],"is_corresponding":false,"raw_author_name":"Jung Pill Kim","raw_affiliation_strings":["Qualcomm Inc., San Diego, CA, USA","School of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea"],"affiliations":[{"raw_affiliation_string":"Qualcomm Inc., San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596","https://openalex.org/I4210111675"]},{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea","institution_ids":["https://openalex.org/I193775966"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103061707","display_name":"Seung H. Kang","orcid":"https://orcid.org/0000-0003-4270-9918"},"institutions":[{"id":"https://openalex.org/I4210111675","display_name":"Market Matters","ror":"https://ror.org/021yan307","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I4210111675"]},{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Seung H. Kang","raw_affiliation_strings":["Qualcomm Inc., San Diego, CA, USA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Inc., San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596","https://openalex.org/I4210111675"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5037010076","display_name":"Seong\u2010Ook Jung","orcid":"https://orcid.org/0000-0003-0757-2581"},"institutions":[{"id":"https://openalex.org/I193775966","display_name":"Yonsei University","ror":"https://ror.org/01wjejq96","country_code":"KR","type":"education","lineage":["https://openalex.org/I193775966"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seong-Ook Jung","raw_affiliation_strings":["School of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea","institution_ids":["https://openalex.org/I193775966"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5089907396"],"corresponding_institution_ids":["https://openalex.org/I193775966"],"apc_list":null,"apc_paid":null,"fwci":1.9729,"has_fulltext":false,"cited_by_count":19,"citation_normalized_percentile":{"value":0.88065883,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":"24","issue":"4","first_page":"1361","last_page":"1370"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10049","display_name":"Magnetic properties of thin films","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12808","display_name":"Ferroelectric and Negative Capacitance Devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/offset","display_name":"Offset (computer science)","score":0.6964764595031738},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4918070137500763},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.41083937883377075},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.39354458451271057},{"id":"https://openalex.org/keywords/topology","display_name":"Topology (electrical circuits)","score":0.3295360803604126},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2332817018032074},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1857931911945343},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.0837460458278656}],"concepts":[{"id":"https://openalex.org/C175291020","wikidata":"https://www.wikidata.org/wiki/Q1156822","display_name":"Offset (computer science)","level":2,"score":0.6964764595031738},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4918070137500763},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.41083937883377075},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.39354458451271057},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.3295360803604126},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2332817018032074},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1857931911945343},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0837460458278656},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tvlsi.2015.2453192","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2015.2453192","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.6899999976158142}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":32,"referenced_works":["https://openalex.org/W1984842310","https://openalex.org/W1996356878","https://openalex.org/W2000777532","https://openalex.org/W2000818868","https://openalex.org/W2001108445","https://openalex.org/W2035257891","https://openalex.org/W2056511998","https://openalex.org/W2057386187","https://openalex.org/W2065991180","https://openalex.org/W2069795715","https://openalex.org/W2074628056","https://openalex.org/W2090387815","https://openalex.org/W2095913060","https://openalex.org/W2096445739","https://openalex.org/W2101328080","https://openalex.org/W2102209351","https://openalex.org/W2104500100","https://openalex.org/W2110276925","https://openalex.org/W2122287325","https://openalex.org/W2130436742","https://openalex.org/W2139052244","https://openalex.org/W2140392630","https://openalex.org/W2142571770","https://openalex.org/W2142897663","https://openalex.org/W2148831941","https://openalex.org/W2150938923","https://openalex.org/W2156728623","https://openalex.org/W2159904000","https://openalex.org/W6659307720","https://openalex.org/W6664507615","https://openalex.org/W6683132901","https://openalex.org/W6684149499"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2051487156","https://openalex.org/W2073681303","https://openalex.org/W2390279801","https://openalex.org/W2358668433","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W2382290278","https://openalex.org/W2478288626","https://openalex.org/W4391913857"],"abstract_inverted_index":{"Due":[0],"to":[1,33,73],"the":[2,92,99,112,146,174],"increased":[3],"process":[4,74],"variation":[5],"and":[6,62,76,111,165],"reduced":[7],"supply":[8],"voltage":[9],"in":[10,128],"deep":[11],"submicrometer":[12],"technology":[13],"nodes,":[14],"an":[15,51,129,139],"offset-tolerant":[16,24,93,176],"sensing":[17,25,45,90,94,163,177],"scheme":[18,46,70],"has":[19],"become":[20],"essential.":[21],"However,":[22],"most":[23],"schemes":[26],"suffer":[27],"from":[28],"inherent":[29],"performance":[30],"degradation":[31],"owing":[32],"multiple-stage":[34],"sensing.":[35],"In":[36],"this":[37],"paper,":[38],"a":[39,81,150],"dual":[40],"V":[41,53,58,63,103,119],"<sub":[42,54,59,64,104,120],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[43,55,60,65,105,121],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">ref</sub>":[44,56,106,122],"(DVSS)":[47],"that":[48,145],"selectively":[49],"uses":[50],"optimal":[52,102],"between":[57],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">ref+</sub>":[61],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">ref-</sub>":[66],"is":[67,71,95,107,125],"proposed.":[68],"This":[69],"tolerant":[72],"variations,":[75],"can":[77],"be":[78],"used":[79],"as":[80],"spin-transfer-torque":[82],"random":[83],"access":[84],"memory.":[85],"Because":[86],"of":[87,153],"no":[88],"additional":[89],"stage,":[91],"achieved":[96],"without":[97],"sacrificing":[98],"performance.":[100],"The":[101],"selected":[108],"after":[109],"fabrication,":[110],"calibrated":[113],"switch":[114],"control":[115],"bit,":[116],"which":[117],"contains":[118],"selection":[123],"information,":[124],"stored":[126],"permanently":[127],"on-chip":[130],"nonvolatile":[131],"latch.":[132],"Monte":[133],"Carlo":[134],"HSPICE":[135],"simulation":[136],"results,":[137],"using":[138],"industry-compatible":[140],"45-nm":[141],"model":[142],"parameters,":[143],"show":[144],"proposed":[147],"DVSS":[148],"achieves":[149],"read":[151,168],"yield":[152],"98.24%":[154],"for":[155],"32":[156],"Mb":[157],"(6.1":[158],"sigma)":[159],"with":[160,173],"2\u00d7":[161],"faster":[162],"speed":[164],"1.5\u00d7":[166],"lower":[167],"energy":[169],"per":[170],"bit":[171],"compared":[172],"state-of-the-art":[175],"scheme.":[178]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":4},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":3},{"year":2015,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}