{"id":"https://openalex.org/W1996238674","doi":"https://doi.org/10.1109/tvlsi.2014.2357756","title":"Microprocessor Aging Analysis and Reliability Modeling Due to Back-End Wearout Mechanisms","display_name":"Microprocessor Aging Analysis and Reliability Modeling Due to Back-End Wearout Mechanisms","publication_year":2014,"publication_date":"2014-10-02","ids":{"openalex":"https://openalex.org/W1996238674","doi":"https://doi.org/10.1109/tvlsi.2014.2357756","mag":"1996238674"},"language":"en","primary_location":{"id":"doi:10.1109/tvlsi.2014.2357756","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2014.2357756","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5011064659","display_name":"Chang-Chih Chen","orcid":null},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Chang-Chih Chen","raw_affiliation_strings":["School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","[School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA]"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"[School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA]","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5032107826","display_name":"Linda Milor","orcid":"https://orcid.org/0000-0002-8244-4793"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Linda Milor","raw_affiliation_strings":["School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","[School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA]"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"[School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA]","institution_ids":["https://openalex.org/I130701444"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5011064659"],"corresponding_institution_ids":["https://openalex.org/I130701444"],"apc_list":null,"apc_paid":null,"fwci":2.3027,"has_fulltext":false,"cited_by_count":22,"citation_normalized_percentile":{"value":0.89280639,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":"23","issue":"10","first_page":"2065","last_page":"2076"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microprocessor","display_name":"Microprocessor","score":0.8008294105529785},{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.7859976887702942},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.7229673266410828},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6716613173484802},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5403611063957214},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.5239068269729614},{"id":"https://openalex.org/keywords/very-large-scale-integration","display_name":"Very-large-scale integration","score":0.5018060207366943},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.40914541482925415},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4055163264274597},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2169816792011261},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20953315496444702}],"concepts":[{"id":"https://openalex.org/C2780728072","wikidata":"https://www.wikidata.org/wiki/Q5297","display_name":"Microprocessor","level":2,"score":0.8008294105529785},{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.7859976887702942},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.7229673266410828},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6716613173484802},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5403611063957214},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.5239068269729614},{"id":"https://openalex.org/C14580979","wikidata":"https://www.wikidata.org/wiki/Q876049","display_name":"Very-large-scale integration","level":2,"score":0.5018060207366943},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.40914541482925415},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4055163264274597},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2169816792011261},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20953315496444702},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tvlsi.2014.2357756","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2014.2357756","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G1321058349","display_name":null,"funder_award_id":"HR0011-11-1-0011","funder_id":"https://openalex.org/F4320332180","funder_display_name":"Defense Advanced Research Projects Agency"}],"funders":[{"id":"https://openalex.org/F4320332180","display_name":"Defense Advanced Research Projects Agency","ror":"https://ror.org/02caytj08"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":40,"referenced_works":["https://openalex.org/W1979695555","https://openalex.org/W1980582523","https://openalex.org/W1989874002","https://openalex.org/W1993597348","https://openalex.org/W1998810909","https://openalex.org/W2011127262","https://openalex.org/W2018633520","https://openalex.org/W2026064584","https://openalex.org/W2042998463","https://openalex.org/W2043294426","https://openalex.org/W2074688871","https://openalex.org/W2080300564","https://openalex.org/W2080592089","https://openalex.org/W2083774980","https://openalex.org/W2087286400","https://openalex.org/W2095416567","https://openalex.org/W2101096828","https://openalex.org/W2104929490","https://openalex.org/W2111637097","https://openalex.org/W2112787278","https://openalex.org/W2116269802","https://openalex.org/W2119716251","https://openalex.org/W2121990706","https://openalex.org/W2123300395","https://openalex.org/W2126232622","https://openalex.org/W2131014123","https://openalex.org/W2131451972","https://openalex.org/W2136143459","https://openalex.org/W2144125934","https://openalex.org/W2150056343","https://openalex.org/W2155022099","https://openalex.org/W2156373378","https://openalex.org/W2159812035","https://openalex.org/W2166943942","https://openalex.org/W2541605900","https://openalex.org/W3097985412","https://openalex.org/W3147595165","https://openalex.org/W3216147140","https://openalex.org/W4251383832","https://openalex.org/W6645551245"],"related_works":["https://openalex.org/W2393079529","https://openalex.org/W1515275251","https://openalex.org/W2135610295","https://openalex.org/W2137441628","https://openalex.org/W1677636423","https://openalex.org/W2104898937","https://openalex.org/W1515716822","https://openalex.org/W2088296464","https://openalex.org/W1664474149","https://openalex.org/W1908785542"],"abstract_inverted_index":{"Back-end":[0],"wearout":[1],"mechanisms":[2],"are":[3,66],"major":[4],"reliability":[5],"concerns":[6],"for":[7,18],"modern":[8],"microprocessors.":[9],"In":[10],"this":[11],"paper,":[12],"a":[13],"framework":[14],"that":[15],"contains":[16],"modules":[17],"back-end":[19],"time-dependent":[20],"dielectric":[21],"breakdown,":[22],"electromigration,":[23],"and":[24,34,54],"stress-induced":[25],"voiding":[26],"is":[27],"proposed":[28],"to":[29,36,42,68],"analyze":[30],"circuit":[31],"layout":[32],"geometries":[33],"interconnects":[35],"estimate":[37],"state-of-the-art":[38],"microprocessor":[39,62],"lifetime":[40],"due":[41],"each":[43,58],"mechanism.":[44],"Our":[45],"methodology":[46],"incorporates":[47],"the":[48,61],"detailed":[49],"electrical":[50],"stress":[51],"temperature,":[52],"linewidth,":[53],"cross-sectional":[55],"areas":[56],"of":[57],"interconnect/via":[59],"within":[60],"system.":[63],"Different":[64],"workloads":[65],"considered":[67],"evaluate":[69],"aging":[70],"effects":[71],"in":[72],"single-core":[73],"microprocessors":[74],"running":[75],"applications":[76],"with":[77],"realistic":[78],"use":[79],"conditions.":[80]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":4},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":7}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}