{"id":"https://openalex.org/W2067676571","doi":"https://doi.org/10.1109/tvlsi.2013.2283800","title":"Globally Constrained Locally Optimized 3-D Power Delivery Networks","display_name":"Globally Constrained Locally Optimized 3-D Power Delivery Networks","publication_year":2013,"publication_date":"2013-10-18","ids":{"openalex":"https://openalex.org/W2067676571","doi":"https://doi.org/10.1109/tvlsi.2013.2283800","mag":"2067676571"},"language":"en","primary_location":{"id":"doi:10.1109/tvlsi.2013.2283800","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2013.2283800","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://hal-lirmm.ccsd.cnrs.fr/lirmm-01255754","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5022136174","display_name":"Aida Todri\u2010Sanial","orcid":"https://orcid.org/0000-0001-8573-2910"},"institutions":[{"id":"https://openalex.org/I4210101743","display_name":"Laboratoire d'Informatique, de Robotique et de Micro\u00e9lectronique de Montpellier","ror":"https://ror.org/013yean28","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I1326498283","https://openalex.org/I151295451","https://openalex.org/I19894307","https://openalex.org/I4210101743","https://openalex.org/I4210159245","https://openalex.org/I4412460525"]}],"countries":["FR"],"is_corresponding":true,"raw_author_name":"Aida Todri-Sanial","raw_affiliation_strings":["Laboratoire d'Informatique de Robotique et de Micro\u00e9lectronique de Montpellier, Montpellier, France"],"affiliations":[{"raw_affiliation_string":"Laboratoire d'Informatique de Robotique et de Micro\u00e9lectronique de Montpellier, Montpellier, France","institution_ids":["https://openalex.org/I4210101743"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054064879","display_name":"Sandip Kundu","orcid":"https://orcid.org/0000-0001-8221-3824"},"institutions":[{"id":"https://openalex.org/I24603500","display_name":"University of Massachusetts Amherst","ror":"https://ror.org/0072zz521","country_code":"US","type":"education","lineage":["https://openalex.org/I24603500"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sandip Kundu","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, MA, USA","Department of Electrical and Computer Engineering; University of Massachusetts; Amherst MA USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, MA, USA","institution_ids":["https://openalex.org/I24603500"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering; University of Massachusetts; Amherst MA USA","institution_ids":["https://openalex.org/I24603500"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005116115","display_name":"Patrick Girard","orcid":"https://orcid.org/0000-0003-0722-8772"},"institutions":[{"id":"https://openalex.org/I4210101743","display_name":"Laboratoire d'Informatique, de Robotique et de Micro\u00e9lectronique de Montpellier","ror":"https://ror.org/013yean28","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I1326498283","https://openalex.org/I151295451","https://openalex.org/I19894307","https://openalex.org/I4210101743","https://openalex.org/I4210159245","https://openalex.org/I4412460525"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Patrick Girard","raw_affiliation_strings":["Laboratoire d'Informatique de Robotique et de Micro\u00e9lectronique de Montpellier, Montpellier, France"],"affiliations":[{"raw_affiliation_string":"Laboratoire d'Informatique de Robotique et de Micro\u00e9lectronique de Montpellier, Montpellier, France","institution_ids":["https://openalex.org/I4210101743"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074986688","display_name":"Alberto Bosio","orcid":"https://orcid.org/0000-0001-6116-7339"},"institutions":[{"id":"https://openalex.org/I4210101743","display_name":"Laboratoire d'Informatique, de Robotique et de Micro\u00e9lectronique de Montpellier","ror":"https://ror.org/013yean28","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I1326498283","https://openalex.org/I151295451","https://openalex.org/I19894307","https://openalex.org/I4210101743","https://openalex.org/I4210159245","https://openalex.org/I4412460525"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Alberto Bosio","raw_affiliation_strings":["Laboratoire d'Informatique de Robotique et de Micro\u00e9lectronique de Montpellier, Montpellier, France"],"affiliations":[{"raw_affiliation_string":"Laboratoire d'Informatique de Robotique et de Micro\u00e9lectronique de Montpellier, Montpellier, France","institution_ids":["https://openalex.org/I4210101743"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001777299","display_name":"Luigi Dilillo","orcid":"https://orcid.org/0000-0002-1295-2688"},"institutions":[{"id":"https://openalex.org/I4210101743","display_name":"Laboratoire d'Informatique, de Robotique et de Micro\u00e9lectronique de Montpellier","ror":"https://ror.org/013yean28","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I1326498283","https://openalex.org/I151295451","https://openalex.org/I19894307","https://openalex.org/I4210101743","https://openalex.org/I4210159245","https://openalex.org/I4412460525"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Luigi Dilillo","raw_affiliation_strings":["Laboratoire d'Informatique de Robotique et de Micro\u00e9lectronique de Montpellier, Montpellier, France"],"affiliations":[{"raw_affiliation_string":"Laboratoire d'Informatique de Robotique et de Micro\u00e9lectronique de Montpellier, Montpellier, France","institution_ids":["https://openalex.org/I4210101743"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5089236739","display_name":"A. Virazel","orcid":"https://orcid.org/0000-0001-7398-7107"},"institutions":[{"id":"https://openalex.org/I4210101743","display_name":"Laboratoire d'Informatique, de Robotique et de Micro\u00e9lectronique de Montpellier","ror":"https://ror.org/013yean28","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I1326498283","https://openalex.org/I151295451","https://openalex.org/I19894307","https://openalex.org/I4210101743","https://openalex.org/I4210159245","https://openalex.org/I4412460525"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Arnaud Virazel","raw_affiliation_strings":["Laboratoire d'Informatique de Robotique et de Micro\u00e9lectronique de Montpellier, Montpellier, France"],"affiliations":[{"raw_affiliation_string":"Laboratoire d'Informatique de Robotique et de Micro\u00e9lectronique de Montpellier, Montpellier, France","institution_ids":["https://openalex.org/I4210101743"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5022136174"],"corresponding_institution_ids":["https://openalex.org/I4210101743"],"apc_list":null,"apc_paid":null,"fwci":0.7207,"has_fulltext":false,"cited_by_count":17,"citation_normalized_percentile":{"value":0.75481219,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":"22","issue":"10","first_page":"2131","last_page":"2144"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9968000054359436,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9958999752998352,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/design-for-manufacturability","display_name":"Design for manufacturability","score":0.5423517823219299},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.529689371585846},{"id":"https://openalex.org/keywords/key","display_name":"Key (lock)","score":0.5150172710418701},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4896405339241028},{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.4875428378582001},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4349363446235657},{"id":"https://openalex.org/keywords/limit","display_name":"Limit (mathematics)","score":0.43356335163116455},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4105093479156494},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3154478073120117},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.313349187374115}],"concepts":[{"id":"https://openalex.org/C62064638","wikidata":"https://www.wikidata.org/wiki/Q553878","display_name":"Design for manufacturability","level":2,"score":0.5423517823219299},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.529689371585846},{"id":"https://openalex.org/C26517878","wikidata":"https://www.wikidata.org/wiki/Q228039","display_name":"Key (lock)","level":2,"score":0.5150172710418701},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4896405339241028},{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.4875428378582001},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4349363446235657},{"id":"https://openalex.org/C151201525","wikidata":"https://www.wikidata.org/wiki/Q177239","display_name":"Limit (mathematics)","level":2,"score":0.43356335163116455},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4105093479156494},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3154478073120117},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.313349187374115},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/tvlsi.2013.2283800","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2013.2283800","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},{"id":"pmh:oai:HAL:lirmm-01255754v1","is_oa":true,"landing_page_url":"https://hal-lirmm.ccsd.cnrs.fr/lirmm-01255754","pdf_url":null,"source":{"id":"https://openalex.org/S4306402512","display_name":"HAL (Le Centre pour la Communication Scientifique Directe)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1294671590","host_organization_name":"Centre National de la Recherche Scientifique","host_organization_lineage":["https://openalex.org/I1294671590"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2014, 22 (10), pp.2131-2144. ⟨10.1109/TVLSI.2013.2283800⟩","raw_type":"Journal articles"}],"best_oa_location":{"id":"pmh:oai:HAL:lirmm-01255754v1","is_oa":true,"landing_page_url":"https://hal-lirmm.ccsd.cnrs.fr/lirmm-01255754","pdf_url":null,"source":{"id":"https://openalex.org/S4306402512","display_name":"HAL (Le Centre pour la Communication Scientifique Directe)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1294671590","host_organization_name":"Centre National de la Recherche Scientifique","host_organization_lineage":["https://openalex.org/I1294671590"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2014, 22 (10), pp.2131-2144. ⟨10.1109/TVLSI.2013.2283800⟩","raw_type":"Journal articles"},"sustainable_development_goals":[{"score":0.46000000834465027,"display_name":"Decent work and economic growth","id":"https://metadata.un.org/sdg/8"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320320883","display_name":"Agence Nationale de la Recherche","ror":"https://ror.org/00rbzpz17"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":41,"referenced_works":["https://openalex.org/W607920065","https://openalex.org/W1969191661","https://openalex.org/W1976080818","https://openalex.org/W2001870828","https://openalex.org/W2022658722","https://openalex.org/W2035224686","https://openalex.org/W2043548604","https://openalex.org/W2051519216","https://openalex.org/W2077395645","https://openalex.org/W2100404320","https://openalex.org/W2100923005","https://openalex.org/W2101846378","https://openalex.org/W2109732691","https://openalex.org/W2111253135","https://openalex.org/W2112890389","https://openalex.org/W2115030014","https://openalex.org/W2115314588","https://openalex.org/W2117591305","https://openalex.org/W2124047460","https://openalex.org/W2124089733","https://openalex.org/W2128160450","https://openalex.org/W2129764097","https://openalex.org/W2132820637","https://openalex.org/W2133863299","https://openalex.org/W2136165389","https://openalex.org/W2140746294","https://openalex.org/W2148385942","https://openalex.org/W2155461249","https://openalex.org/W2155707315","https://openalex.org/W2161803106","https://openalex.org/W2162135665","https://openalex.org/W2536066754","https://openalex.org/W2541504714","https://openalex.org/W3146779744","https://openalex.org/W4232892799","https://openalex.org/W4241440036","https://openalex.org/W4256312066","https://openalex.org/W6677543417","https://openalex.org/W6679790342","https://openalex.org/W6680771764","https://openalex.org/W6728469656"],"related_works":["https://openalex.org/W2004615523","https://openalex.org/W2055638565","https://openalex.org/W2138118262","https://openalex.org/W2542708587","https://openalex.org/W2169154812","https://openalex.org/W2318525917","https://openalex.org/W2108703634","https://openalex.org/W2086910809","https://openalex.org/W1984394007","https://openalex.org/W3094065812"],"abstract_inverted_index":{"Design":[0],"of":[1,107,171],"power":[2,80,105,115,129],"delivery":[3],"network":[4],"(PDN)":[5],"is":[6,156],"a":[7,65,150,195],"constrained":[8,93],"optimization":[9,131],"problem.":[10],"An":[11],"ideal":[12,61],"PDN":[13,62],"must":[14],"limit":[15],"voltage":[16],"drop":[17],"that":[18,28,40,133,179],"results":[19],"from":[20,30,166],"switching":[21],"circuits'":[22],"transients,":[23],"satisfy":[24],"current":[25],"density":[26,42],"constraints":[27,144,163],"arise":[29],"electromigration":[31],"limits,":[32],"yet":[33,74,146],"use":[34],"only":[35],"minimal":[36],"metal":[37],"resources":[38],"so":[39],"design":[41,70],"targets":[43,170],"can":[44,202],"be":[45,64,75,147,203],"met.":[46],"It":[47],"should":[48,63],"also":[49],"provide":[50],"an":[51,60,127],"efficient":[52],"thermal":[53,169],"conduit":[54],"to":[55,68,77,97,136],"address":[56,78],"heat":[57],"flux.":[58],"Furthermore,":[59],"regular":[66],"structure":[67],"facilitate":[69],"productivity":[71],"and":[72,103,119,145,168],"manufacturability,":[73],"resilient":[76],"varying":[79,114],"demands":[81,116],"across":[82,110],"its":[83],"distribution":[84],"area.":[85],"In":[86,122],"3-D":[87,172,181,185],"ICs,":[88],"these":[89,192],"problems":[90],"are":[91,164,177],"further":[92],"by":[94,141],"the":[95],"need":[96],"minimize":[98],"through-silicon":[99],"via":[100],"(TSV)":[101],"area":[102,200],"bridge":[104],"lines":[106],"different":[108],"dimensions":[109],"tiers,":[111],"while":[112,159],"addressing":[113],"in":[117,149],"lateral":[118],"vertical":[120],"directions.":[121],"this":[123],"paper,":[124],"we":[125],"propose":[126],"unconventional":[128],"grid":[130],"solution":[132],"allows":[134],"us":[135],"resize":[137],"each":[138,154],"tier":[139,155],"individually":[140],"applying":[142],"tier-specific":[143],"optimal":[148],"multitier":[151],"network,":[152],"where":[153,198],"locally":[157],"resized":[158],"globally":[160],"constrained.":[161],"Tier-specific":[162],"derived":[165],"electrical":[167],"PDNs.":[173],"Two":[174],"resizing":[175],"algorithms":[176],"presented":[178],"optimize":[180],"PDNs":[182,186],"standalone":[183],"or":[184],"together":[187],"with":[188],"TSVs.":[189],"We":[190],"demonstrate":[191],"solutions":[193],"on":[194],"three-tier":[196],"setup":[197],"significant":[199],"savings":[201],"achieved.":[204]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":6},{"year":2016,"cited_by_count":2},{"year":2014,"cited_by_count":1}],"updated_date":"2026-03-10T16:38:18.471706","created_date":"2025-10-10T00:00:00"}