{"id":"https://openalex.org/W2114892410","doi":"https://doi.org/10.1109/tvlsi.2009.2013630","title":"Modeling and Analysis of the Nonrectangular Gate Effect for Postlithography Circuit Simulation","display_name":"Modeling and Analysis of the Nonrectangular Gate Effect for Postlithography Circuit Simulation","publication_year":2009,"publication_date":"2009-07-01","ids":{"openalex":"https://openalex.org/W2114892410","doi":"https://doi.org/10.1109/tvlsi.2009.2013630","mag":"2114892410"},"language":"en","primary_location":{"id":"doi:10.1109/tvlsi.2009.2013630","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2009.2013630","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5097037264","display_name":"Ritu Singal","orcid":null},"institutions":[{"id":"https://openalex.org/I4210093228","display_name":"Microchip Technology (United States)","ror":"https://ror.org/00kvz1558","country_code":"US","type":"company","lineage":["https://openalex.org/I4210093228"]},{"id":"https://openalex.org/I76308706","display_name":"Microchip Technology (Germany)","ror":"https://ror.org/05bqd9t64","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210093228","https://openalex.org/I76308706"]}],"countries":["DE","US"],"is_corresponding":false,"raw_author_name":"Ritu Singal","raw_affiliation_strings":["Microchip Technology, Inc., Chandler, AZ, USA","Microchip Technol. Inc., Chandler, AZ, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microchip Technology, Inc., Chandler, AZ, USA","institution_ids":["https://openalex.org/I4210093228"]},{"raw_affiliation_string":"Microchip Technol. Inc., Chandler, AZ, USA","institution_ids":["https://openalex.org/I76308706"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016332712","display_name":"Asha Balijepalli","orcid":null},"institutions":[{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Asha Balijepalli","raw_affiliation_strings":["Department of Electrical Engineering, Arizona State University, Tempe, AZ, USA","Dept. of Electr. Eng.. Arizona State Univ., Tempe, AZ, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, Arizona State University, Tempe, AZ, USA","institution_ids":["https://openalex.org/I55732556"]},{"raw_affiliation_string":"Dept. of Electr. Eng.. Arizona State Univ., Tempe, AZ, USA","institution_ids":["https://openalex.org/I55732556"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5029118023","display_name":"Anupama R. Subramaniam","orcid":null},"institutions":[{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Anupama Subramaniam","raw_affiliation_strings":["Department of Electrical Engineering, Arizona State University, Tempe, AZ, USA","Dept. of Electr. Eng.. Arizona State Univ., Tempe, AZ, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, Arizona State University, Tempe, AZ, USA","institution_ids":["https://openalex.org/I55732556"]},{"raw_affiliation_string":"Dept. of Electr. Eng.. Arizona State Univ., Tempe, AZ, USA","institution_ids":["https://openalex.org/I55732556"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037585738","display_name":"Chi\u2010Chao Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chi-Chao Wang","raw_affiliation_strings":["Department of Electrical Engineering, Arizona State University, Tempe, AZ, USA","Dept. of Electr. Eng.. Arizona State Univ., Tempe, AZ, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, Arizona State University, Tempe, AZ, USA","institution_ids":["https://openalex.org/I55732556"]},{"raw_affiliation_string":"Dept. of Electr. Eng.. Arizona State Univ., Tempe, AZ, USA","institution_ids":["https://openalex.org/I55732556"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006587869","display_name":"Frank Liu","orcid":"https://orcid.org/0000-0001-6615-0739"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]},{"id":"https://openalex.org/I4210156936","display_name":"IBM Research - Austin","ror":"https://ror.org/05gjbbg60","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115","https://openalex.org/I4210156936"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Frank Liu","raw_affiliation_strings":["IBM Research Laboratory, Austin, TX, USA","IBM Research Lab, Austin, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Research Laboratory, Austin, TX, USA","institution_ids":["https://openalex.org/I4210156936"]},{"raw_affiliation_string":"IBM Research Lab, Austin, TX, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046886936","display_name":"Sani Nassif","orcid":"https://orcid.org/0000-0002-5096-4794"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]},{"id":"https://openalex.org/I4210156936","display_name":"IBM Research - Austin","ror":"https://ror.org/05gjbbg60","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115","https://openalex.org/I4210156936"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sani R. Nassif","raw_affiliation_strings":["IBM Research Laboratory, Austin, TX, USA","IBM Research Lab, Austin, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Research Laboratory, Austin, TX, USA","institution_ids":["https://openalex.org/I4210156936"]},{"raw_affiliation_string":"IBM Research Lab, Austin, TX, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100740019","display_name":"Yu Cao","orcid":"https://orcid.org/0000-0001-6968-1180"},"institutions":[{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yu Cao","raw_affiliation_strings":["Department of Electrical Engineering, Arizona State University, Tempe, AZ, USA","Dept. of Electr. Eng.. Arizona State Univ., Tempe, AZ, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, Arizona State University, Tempe, AZ, USA","institution_ids":["https://openalex.org/I55732556"]},{"raw_affiliation_string":"Dept. of Electr. Eng.. Arizona State Univ., Tempe, AZ, USA","institution_ids":["https://openalex.org/I55732556"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.3003,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.64056266,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"18","issue":"4","first_page":"666","last_page":"670"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.4803372621536255},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.41355302929878235},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.357449471950531},{"id":"https://openalex.org/keywords/topology","display_name":"Topology (electrical circuits)","score":0.34064412117004395},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.23783203959465027},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.15259578824043274}],"concepts":[{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.4803372621536255},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.41355302929878235},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.357449471950531},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.34064412117004395},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.23783203959465027},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.15259578824043274}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tvlsi.2009.2013630","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2009.2013630","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W1503492383","https://openalex.org/W1604537105","https://openalex.org/W1753644305","https://openalex.org/W1870293527","https://openalex.org/W1971619329","https://openalex.org/W1989891105","https://openalex.org/W2001762759","https://openalex.org/W2027515410","https://openalex.org/W2069345435","https://openalex.org/W2077426284","https://openalex.org/W2114131053","https://openalex.org/W2115092649","https://openalex.org/W2172117646","https://openalex.org/W6635909610","https://openalex.org/W6648022024"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W3014521742","https://openalex.org/W2051487156","https://openalex.org/W2073681303","https://openalex.org/W2390279801","https://openalex.org/W2358668433","https://openalex.org/W2617868873","https://openalex.org/W3204141294","https://openalex.org/W2376932109","https://openalex.org/W2001405890"],"abstract_inverted_index":{"For":[0],"nanoscale":[1],"CMOS":[2],"devices,":[3],"gate":[4,29,88,93,107,178],"roughness":[5],"has":[6],"severe":[7],"impact":[8],"on":[9,55],"the":[10,22,27,66,79,82,86,106,113,119,170,176,183,191,198,221],"device":[11],"<i":[12,16,56,60,69,73,96,136,171,200],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[13,17,57,61,70,74,97,137,172,201],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">I</i>":[14,58,71],"-":[15,59,72],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">V</i>":[18,62,75],"characteristics,":[19],"particularly":[20],"in":[21,147],"subthreshold":[23],"region.":[24],"In":[25,43],"particular,":[26],"nonrectangular":[28],"(NRG)":[30],"geometries":[31,212],"are":[32],"caused":[33],"by":[34,124],"subwavelength":[35],"lithography":[36],"and":[37,158,213,216],"have":[38],"relatively":[39],"low":[40],"spatial":[41],"frequency.":[42],"this":[44,122],"paper,":[45],"we":[46],"present":[47],"an":[48,91],"analytical":[49],"approach":[50,123],"to":[51,78,127,167],"model":[52,84,139,203],"NRG":[53,80],"effects":[54],"characteristics.":[63],"To":[64],"predict":[65],"change":[67],"of":[68,105,112,121],"characteristics":[76],"due":[77],"effect,":[81],"proposed":[83,192,199],"converts":[85],"postlithography":[87,177],"profile":[89],"into":[90,143,190],"equivalent":[92],"length":[94],"(":[95],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">Le</i>":[98,138,173,202],")":[99],",":[100],"which":[101],"is":[102,140,186,204],"a":[103,164],"function":[104],"bias":[108,115,214],"voltage":[109],"but":[110],"independent":[111],"drain":[114],"voltage.":[116],"We":[117,161],"demonstrate":[118],"accuracy":[120],"comparing":[125],"it":[126],"TCAD":[128,194],"simulation":[129,150],"results":[130],"for":[131,155,206],"65-nm":[132],"technology.":[133],"The":[134,180],"new":[135],"readily":[141],"integrated":[142],"standard":[144],"transistor":[145,211],"models":[146],"traditional":[148],"circuit":[149],"tools,":[151],"such":[152],"as":[153],"SPICE,":[154],"both":[156,210],"dc":[157],"transient":[159],"analyses.":[160],"further":[162],"develop":[163],"generic":[165],"procedure":[166],"systematically":[168],"extract":[169],"value":[174],"from":[175],"profile.":[179],"interaction":[181],"with":[182,209],"narrow-width":[184],"effect":[185],"also":[187,217],"efficiently":[188],"incorporated":[189],"algorithm.":[193],"verification":[195],"demonstrates":[196],"that":[197],"simple":[205],"implementation,":[207],"scalable":[208],"conditions,":[215],"continuous":[218],"across":[219],"all":[220],"operation":[222],"regions.":[223]},"counts_by_year":[{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}