{"id":"https://openalex.org/W2133708550","doi":"https://doi.org/10.1109/tvlsi.2008.2010830","title":"Crosstalk-Induced Delay, Noise, and Interconnect Planarization Implications of Fill Metal in Nanoscale Process Technology","display_name":"Crosstalk-Induced Delay, Noise, and Interconnect Planarization Implications of Fill Metal in Nanoscale Process Technology","publication_year":2009,"publication_date":"2009-04-15","ids":{"openalex":"https://openalex.org/W2133708550","doi":"https://doi.org/10.1109/tvlsi.2008.2010830","mag":"2133708550"},"language":"en","primary_location":{"id":"doi:10.1109/tvlsi.2008.2010830","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2008.2010830","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5060207895","display_name":"Arthur Nieuwoudt","orcid":null},"institutions":[{"id":"https://openalex.org/I4210088951","display_name":"Synopsys (United States)","ror":"https://ror.org/013by2m91","country_code":"US","type":"company","lineage":["https://openalex.org/I4210088951"]},{"id":"https://openalex.org/I74775410","display_name":"Rice University","ror":"https://ror.org/008zs3103","country_code":"US","type":"education","lineage":["https://openalex.org/I74775410"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Arthur Nieuwoudt","raw_affiliation_strings":["Rice University, Houston, TX, USA","Synopsys, Inc., Sunnyvale, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Rice University, Houston, TX, USA","institution_ids":["https://openalex.org/I74775410"]},{"raw_affiliation_string":"Synopsys, Inc., Sunnyvale, CA, USA","institution_ids":["https://openalex.org/I4210088951"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047909050","display_name":"Jamil Kawa","orcid":null},"institutions":[{"id":"https://openalex.org/I4210088951","display_name":"Synopsys (United States)","ror":"https://ror.org/013by2m91","country_code":"US","type":"company","lineage":["https://openalex.org/I4210088951"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jamil Kawa","raw_affiliation_strings":["Synopsys, Inc., Mountain View, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Synopsys, Inc., Mountain View, CA, USA","institution_ids":["https://openalex.org/I4210088951"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5057380866","display_name":"Yehia Massoud","orcid":"https://orcid.org/0000-0002-6701-0639"},"institutions":[{"id":"https://openalex.org/I74775410","display_name":"Rice University","ror":"https://ror.org/008zs3103","country_code":"US","type":"education","lineage":["https://openalex.org/I74775410"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yehia Massoud","raw_affiliation_strings":["Rice University, Houston, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Rice University, Houston, TX, USA","institution_ids":["https://openalex.org/I74775410"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.8371,"has_fulltext":false,"cited_by_count":21,"citation_normalized_percentile":{"value":0.85247354,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":"18","issue":"3","first_page":"378","last_page":"391"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/chemical-mechanical-planarization","display_name":"Chemical-mechanical planarization","score":0.8286595344543457},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7658722400665283},{"id":"https://openalex.org/keywords/crosstalk","display_name":"Crosstalk","score":0.6727191805839539},{"id":"https://openalex.org/keywords/capacitance","display_name":"Capacitance","score":0.6572480201721191},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.6186866164207458},{"id":"https://openalex.org/keywords/very-large-scale-integration","display_name":"Very-large-scale integration","score":0.46243131160736084},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.45808544754981995},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4432438611984253},{"id":"https://openalex.org/keywords/parasitic-capacitance","display_name":"Parasitic capacitance","score":0.4188733398914337},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2477116882801056},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.16526132822036743},{"id":"https://openalex.org/keywords/polishing","display_name":"Polishing","score":0.15040233731269836},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.14194256067276}],"concepts":[{"id":"https://openalex.org/C180088628","wikidata":"https://www.wikidata.org/wiki/Q1069404","display_name":"Chemical-mechanical planarization","level":3,"score":0.8286595344543457},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7658722400665283},{"id":"https://openalex.org/C169822122","wikidata":"https://www.wikidata.org/wiki/Q230187","display_name":"Crosstalk","level":2,"score":0.6727191805839539},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.6572480201721191},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.6186866164207458},{"id":"https://openalex.org/C14580979","wikidata":"https://www.wikidata.org/wiki/Q876049","display_name":"Very-large-scale integration","level":2,"score":0.46243131160736084},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.45808544754981995},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4432438611984253},{"id":"https://openalex.org/C154318817","wikidata":"https://www.wikidata.org/wiki/Q2157249","display_name":"Parasitic capacitance","level":4,"score":0.4188733398914337},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2477116882801056},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.16526132822036743},{"id":"https://openalex.org/C138113353","wikidata":"https://www.wikidata.org/wiki/Q611639","display_name":"Polishing","level":2,"score":0.15040233731269836},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.14194256067276},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tvlsi.2008.2010830","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2008.2010830","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.46000000834465027,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":44,"referenced_works":["https://openalex.org/W161930826","https://openalex.org/W1486212813","https://openalex.org/W1556099140","https://openalex.org/W1732617650","https://openalex.org/W1949163578","https://openalex.org/W2024876042","https://openalex.org/W2067035452","https://openalex.org/W2098319450","https://openalex.org/W2098571191","https://openalex.org/W2102387714","https://openalex.org/W2104767888","https://openalex.org/W2107786105","https://openalex.org/W2115045032","https://openalex.org/W2119860317","https://openalex.org/W2124253553","https://openalex.org/W2127376190","https://openalex.org/W2133231188","https://openalex.org/W2135501127","https://openalex.org/W2135517221","https://openalex.org/W2141983875","https://openalex.org/W2142350374","https://openalex.org/W2142782342","https://openalex.org/W2147293610","https://openalex.org/W2147520163","https://openalex.org/W2157828395","https://openalex.org/W2161615290","https://openalex.org/W2162523242","https://openalex.org/W2166230687","https://openalex.org/W2167848093","https://openalex.org/W2178412182","https://openalex.org/W2535372780","https://openalex.org/W2629157711","https://openalex.org/W3150476217","https://openalex.org/W4230719168","https://openalex.org/W4235471468","https://openalex.org/W4235990555","https://openalex.org/W4256482552","https://openalex.org/W6637723331","https://openalex.org/W6674577083","https://openalex.org/W6680965030","https://openalex.org/W6681521189","https://openalex.org/W6685843745","https://openalex.org/W6729155301","https://openalex.org/W6817005902"],"related_works":["https://openalex.org/W1973489165","https://openalex.org/W2536238899","https://openalex.org/W2076670302","https://openalex.org/W2012485143","https://openalex.org/W2152880543","https://openalex.org/W3216034352","https://openalex.org/W2108368155","https://openalex.org/W2107552740","https://openalex.org/W2125788370","https://openalex.org/W2133708550"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"we":[3],"investigate":[4],"the":[5,73,96,111,113,121],"crosstalk-induced":[6,87,129],"delay,":[7],"noise,":[8,90],"and":[9,26,46,60,67,76,89,131,142],"chemical":[10],"mechanical":[11],"polishing":[12],"(CMP)-induced":[13],"thickness-variation":[14],"implications":[15],"of":[16,98],"dummy":[17],"fill":[18,24,42,80,148],"generated":[19,43],"using":[20,44],"rule-based":[21,45],"wire":[22],"track":[23],"techniques":[25],"CMP-aware":[27,47],"model-based":[28,48],"methods":[29,49],"for":[30],"designs":[31,77],"implemented":[32],"in":[33,72,85,93,110,137],"65":[34],"nm":[35],"process":[36],"technology.":[37],"The":[38],"results":[39],"indicate":[40],"that":[41],"can":[50],"have":[51],"a":[52,83],"significant":[53],"impact":[54],"on":[55,101],"parasitic":[56,140],"capacitance,":[57],"interconnect":[58,103,143],"planarization,":[59],"individual":[61],"path":[62],"delay":[63,66,88,115,122,130],"variation.":[64],"Crosstalk-induced":[65],"noise":[68,132],"are":[69,108],"significantly":[70,118],"reduced":[71],"grounded-fill":[74],"cases,":[75],"with":[78],"floating":[79],"also":[81],"experience":[82],"reduction":[84],"average":[86],"which":[91],"is":[92,117],"contrast":[94],"to":[95,139],"predictions":[97],"previous":[99],"studies":[100],"small-scale":[102],"structures.":[104],"When":[105],"crosstalk":[106,126],"effects":[107],"included":[109],"analysis,":[112],"observed":[114],"behavior":[116],"different":[119],"from":[120],"modeled":[123],"without":[124],"considering":[125],"effects.":[127],"Consequently,":[128],"must":[133],"be":[134],"simultaneously":[135],"considered":[136],"addition":[138],"capacitance":[141],"planarization":[144],"when":[145],"developing":[146],"future":[147],"generation":[149],"methods.":[150]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":3}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}