{"id":"https://openalex.org/W2164887058","doi":"https://doi.org/10.1109/tvlsi.2008.2005312","title":"Fully Monolithic Cellular Buck Converter Design for 3-D Power Delivery","display_name":"Fully Monolithic Cellular Buck Converter Design for 3-D Power Delivery","publication_year":2009,"publication_date":"2009-02-09","ids":{"openalex":"https://openalex.org/W2164887058","doi":"https://doi.org/10.1109/tvlsi.2008.2005312","mag":"2164887058"},"language":"en","primary_location":{"id":"doi:10.1109/tvlsi.2008.2005312","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2008.2005312","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100428994","display_name":"Jian Sun","orcid":"https://orcid.org/0000-0001-8964-6227"},"institutions":[{"id":"https://openalex.org/I165799507","display_name":"Rensselaer Polytechnic Institute","ror":"https://ror.org/01rtyzb94","country_code":"US","type":"education","lineage":["https://openalex.org/I165799507"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Jian Sun","raw_affiliation_strings":["Rensselaer Polytechnic Institute, Troy, NY, USA"],"affiliations":[{"raw_affiliation_string":"Rensselaer Polytechnic Institute, Troy, NY, USA","institution_ids":["https://openalex.org/I165799507"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072848012","display_name":"David M. Giuliano","orcid":null},"institutions":[{"id":"https://openalex.org/I63966007","display_name":"Massachusetts Institute of Technology","ror":"https://ror.org/042nb2s44","country_code":"US","type":"education","lineage":["https://openalex.org/I63966007"]},{"id":"https://openalex.org/I165799507","display_name":"Rensselaer Polytechnic Institute","ror":"https://ror.org/01rtyzb94","country_code":"US","type":"education","lineage":["https://openalex.org/I165799507"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Giuliano","raw_affiliation_strings":["Massachusetts Institute of Technology, Boston, MA, USA","Rensselaer Polytechnic Institute, Troy, NY, USA"],"affiliations":[{"raw_affiliation_string":"Massachusetts Institute of Technology, Boston, MA, USA","institution_ids":["https://openalex.org/I63966007"]},{"raw_affiliation_string":"Rensselaer Polytechnic Institute, Troy, NY, USA","institution_ids":["https://openalex.org/I165799507"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005069396","display_name":"S. Devarajan","orcid":"https://orcid.org/0000-0002-0346-3866"},"institutions":[{"id":"https://openalex.org/I165799507","display_name":"Rensselaer Polytechnic Institute","ror":"https://ror.org/01rtyzb94","country_code":"US","type":"education","lineage":["https://openalex.org/I165799507"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Devarajan","raw_affiliation_strings":["Rensselaer Polytechnic Institute, Troy, NY, USA"],"affiliations":[{"raw_affiliation_string":"Rensselaer Polytechnic Institute, Troy, NY, USA","institution_ids":["https://openalex.org/I165799507"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101492979","display_name":"Jian\u2010Qiang Lu","orcid":"https://orcid.org/0000-0002-3265-2535"},"institutions":[{"id":"https://openalex.org/I165799507","display_name":"Rensselaer Polytechnic Institute","ror":"https://ror.org/01rtyzb94","country_code":"US","type":"education","lineage":["https://openalex.org/I165799507"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jian-Qiang Lu","raw_affiliation_strings":["Rensselaer Polytechnic Institute, Troy, NY, USA"],"affiliations":[{"raw_affiliation_string":"Rensselaer Polytechnic Institute, Troy, NY, USA","institution_ids":["https://openalex.org/I165799507"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5059828920","display_name":"T. Paul Chow","orcid":"https://orcid.org/0000-0002-1078-1707"},"institutions":[{"id":"https://openalex.org/I165799507","display_name":"Rensselaer Polytechnic Institute","ror":"https://ror.org/01rtyzb94","country_code":"US","type":"education","lineage":["https://openalex.org/I165799507"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"T.P. Chow","raw_affiliation_strings":["Rensselaer Polytechnic Institute, Troy, NY, USA"],"affiliations":[{"raw_affiliation_string":"Rensselaer Polytechnic Institute, Troy, NY, USA","institution_ids":["https://openalex.org/I165799507"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5079222531","display_name":"R.J. Gutmann","orcid":null},"institutions":[{"id":"https://openalex.org/I165799507","display_name":"Rensselaer Polytechnic Institute","ror":"https://ror.org/01rtyzb94","country_code":"US","type":"education","lineage":["https://openalex.org/I165799507"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"R.J. Gutmann","raw_affiliation_strings":["Rensselaer Polytechnic Institute, Troy, NY, USA"],"affiliations":[{"raw_affiliation_string":"Rensselaer Polytechnic Institute, Troy, NY, USA","institution_ids":["https://openalex.org/I165799507"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5100428994"],"corresponding_institution_ids":["https://openalex.org/I165799507"],"apc_list":null,"apc_paid":null,"fwci":2.3926,"has_fulltext":false,"cited_by_count":31,"citation_normalized_percentile":{"value":0.89492603,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":98},"biblio":{"volume":"17","issue":"3","first_page":"447","last_page":"451"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10175","display_name":"Advanced DC-DC Converters","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10175","display_name":"Advanced DC-DC Converters","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9973999857902527,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/buck-converter","display_name":"Buck converter","score":0.7079827785491943},{"id":"https://openalex.org/keywords/converters","display_name":"Converters","score":0.5186842679977417},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5124431252479553},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.4885426461696625},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.46837741136550903},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.4547637104988098},{"id":"https://openalex.org/keywords/bicmos","display_name":"BiCMOS","score":0.4423137307167053},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.425295889377594},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.38274645805358887},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.35504257678985596},{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.2795698940753937},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.1162232756614685},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.10564860701560974}],"concepts":[{"id":"https://openalex.org/C150818752","wikidata":"https://www.wikidata.org/wiki/Q83804","display_name":"Buck converter","level":3,"score":0.7079827785491943},{"id":"https://openalex.org/C2778422915","wikidata":"https://www.wikidata.org/wiki/Q10302051","display_name":"Converters","level":3,"score":0.5186842679977417},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5124431252479553},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4885426461696625},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.46837741136550903},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4547637104988098},{"id":"https://openalex.org/C62427370","wikidata":"https://www.wikidata.org/wiki/Q173416","display_name":"BiCMOS","level":4,"score":0.4423137307167053},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.425295889377594},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.38274645805358887},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.35504257678985596},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.2795698940753937},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.1162232756614685},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.10564860701560974},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tvlsi.2008.2005312","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2008.2005312","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.8500000238418579}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W1545292401","https://openalex.org/W1943391756","https://openalex.org/W2025411433","https://openalex.org/W2100925189","https://openalex.org/W2102159448","https://openalex.org/W2106044767","https://openalex.org/W2112111321","https://openalex.org/W2144391331","https://openalex.org/W2157444974","https://openalex.org/W2399156338"],"related_works":["https://openalex.org/W631083485","https://openalex.org/W4313452936","https://openalex.org/W2097026685","https://openalex.org/W2169811953","https://openalex.org/W2102542442","https://openalex.org/W1986220761","https://openalex.org/W2070883797","https://openalex.org/W4386859288","https://openalex.org/W2042495646","https://openalex.org/W2538534558"],"abstract_inverted_index":{"A":[0],"fully":[1],"monolithic":[2,106,125],"interleaved":[3,68],"buck":[4,69],"dc-dc":[5],"point-of-load":[6],"(PoL)":[7],"converter":[8,36,70,92],"has":[9],"been":[10],"designed":[11],"and":[12,79,95,110],"fabricated":[13,115],"in":[14,32],"a":[15,88],"0.18-mm":[16],"SiGe":[17],"BiCMOS":[18],"process.":[19],"Target":[20],"application":[21],"of":[22,50,113,123,133],"the":[23,34,42,91,100,114,121,129],"design":[24],"is":[25,85],"3-D":[26,46,51],"power":[27,52,93,130],"delivery":[28,53,131],"for":[29],"future":[30,134],"microprocessors,":[31],"which":[33],"PoL":[35],"will":[37],"be":[38],"vertically":[39],"integrated":[40],"with":[41,87],"processor":[43],"using":[44,66],"wafer-level":[45],"interconnect":[47],"technologies.":[48],"Advantages":[49],"over":[54],"conventional":[55],"discrete":[56],"voltage":[57],"regulator":[58],"modules":[59],"(VRMs)":[60],"are":[61,117],"discussed.":[62],"The":[63],"prototype":[64,116],"design,":[65],"two":[67],"cells":[71],"each":[72],"operating":[73],"at":[74],"200":[75],"MHz":[76],"switching":[77],"frequency":[78],"delivering":[80],"500":[81],"mA":[82],"output":[83],"current,":[84],"discussed":[86],"focus":[89],"on":[90],"stage":[94],"control":[96],"loop":[97],"to":[98,103,119,127],"highlight":[99],"tradeoffs":[101],"unique":[102],"such":[104,124],"high-frequency,":[105],"designs.":[107],"Measured":[108],"steady-state":[109],"dynamic":[111],"responses":[112],"presented":[118],"demonstrate":[120],"ability":[122],"converters":[126],"meet":[128],"requirements":[132],"processors.":[135]},"counts_by_year":[{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":2},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":3},{"year":2015,"cited_by_count":5},{"year":2014,"cited_by_count":3},{"year":2013,"cited_by_count":5},{"year":2012,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}