{"id":"https://openalex.org/W2130921921","doi":"https://doi.org/10.1109/tvlsi.2008.2001735","title":"Efficient Distributed On-Chip Decoupling Capacitors for Nanoscale ICs","display_name":"Efficient Distributed On-Chip Decoupling Capacitors for Nanoscale ICs","publication_year":2008,"publication_date":"2008-11-25","ids":{"openalex":"https://openalex.org/W2130921921","doi":"https://doi.org/10.1109/tvlsi.2008.2001735","mag":"2130921921"},"language":"en","primary_location":{"id":"doi:10.1109/tvlsi.2008.2001735","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2008.2001735","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5073281491","display_name":"Mikhail Popovich","orcid":"https://orcid.org/0000-0003-2930-2435"},"institutions":[{"id":"https://openalex.org/I19268510","display_name":"Qualcomm (United Kingdom)","ror":"https://ror.org/04d3djg48","country_code":"GB","type":"company","lineage":["https://openalex.org/I19268510","https://openalex.org/I4210087596"]},{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["GB","US"],"is_corresponding":false,"raw_author_name":"M. Popovich","raw_affiliation_strings":["QCT, Qualcomm Corporation, San Diego, CA, USA","QCT, Qualcomm Corporation, San Diego, CA#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"QCT, Qualcomm Corporation, San Diego, CA, USA","institution_ids":["https://openalex.org/I4210087596"]},{"raw_affiliation_string":"QCT, Qualcomm Corporation, San Diego, CA#TAB#","institution_ids":["https://openalex.org/I19268510"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053517349","display_name":"Eby G. Friedman","orcid":"https://orcid.org/0000-0002-5549-7160"},"institutions":[{"id":"https://openalex.org/I5388228","display_name":"University of Rochester","ror":"https://ror.org/022kthw22","country_code":"US","type":"education","lineage":["https://openalex.org/I5388228"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"E.G. Friedman","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Rochester, Rochester, NY, USA","Department of Electrical and Computer Engineering, University of Rochester, Rochester, NY#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Rochester, Rochester, NY, USA","institution_ids":["https://openalex.org/I5388228"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Rochester, Rochester, NY#TAB#","institution_ids":["https://openalex.org/I5388228"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108634711","display_name":"R.M. Secareanu","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"R.M. Secareanu","raw_affiliation_strings":["Microwave and Mixed Signal Technologies Laboratory, Freescale Semiconductor, Inc., Tempe, AZ, USA","Microwave and Mixed Signal Technologies Laboratory, Freescale Semiconductor, Tempe, AZ#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microwave and Mixed Signal Technologies Laboratory, Freescale Semiconductor, Inc., Tempe, AZ, USA","institution_ids":[]},{"raw_affiliation_string":"Microwave and Mixed Signal Technologies Laboratory, Freescale Semiconductor, Tempe, AZ#TAB#","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5089852164","display_name":"O. Hartin","orcid":"https://orcid.org/0000-0002-4339-2513"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"O.L. Hartin","raw_affiliation_strings":["Microwave and Mixed Signal Technologies Laboratory, Freescale Semiconductor, Inc., Tempe, AZ, USA","Microwave and Mixed Signal Technologies Laboratory, Freescale Semiconductor, Tempe, AZ#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microwave and Mixed Signal Technologies Laboratory, Freescale Semiconductor, Inc., Tempe, AZ, USA","institution_ids":[]},{"raw_affiliation_string":"Microwave and Mixed Signal Technologies Laboratory, Freescale Semiconductor, Tempe, AZ#TAB#","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":{"value":2645,"currency":"USD","value_usd":2645},"apc_paid":null,"fwci":0.3017,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":{"value":0.68995694,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"16","issue":"12","first_page":"1717","last_page":"1721"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/decoupling-capacitor","display_name":"Decoupling capacitor","score":0.8968386650085449},{"id":"https://openalex.org/keywords/decoupling","display_name":"Decoupling (probability)","score":0.8729773759841919},{"id":"https://openalex.org/keywords/capacitor","display_name":"Capacitor","score":0.8270429968833923},{"id":"https://openalex.org/keywords/capacitance","display_name":"Capacitance","score":0.661327600479126},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.6348389387130737},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5731903910636902},{"id":"https://openalex.org/keywords/parasitic-capacitance","display_name":"Parasitic capacitance","score":0.5090693831443787},{"id":"https://openalex.org/keywords/parasitic-extraction","display_name":"Parasitic extraction","score":0.5089848041534424},{"id":"https://openalex.org/keywords/spice","display_name":"Spice","score":0.49765732884407043},{"id":"https://openalex.org/keywords/electrical-impedance","display_name":"Electrical impedance","score":0.47161275148391724},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.4416671395301819},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.43613579869270325},{"id":"https://openalex.org/keywords/equivalent-series-resistance","display_name":"Equivalent series resistance","score":0.43000054359436035},{"id":"https://openalex.org/keywords/filter-capacitor","display_name":"Filter capacitor","score":0.4140235483646393},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.37574607133865356},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.34127092361450195},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.260814905166626},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.17495763301849365},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.16475516557693481},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.09574541449546814},{"id":"https://openalex.org/keywords/control-engineering","display_name":"Control engineering","score":0.0763990581035614}],"concepts":[{"id":"https://openalex.org/C35196352","wikidata":"https://www.wikidata.org/wiki/Q1532649","display_name":"Decoupling capacitor","level":4,"score":0.8968386650085449},{"id":"https://openalex.org/C205606062","wikidata":"https://www.wikidata.org/wiki/Q5249645","display_name":"Decoupling (probability)","level":2,"score":0.8729773759841919},{"id":"https://openalex.org/C52192207","wikidata":"https://www.wikidata.org/wiki/Q5322","display_name":"Capacitor","level":3,"score":0.8270429968833923},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.661327600479126},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6348389387130737},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5731903910636902},{"id":"https://openalex.org/C154318817","wikidata":"https://www.wikidata.org/wiki/Q2157249","display_name":"Parasitic capacitance","level":4,"score":0.5090693831443787},{"id":"https://openalex.org/C159818811","wikidata":"https://www.wikidata.org/wiki/Q7135947","display_name":"Parasitic extraction","level":2,"score":0.5089848041534424},{"id":"https://openalex.org/C2780077345","wikidata":"https://www.wikidata.org/wiki/Q16891888","display_name":"Spice","level":2,"score":0.49765732884407043},{"id":"https://openalex.org/C17829176","wikidata":"https://www.wikidata.org/wiki/Q179043","display_name":"Electrical impedance","level":2,"score":0.47161275148391724},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.4416671395301819},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.43613579869270325},{"id":"https://openalex.org/C14485415","wikidata":"https://www.wikidata.org/wiki/Q5384730","display_name":"Equivalent series resistance","level":3,"score":0.43000054359436035},{"id":"https://openalex.org/C157808515","wikidata":"https://www.wikidata.org/wiki/Q4781508","display_name":"Filter capacitor","level":4,"score":0.4140235483646393},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.37574607133865356},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.34127092361450195},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.260814905166626},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.17495763301849365},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.16475516557693481},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09574541449546814},{"id":"https://openalex.org/C133731056","wikidata":"https://www.wikidata.org/wiki/Q4917288","display_name":"Control engineering","level":1,"score":0.0763990581035614},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tvlsi.2008.2001735","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tvlsi.2008.2001735","pdf_url":null,"source":{"id":"https://openalex.org/S37538908","display_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","issn_l":"1063-8210","issn":["1063-8210","1557-9999"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.5699999928474426}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1546169179","https://openalex.org/W1610803466","https://openalex.org/W1905842392","https://openalex.org/W2104923609","https://openalex.org/W2122165059","https://openalex.org/W2125671371","https://openalex.org/W2126997378","https://openalex.org/W2147126729","https://openalex.org/W2165604639","https://openalex.org/W4285719527","https://openalex.org/W6639840969"],"related_works":["https://openalex.org/W63447294","https://openalex.org/W2537334175","https://openalex.org/W1973000679","https://openalex.org/W2068547800","https://openalex.org/W2114312831","https://openalex.org/W4256385015","https://openalex.org/W3215101624","https://openalex.org/W2106005208","https://openalex.org/W3082795214","https://openalex.org/W4252453963"],"abstract_inverted_index":{"A":[0,11],"distributed":[1,14,40,64],"on-chip":[2,15,29,41,65,78],"decoupling":[3,16,30,42,66],"capacitor":[4,45],"network":[5],"is":[6,18,46,88],"proposed":[7],"in":[8,60],"this":[9],"paper.":[10],"system":[12,38,62],"of":[13,39,53,63,77],"capacitors":[17,67],"shown":[19],"to":[20,92],"provide":[21],"an":[22],"efficient":[23],"solution":[24],"for":[25,74],"providing":[26],"the":[27,50,54],"required":[28],"capacitance":[31],"under":[32],"existing":[33],"technology":[34],"constraints.":[35],"In":[36],"a":[37,61],"capacitors,":[43],"each":[44],"sized":[47],"based":[48],"on":[49],"parasitic":[51,79],"impedance":[52],"power":[55],"distribution":[56],"grid.":[57],"Various":[58],"tradeoffs":[59],"are":[68,81],"also":[69,82],"discussed.":[70],"Related":[71],"simulation":[72],"results":[73],"typical":[75],"values":[76],"resistance":[80],"presented.":[83],"The":[84],"worst":[85],"case":[86],"error":[87],"0.003%":[89],"as":[90],"compared":[91],"SPICE.":[93]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2012,"cited_by_count":2}],"updated_date":"2026-08-21T09:56:20.448147","created_date":"2025-10-10T00:00:00"}