{"id":"https://openalex.org/W3196304337","doi":"https://doi.org/10.1109/tsp52935.2021.9522666","title":"Conductive Printing of RFID Tag and Chip Contacting Methods for High Volume Additive Production","display_name":"Conductive Printing of RFID Tag and Chip Contacting Methods for High Volume Additive Production","publication_year":2021,"publication_date":"2021-07-26","ids":{"openalex":"https://openalex.org/W3196304337","doi":"https://doi.org/10.1109/tsp52935.2021.9522666","mag":"3196304337"},"language":"en","primary_location":{"id":"doi:10.1109/tsp52935.2021.9522666","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tsp52935.2021.9522666","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 44th International Conference on Telecommunications and Signal Processing (TSP)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5040444112","display_name":"Michal Kerndl","orcid":null},"institutions":[{"id":"https://openalex.org/I60587646","display_name":"Brno University of Technology","ror":"https://ror.org/03613d656","country_code":"CZ","type":"education","lineage":["https://openalex.org/I60587646"]}],"countries":["CZ"],"is_corresponding":true,"raw_author_name":"Michal Kerndl","raw_affiliation_strings":["Brno University of Technology, Brno, Czech Republic"],"affiliations":[{"raw_affiliation_string":"Brno University of Technology, Brno, Czech Republic","institution_ids":["https://openalex.org/I60587646"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5061129780","display_name":"Pavel \u0160teffan","orcid":"https://orcid.org/0000-0002-8466-0625"},"institutions":[{"id":"https://openalex.org/I60587646","display_name":"Brno University of Technology","ror":"https://ror.org/03613d656","country_code":"CZ","type":"education","lineage":["https://openalex.org/I60587646"]}],"countries":["CZ"],"is_corresponding":false,"raw_author_name":"Pavel Steffan","raw_affiliation_strings":["Brno University of Technology, Brno, Czech Republic"],"affiliations":[{"raw_affiliation_string":"Brno University of Technology, Brno, Czech Republic","institution_ids":["https://openalex.org/I60587646"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5040444112"],"corresponding_institution_ids":["https://openalex.org/I60587646"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.09005577,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"22","issue":null,"first_page":"352","last_page":"356"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9977999925613403,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.7216233015060425},{"id":"https://openalex.org/keywords/conductive-ink","display_name":"Conductive ink","score":0.6271730661392212},{"id":"https://openalex.org/keywords/electrical-conductor","display_name":"Electrical conductor","score":0.548425018787384},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.528076171875},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.5109211802482605},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.5016305446624756},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4993748664855957},{"id":"https://openalex.org/keywords/radio-frequency-identification","display_name":"Radio-frequency identification","score":0.47929778695106506},{"id":"https://openalex.org/keywords/near-field-communication","display_name":"Near field communication","score":0.47158634662628174},{"id":"https://openalex.org/keywords/focus","display_name":"Focus (optics)","score":0.42554113268852234},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3626244068145752},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3189910650253296},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.272359162569046},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.23981323838233948},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19776353240013123},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.08297565579414368}],"concepts":[{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.7216233015060425},{"id":"https://openalex.org/C2777892344","wikidata":"https://www.wikidata.org/wiki/Q5159386","display_name":"Conductive ink","level":4,"score":0.6271730661392212},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.548425018787384},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.528076171875},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.5109211802482605},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.5016305446624756},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4993748664855957},{"id":"https://openalex.org/C204222849","wikidata":"https://www.wikidata.org/wiki/Q104954","display_name":"Radio-frequency identification","level":2,"score":0.47929778695106506},{"id":"https://openalex.org/C175604262","wikidata":"https://www.wikidata.org/wiki/Q273353","display_name":"Near field communication","level":3,"score":0.47158634662628174},{"id":"https://openalex.org/C192209626","wikidata":"https://www.wikidata.org/wiki/Q190909","display_name":"Focus (optics)","level":2,"score":0.42554113268852234},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3626244068145752},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3189910650253296},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.272359162569046},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.23981323838233948},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19776353240013123},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.08297565579414368},{"id":"https://openalex.org/C66825105","wikidata":"https://www.wikidata.org/wiki/Q354718","display_name":"Sheet resistance","level":3,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.0},{"id":"https://openalex.org/C96122199","wikidata":"https://www.wikidata.org/wiki/Q628096","display_name":"Ultra high frequency","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tsp52935.2021.9522666","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tsp52935.2021.9522666","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 44th International Conference on Telecommunications and Signal Processing (TSP)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5899999737739563,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":20,"referenced_works":["https://openalex.org/W1706216394","https://openalex.org/W1755227063","https://openalex.org/W1874093040","https://openalex.org/W1902748306","https://openalex.org/W1975743784","https://openalex.org/W1991099316","https://openalex.org/W2068220298","https://openalex.org/W2113261573","https://openalex.org/W2126076787","https://openalex.org/W2137803469","https://openalex.org/W2155230353","https://openalex.org/W2157760616","https://openalex.org/W2539407353","https://openalex.org/W2743875511","https://openalex.org/W3015715114","https://openalex.org/W3049395604","https://openalex.org/W3103243862","https://openalex.org/W3117171073","https://openalex.org/W6637618429","https://openalex.org/W6680563852"],"related_works":["https://openalex.org/W2093387329","https://openalex.org/W2355567628","https://openalex.org/W2124391012","https://openalex.org/W2801872294","https://openalex.org/W2390748531","https://openalex.org/W4361220757","https://openalex.org/W2333075698","https://openalex.org/W4312671188","https://openalex.org/W1933023828","https://openalex.org/W244162531"],"abstract_inverted_index":{"The":[0],"emerging":[1],"Internet":[2],"of":[3,12,26,88],"Things":[4],"(IoT)":[5],"paradigm":[6],"keeps":[7],"pressure":[8],"on":[9,16,78,104,109],"constant":[10],"innovation":[11],"manufacturing":[13],"processes,":[14],"mainly":[15,57],"additive":[17,41],"technologies":[18,52],"that":[19,116],"can":[20],"significantly":[21],"reduce":[22],"waste":[23],"and":[24,36,124],"cost":[25,35,60],"manufactured":[27],"parts.":[28],"Promising":[29],"field":[30],"for":[31,54,58,101],"high":[32],"volume,":[33],"low":[34,59],"quick":[37],"time":[38],"to":[39],"market":[40],"fabrication":[42],"method":[43,82,115],"is":[44,90],"printing.":[45],"This":[46,81,94],"paper":[47],"briefly":[48],"compares":[49],"current":[50,97],"printing":[51],"used":[53],"electronics":[55,103],"fabrication,":[56],"Radio":[61],"Frequency":[62],"Identification":[63],"(RFID),":[64],"Near":[65],"Field":[66],"Communication":[67],"(NFC)":[68],"tags,":[69],"smart":[70,72],"labels,":[71],"packaging,":[73],"sensors":[74],"etc.":[75],"with":[76,107],"focus":[77,108],"\"offset":[79],"lithography\".":[80],"raises":[83],"a":[84],"big":[85],"challenges,":[86],"one":[87],"them":[89],"chip":[91,123],"contacting":[92,98],"method.":[93],"work":[95],"summarizes":[96],"methods":[99],"suitable":[100],"printed":[102],"flexible":[105],"substrates":[106],"promising":[110],"contactless":[111],"RFID":[112],"magnetic":[113],"coupling":[114],"does":[117],"not":[118],"require":[119],"conductive":[120],"connection":[121],"between":[122],"antenna":[125],"itself.":[126]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}