{"id":"https://openalex.org/W1983835122","doi":"https://doi.org/10.1109/tsmc.1984.6313276","title":"Metal surface inspection using image processing techniques","display_name":"Metal surface inspection using image processing techniques","publication_year":1984,"publication_date":"1984-01-01","ids":{"openalex":"https://openalex.org/W1983835122","doi":"https://doi.org/10.1109/tsmc.1984.6313276","mag":"1983835122"},"language":"en","primary_location":{"id":"doi:10.1109/tsmc.1984.6313276","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tsmc.1984.6313276","pdf_url":null,"source":{"id":"https://openalex.org/S76152103","display_name":"IEEE Transactions on Systems Man and Cybernetics","issn_l":"0018-9472","issn":["0018-9472","2168-2909"],"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Systems, Man, and Cybernetics","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111525038","display_name":"Hon-Son Don","orcid":null},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Hon-Son Don","raw_affiliation_strings":["School of Electrical Engineering, Purdue University, West Lafayette, IN 47907"],"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering, Purdue University, West Lafayette, IN 47907","institution_ids":["https://openalex.org/I219193219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111805936","display_name":"King\u2010Sun Fu","orcid":null},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"King-Sun Fu","raw_affiliation_strings":["School of Electrical Engineering, Purdue University, West Lafayette, IN 47907"],"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering, Purdue University, West Lafayette, IN 47907","institution_ids":["https://openalex.org/I219193219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5114106054","display_name":"C. R. Liu","orcid":null},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"C. R. Liu","raw_affiliation_strings":["School of Electrical Engineering, Purdue University, West Lafayette, IN 47907"],"affiliations":[{"raw_affiliation_string":"School of Electrical Engineering, Purdue University, West Lafayette, IN 47907","institution_ids":["https://openalex.org/I219193219"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101552925","display_name":"Wei\u2010Chung Lin","orcid":null},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Wei-Chung Lin","raw_affiliation_strings":["Department of Industrial Engineering, Purdue University, West Lafayette, IN 47907"],"affiliations":[{"raw_affiliation_string":"Department of Industrial Engineering, Purdue University, West Lafayette, IN 47907","institution_ids":["https://openalex.org/I219193219"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5111525038"],"corresponding_institution_ids":["https://openalex.org/I219193219"],"apc_list":null,"apc_paid":null,"fwci":4.8266,"has_fulltext":false,"cited_by_count":47,"citation_normalized_percentile":{"value":0.93245069,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"SMC-14","issue":"1","first_page":"139","last_page":"146"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13049","display_name":"Surface Roughness and Optical Measurements","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12169","display_name":"Non-Destructive Testing Techniques","score":0.994700014591217,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.6586045026779175},{"id":"https://openalex.org/keywords/feature-extraction","display_name":"Feature extraction","score":0.6366108655929565},{"id":"https://openalex.org/keywords/pattern-recognition","display_name":"Pattern recognition (psychology)","score":0.6260330677032471},{"id":"https://openalex.org/keywords/surface-roughness","display_name":"Surface roughness","score":0.592969536781311},{"id":"https://openalex.org/keywords/image-processing","display_name":"Image processing","score":0.5346324443817139},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.534504771232605},{"id":"https://openalex.org/keywords/classifier","display_name":"Classifier (UML)","score":0.49522843956947327},{"id":"https://openalex.org/keywords/contextual-image-classification","display_name":"Contextual image classification","score":0.48008471727371216},{"id":"https://openalex.org/keywords/surface-finish","display_name":"Surface finish","score":0.46458059549331665},{"id":"https://openalex.org/keywords/surface","display_name":"Surface (topology)","score":0.4637380838394165},{"id":"https://openalex.org/keywords/computer-vision","display_name":"Computer vision","score":0.43706804513931274},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.36904990673065186},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.20752790570259094},{"id":"https://openalex.org/keywords/image","display_name":"Image (mathematics)","score":0.18108424544334412},{"id":"https://openalex.org/keywords/geometry","display_name":"Geometry","score":0.10153350234031677}],"concepts":[{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.6586045026779175},{"id":"https://openalex.org/C52622490","wikidata":"https://www.wikidata.org/wiki/Q1026626","display_name":"Feature extraction","level":2,"score":0.6366108655929565},{"id":"https://openalex.org/C153180895","wikidata":"https://www.wikidata.org/wiki/Q7148389","display_name":"Pattern recognition (psychology)","level":2,"score":0.6260330677032471},{"id":"https://openalex.org/C107365816","wikidata":"https://www.wikidata.org/wiki/Q114817","display_name":"Surface roughness","level":2,"score":0.592969536781311},{"id":"https://openalex.org/C9417928","wikidata":"https://www.wikidata.org/wiki/Q1070689","display_name":"Image processing","level":3,"score":0.5346324443817139},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.534504771232605},{"id":"https://openalex.org/C95623464","wikidata":"https://www.wikidata.org/wiki/Q1096149","display_name":"Classifier (UML)","level":2,"score":0.49522843956947327},{"id":"https://openalex.org/C75294576","wikidata":"https://www.wikidata.org/wiki/Q5165192","display_name":"Contextual image classification","level":3,"score":0.48008471727371216},{"id":"https://openalex.org/C71039073","wikidata":"https://www.wikidata.org/wiki/Q3439090","display_name":"Surface finish","level":2,"score":0.46458059549331665},{"id":"https://openalex.org/C2776799497","wikidata":"https://www.wikidata.org/wiki/Q484298","display_name":"Surface (topology)","level":2,"score":0.4637380838394165},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.43706804513931274},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.36904990673065186},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.20752790570259094},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.18108424544334412},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.10153350234031677},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tsmc.1984.6313276","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tsmc.1984.6313276","pdf_url":null,"source":{"id":"https://openalex.org/S76152103","display_name":"IEEE Transactions on Systems Man and Cybernetics","issn_l":"0018-9472","issn":["0018-9472","2168-2909"],"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Systems, Man, and Cybernetics","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2386922414","https://openalex.org/W4313638943","https://openalex.org/W1966522691","https://openalex.org/W4304014137","https://openalex.org/W3034740403","https://openalex.org/W2032025132","https://openalex.org/W4297916609","https://openalex.org/W2349732462","https://openalex.org/W2106541163","https://openalex.org/W1988381798"],"abstract_inverted_index":{"The":[0,43,56],"feasibility":[1],"of":[2,69,73,85,88],"applying":[3],"image":[4],"processing":[5],"techniques":[6,62],"to":[7,63],"metal":[8,16,26,32,44,53,65],"surface":[9,17,27,33,40,45,54],"inspection":[10,18],"is":[11],"demonstrated.":[12],"Two":[13],"methods":[14],"for":[15],"are":[19,35],"described.":[20],"In":[21],"the":[22,25,31,52,83,111],"first":[23],"method,":[24],"reflective":[28],"power":[29],"and":[30,76,82],"normal":[34],"related":[36],"by":[37],"a":[38],"random":[39],"scattering":[41],"model.":[42],"profile":[46],"can":[47],"then":[48],"be":[49],"computed":[50],"from":[51],"normal.":[55],"second":[57],"method":[58],"applies":[59],"pattern":[60],"recognition":[61],"classify":[64],"surfaces":[66],"into":[67],"classes":[68],"different":[70,86],"roughness.":[71],"Methods":[72],"feature":[74],"extraction":[75],"classification":[77,109],"have":[78,90],"been":[79,91],"tested":[80],"experimentally":[81],"performances":[84],"types":[87],"classifier":[89,96],"compared.":[92],"A":[93],"two-level":[94],"tree":[95],"using":[97],"nonparametric":[98],"linear":[99],"classifiers":[100],"at":[101],"each":[102],"node":[103],"gives":[104],"better":[105],"than":[106],"90%":[107],"correct":[108],"on":[110],"testing":[112],"set.":[113]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}
