{"id":"https://openalex.org/W7123360698","doi":"https://doi.org/10.1109/tr.2025.3647435","title":"Development and Practical Advances in Integrated Circuit Electromagnetic Reliability Over the Last Decade","display_name":"Development and Practical Advances in Integrated Circuit Electromagnetic Reliability Over the Last Decade","publication_year":2026,"publication_date":"2026-01-01","ids":{"openalex":"https://openalex.org/W7123360698","doi":"https://doi.org/10.1109/tr.2025.3647435"},"language":null,"primary_location":{"id":"doi:10.1109/tr.2025.3647435","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tr.2025.3647435","pdf_url":null,"source":{"id":"https://openalex.org/S87725633","display_name":"IEEE Transactions on Reliability","issn_l":"0018-9529","issn":["0018-9529","1558-1721"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5060169526","display_name":"L Chen","orcid":null},"institutions":[{"id":"https://openalex.org/I170215575","display_name":"National University of Defense Technology","ror":"https://ror.org/05d2yfz11","country_code":"CN","type":"education","lineage":["https://openalex.org/I170215575"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Ledong Chen","raw_affiliation_strings":["College of Electronic Science and Technology, National University of Defense Technology, Changsha, China"],"raw_orcid":"https://orcid.org/0000-0002-9298-2675","affiliations":[{"raw_affiliation_string":"College of Electronic Science and Technology, National University of Defense Technology, Changsha, China","institution_ids":["https://openalex.org/I170215575"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Jianfei Wu","orcid":"https://orcid.org/0000-0002-0908-8614"},"institutions":[{"id":"https://openalex.org/I170215575","display_name":"National University of Defense Technology","ror":"https://ror.org/05d2yfz11","country_code":"CN","type":"education","lineage":["https://openalex.org/I170215575"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jianfei Wu","raw_affiliation_strings":[" College of Electronic Science and Technology, National University of Defense Technology, Changsha, China"],"raw_orcid":"https://orcid.org/0000-0002-0908-8614","affiliations":[{"raw_affiliation_string":" College of Electronic Science and Technology, National University of Defense Technology, Changsha, China","institution_ids":["https://openalex.org/I170215575"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Honghai Liu","orcid":null},"institutions":[{"id":"https://openalex.org/I170215575","display_name":"National University of Defense Technology","ror":"https://ror.org/05d2yfz11","country_code":"CN","type":"education","lineage":["https://openalex.org/I170215575"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Honghai Liu","raw_affiliation_strings":["College of Electronic Science and Technology, National University of Defense Technology, Changsha, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"College of Electronic Science and Technology, National University of Defense Technology, Changsha, China","institution_ids":["https://openalex.org/I170215575"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5122874578","display_name":"Fukang Niu","orcid":null},"institutions":[{"id":"https://openalex.org/I170215575","display_name":"National University of Defense Technology","ror":"https://ror.org/05d2yfz11","country_code":"CN","type":"education","lineage":["https://openalex.org/I170215575"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fukang Niu","raw_affiliation_strings":["College of Electronic Science and Technology, National University of Defense Technology, Changsha, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"College of Electronic Science and Technology, National University of Defense Technology, Changsha, China","institution_ids":["https://openalex.org/I170215575"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5122904445","display_name":"Linxi Huang","orcid":null},"institutions":[{"id":"https://openalex.org/I170215575","display_name":"National University of Defense Technology","ror":"https://ror.org/05d2yfz11","country_code":"CN","type":"education","lineage":["https://openalex.org/I170215575"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Linxi Huang","raw_affiliation_strings":["College of Electronic Science and Technology, National University of Defense Technology, Changsha, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"College of Electronic Science and Technology, National University of Defense Technology, Changsha, China","institution_ids":["https://openalex.org/I170215575"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034144240","display_name":"P. Jiang","orcid":null},"institutions":[{"id":"https://openalex.org/I170215575","display_name":"National University of Defense Technology","ror":"https://ror.org/05d2yfz11","country_code":"CN","type":"education","lineage":["https://openalex.org/I170215575"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Pingyun Jiang","raw_affiliation_strings":["College of Electronic Science and Technology, National University of Defense Technology, Changsha, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"College of Electronic Science and Technology, National University of Defense Technology, Changsha, China","institution_ids":["https://openalex.org/I170215575"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5122847071","display_name":"Jibin Liu","orcid":null},"institutions":[{"id":"https://openalex.org/I170215575","display_name":"National University of Defense Technology","ror":"https://ror.org/05d2yfz11","country_code":"CN","type":"education","lineage":["https://openalex.org/I170215575"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jibin Liu","raw_affiliation_strings":["College of Electronic Science and Technology, National University of Defense Technology, Changsha, China"],"raw_orcid":"https://orcid.org/0000-0003-3979-5771","affiliations":[{"raw_affiliation_string":"College of Electronic Science and Technology, National University of Defense Technology, Changsha, China","institution_ids":["https://openalex.org/I170215575"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5060169526"],"corresponding_institution_ids":["https://openalex.org/I170215575"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.07327621,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"75","issue":null,"first_page":"819","last_page":"832"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.41830000281333923,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.41830000281333923,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.07450000196695328,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.06360000371932983,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interdependence","display_name":"Interdependence","score":0.6007999777793884},{"id":"https://openalex.org/keywords/electromagnetic-compatibility","display_name":"Electromagnetic compatibility","score":0.5633999705314636},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.521399974822998},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.5},{"id":"https://openalex.org/keywords/bridging","display_name":"Bridging (networking)","score":0.4896000027656555},{"id":"https://openalex.org/keywords/electromagnetic-interference","display_name":"Electromagnetic interference","score":0.4697999954223633},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.38179999589920044},{"id":"https://openalex.org/keywords/field","display_name":"Field (mathematics)","score":0.33320000767707825}],"concepts":[{"id":"https://openalex.org/C185874996","wikidata":"https://www.wikidata.org/wiki/Q269699","display_name":"Interdependence","level":2,"score":0.6007999777793884},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.5663999915122986},{"id":"https://openalex.org/C125470083","wikidata":"https://www.wikidata.org/wiki/Q747288","display_name":"Electromagnetic compatibility","level":2,"score":0.5633999705314636},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.521399974822998},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.5},{"id":"https://openalex.org/C174348530","wikidata":"https://www.wikidata.org/wiki/Q188635","display_name":"Bridging (networking)","level":2,"score":0.4896000027656555},{"id":"https://openalex.org/C184892835","wikidata":"https://www.wikidata.org/wiki/Q1474513","display_name":"Electromagnetic interference","level":2,"score":0.4697999954223633},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.45899999141693115},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.42800000309944153},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.4090000092983246},{"id":"https://openalex.org/C112930515","wikidata":"https://www.wikidata.org/wiki/Q4389547","display_name":"Risk analysis (engineering)","level":1,"score":0.3837999999523163},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.38179999589920044},{"id":"https://openalex.org/C9652623","wikidata":"https://www.wikidata.org/wiki/Q190109","display_name":"Field (mathematics)","level":2,"score":0.33320000767707825},{"id":"https://openalex.org/C2778306610","wikidata":"https://www.wikidata.org/wiki/Q7189696","display_name":"Physics of failure","level":4,"score":0.32839998602867126},{"id":"https://openalex.org/C66283442","wikidata":"https://www.wikidata.org/wiki/Q1389268","display_name":"Failure mode and effects analysis","level":2,"score":0.3179999887943268},{"id":"https://openalex.org/C174998907","wikidata":"https://www.wikidata.org/wiki/Q357662","display_name":"Work in process","level":2,"score":0.30970001220703125},{"id":"https://openalex.org/C23725684","wikidata":"https://www.wikidata.org/wiki/Q616377","display_name":"Maintenance engineering","level":2,"score":0.30390000343322754},{"id":"https://openalex.org/C112987892","wikidata":"https://www.wikidata.org/wiki/Q5051574","display_name":"Catastrophic failure","level":2,"score":0.29899999499320984},{"id":"https://openalex.org/C2778309119","wikidata":"https://www.wikidata.org/wiki/Q5121614","display_name":"Circuit reliability","level":4,"score":0.29899999499320984},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.2702000141143799},{"id":"https://openalex.org/C201729545","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability theory","level":3,"score":0.260699987411499},{"id":"https://openalex.org/C152124472","wikidata":"https://www.wikidata.org/wiki/Q1204361","display_name":"Redundancy (engineering)","level":2,"score":0.26010000705718994},{"id":"https://openalex.org/C28843909","wikidata":"https://www.wikidata.org/wiki/Q177625","display_name":"Electromagnetic field","level":2,"score":0.2526000142097473}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tr.2025.3647435","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tr.2025.3647435","pdf_url":null,"source":{"id":"https://openalex.org/S87725633","display_name":"IEEE Transactions on Reliability","issn_l":"0018-9529","issn":["0018-9529","1558-1721"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5694358944892883,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":69,"referenced_works":["https://openalex.org/W1522193198","https://openalex.org/W1579598622","https://openalex.org/W1978844068","https://openalex.org/W1981867110","https://openalex.org/W1994743138","https://openalex.org/W2000554782","https://openalex.org/W2005829064","https://openalex.org/W2021824097","https://openalex.org/W2035883040","https://openalex.org/W2057025643","https://openalex.org/W2071920673","https://openalex.org/W2094610271","https://openalex.org/W2112643533","https://openalex.org/W2112774177","https://openalex.org/W2141565132","https://openalex.org/W2218607081","https://openalex.org/W2289797172","https://openalex.org/W2331144473","https://openalex.org/W2338233723","https://openalex.org/W2342386422","https://openalex.org/W2405841984","https://openalex.org/W2468538397","https://openalex.org/W2474967110","https://openalex.org/W2524184042","https://openalex.org/W2540496230","https://openalex.org/W2560512726","https://openalex.org/W2563760349","https://openalex.org/W2742313987","https://openalex.org/W2753313284","https://openalex.org/W2755507879","https://openalex.org/W2768042671","https://openalex.org/W2770900658","https://openalex.org/W2895907140","https://openalex.org/W2896838799","https://openalex.org/W2897039132","https://openalex.org/W2911165071","https://openalex.org/W2951201234","https://openalex.org/W2970963565","https://openalex.org/W2974906749","https://openalex.org/W2985255155","https://openalex.org/W3035375617","https://openalex.org/W3047146014","https://openalex.org/W3047709903","https://openalex.org/W3048902956","https://openalex.org/W3095711704","https://openalex.org/W3191549253","https://openalex.org/W3194510261","https://openalex.org/W3200219099","https://openalex.org/W3206019052","https://openalex.org/W3210071136","https://openalex.org/W3211082524","https://openalex.org/W3213908057","https://openalex.org/W4200293762","https://openalex.org/W4220991069","https://openalex.org/W4226073571","https://openalex.org/W4233977170","https://openalex.org/W4285230289","https://openalex.org/W4293029326","https://openalex.org/W4295037232","https://openalex.org/W4296475603","https://openalex.org/W4296914486","https://openalex.org/W4297802373","https://openalex.org/W4297984631","https://openalex.org/W4302014070","https://openalex.org/W4304468729","https://openalex.org/W4322706793","https://openalex.org/W4327643793","https://openalex.org/W4375947509","https://openalex.org/W4387753021"],"related_works":[],"abstract_inverted_index":{"As":[0],"we":[1],"delve":[2],"deeper":[3],"into":[4,90,112],"the":[5,26,48,63],"post-Moore":[6],"era,":[7],"integrated":[8],"circuits":[9],"(ICs)":[10],"confront":[11],"escalating":[12],"electromagnetic":[13,18,141],"reliability":[14],"(EMR)":[15],"challenges.":[16],"Traditional":[17],"compatibility":[19],"(EMC)":[20],"frameworks":[21],"fall":[22],"short":[23],"in":[24,34,155,181],"addressing":[25],"lifetime":[27,146],"performance":[28],"degradation":[29,73],"of":[30,43,66,85],"nano-scale":[31],"ICs":[32],"operating":[33],"multi-physics":[35,116],"environments.":[36],"This":[37],"review":[38,109,153],"offers":[39],"a":[40,52,82,157],"comprehensive":[41],"synthesis":[42],"IC":[44],"EMR":[45,162],"advancements":[46],"spanning":[47],"past":[49],"decade":[50],"(2013-2023),":[51],"period":[53],"chosen":[54],"because":[55],"28":[56],"nm":[57,60],"to":[58],"3":[59],"scaling":[61],"and":[62,68,100,122,145,169,188],"2014/2020":[64],"revisions":[65],"AEC-Q100":[67,120],"IEC":[69],"62132":[70],"introduced":[71],"new":[72],"mechanisms":[74],"not":[75],"covered":[76],"by":[77],"earlier":[78],"surveys.":[79],"It":[80],"establishes":[81],"consolidated":[83],"framework":[84],"influencing":[86],"factors,":[87],"categorizing":[88],"them":[89],"four":[91],"interdependent":[92],"domains:":[93],"process":[94],"scaling,":[95],"GHz-band":[96],"effects,":[97],"3D":[98],"packaging,":[99],"application":[101],"environments,":[102],"thereby":[103],"bridging":[104],"critical":[105],"literature":[106],"gaps.":[107],"The":[108,152],"also":[110],"delves":[111],"emergent":[113],"trends":[114],"like":[115],"field":[117],"modeling,":[118],"automotive-grade":[119],"compliance,":[121],"in-situ":[123],"aging":[124],"monitoring,":[125],"proposing":[126],"innovative":[127],"data-driven":[128],"solutions":[129,135],"for":[130,160,176],"pressing":[131],"industry":[132],"concerns.":[133],"These":[134,172],"include":[136],"standardized":[137],"quantitative":[138],"evaluation,":[139],"chip-level":[140],"interference":[142],"(EMI)":[143],"suppression,":[144],"prediction":[147],"under":[148],"harsh":[149],"environmental":[150],"conditions.":[151],"culminates":[154],"presenting":[156],"forward-looking":[158],"roadmap":[159],"next-generation":[161],"design,":[163],"emphasizing":[164],"AI-optimized":[165],"shielding,":[166],"self-healing":[167],"circuits,":[168],"heterogeneous":[170],"integration.":[171],"strategies":[173],"are":[174],"crucial":[175],"mitigating":[177],"catastrophic":[178],"system":[179],"risks":[180],"safety-critical":[182],"applications":[183],"such":[184],"as":[185],"aerospace,":[186],"automotive,":[187],"IoT.":[189]},"counts_by_year":[],"updated_date":"2026-02-11T14:41:00.668223","created_date":"2026-01-14T00:00:00"}