{"id":"https://openalex.org/W2048982934","doi":"https://doi.org/10.1109/tr.2015.2408231","title":"So Where Are We? <newline/>A Guest Opinion Editorial","display_name":"So Where Are We? <newline/>A Guest Opinion Editorial","publication_year":2015,"publication_date":"2015-03-20","ids":{"openalex":"https://openalex.org/W2048982934","doi":"https://doi.org/10.1109/tr.2015.2408231","mag":"2048982934"},"language":"en","primary_location":{"id":"doi:10.1109/tr.2015.2408231","is_oa":true,"landing_page_url":"https://doi.org/10.1109/tr.2015.2408231","pdf_url":"https://ieeexplore.ieee.org/ielx7/24/7115294/07064808.pdf","source":{"id":"https://openalex.org/S87725633","display_name":"IEEE Transactions on Reliability","issn_l":"0018-9529","issn":["0018-9529","1558-1721"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Reliability","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://ieeexplore.ieee.org/ielx7/24/7115294/07064808.pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113985843","display_name":"Jeffrey Voas","orcid":null},"institutions":[{"id":"https://openalex.org/I967637","display_name":"Gannon University","ror":"https://ror.org/02y041669","country_code":"US","type":"education","lineage":["https://openalex.org/I967637"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Jeffrey Voas","raw_affiliation_strings":["Mechanical Engineering Department, Gannon University, Erie, Pennsylvania, USA","[Mechanical Engineering Department, Gannon University, Erie, Pennsylvania, USA]"],"affiliations":[{"raw_affiliation_string":"Mechanical Engineering Department, Gannon University, Erie, Pennsylvania, USA","institution_ids":["https://openalex.org/I967637"]},{"raw_affiliation_string":"[Mechanical Engineering Department, Gannon University, Erie, Pennsylvania, USA]","institution_ids":["https://openalex.org/I967637"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5113985843"],"corresponding_institution_ids":["https://openalex.org/I967637"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":true,"cited_by_count":0,"citation_normalized_percentile":{"value":0.08645951,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"64","issue":"2","first_page":"538","last_page":"538"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12423","display_name":"Software Reliability and Analysis Research","score":0.9781000018119812,"subfield":{"id":"https://openalex.org/subfields/1712","display_name":"Software"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12423","display_name":"Software Reliability and Analysis Research","score":0.9781000018119812,"subfield":{"id":"https://openalex.org/subfields/1712","display_name":"Software"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.6418403387069702},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.6181948781013489},{"id":"https://openalex.org/keywords/resilience","display_name":"Resilience (materials science)","score":0.5596033334732056},{"id":"https://openalex.org/keywords/software-quality","display_name":"Software quality","score":0.5324453115463257},{"id":"https://openalex.org/keywords/software-reliability-testing","display_name":"Software reliability testing","score":0.5291284322738647},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5147693157196045},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.48701125383377075},{"id":"https://openalex.org/keywords/software-engineering","display_name":"Software engineering","score":0.45109108090400696},{"id":"https://openalex.org/keywords/software-development","display_name":"Software development","score":0.3620455265045166},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2684635818004608},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.09224408864974976}],"concepts":[{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.6418403387069702},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6181948781013489},{"id":"https://openalex.org/C2779585090","wikidata":"https://www.wikidata.org/wiki/Q3457762","display_name":"Resilience (materials science)","level":2,"score":0.5596033334732056},{"id":"https://openalex.org/C117447612","wikidata":"https://www.wikidata.org/wiki/Q1412670","display_name":"Software quality","level":4,"score":0.5324453115463257},{"id":"https://openalex.org/C52928878","wikidata":"https://www.wikidata.org/wiki/Q7554226","display_name":"Software reliability testing","level":5,"score":0.5291284322738647},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5147693157196045},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.48701125383377075},{"id":"https://openalex.org/C115903868","wikidata":"https://www.wikidata.org/wiki/Q80993","display_name":"Software engineering","level":1,"score":0.45109108090400696},{"id":"https://openalex.org/C529173508","wikidata":"https://www.wikidata.org/wiki/Q638608","display_name":"Software development","level":3,"score":0.3620455265045166},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2684635818004608},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.09224408864974976},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tr.2015.2408231","is_oa":true,"landing_page_url":"https://doi.org/10.1109/tr.2015.2408231","pdf_url":"https://ieeexplore.ieee.org/ielx7/24/7115294/07064808.pdf","source":{"id":"https://openalex.org/S87725633","display_name":"IEEE Transactions on Reliability","issn_l":"0018-9529","issn":["0018-9529","1558-1721"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Reliability","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1109/tr.2015.2408231","is_oa":true,"landing_page_url":"https://doi.org/10.1109/tr.2015.2408231","pdf_url":"https://ieeexplore.ieee.org/ielx7/24/7115294/07064808.pdf","source":{"id":"https://openalex.org/S87725633","display_name":"IEEE Transactions on Reliability","issn_l":"0018-9529","issn":["0018-9529","1558-1721"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Reliability","raw_type":"journal-article"},"sustainable_development_goals":[{"score":0.4699999988079071,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2048982934.pdf","grobid_xml":"https://content.openalex.org/works/W2048982934.grobid-xml"},"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W1521772560","https://openalex.org/W4238386252","https://openalex.org/W4303457073","https://openalex.org/W4226182203","https://openalex.org/W234065253","https://openalex.org/W3185885951","https://openalex.org/W111546663","https://openalex.org/W1966392103","https://openalex.org/W2047750899","https://openalex.org/W3088925126"],"abstract_inverted_index":{"Reliability":[0],"engineering":[1,36],"have":[2,37],"been":[3],"longstanding,":[4],"well":[5,7],"understood,":[6],"defined,":[8],"and":[9,29,34,55,61,85],"practiced":[10],"by":[11],"a":[12],"small":[13],"community":[14],"when":[15],"one":[16],"looks":[17],"at":[18,82],"the":[19,26,41],"entirety":[20],"of":[21,32,72,77],"engineering.":[22],"Of":[23],"more":[24],"recent,":[25],"hardware,":[27],"component,":[28],"system":[30],"principles":[31],"reliability":[33,35,50],"gradually":[38],"moved":[39],"into":[40],"software":[42,47,49,52,56,75],"arena.":[43],"Today,":[44],"terms":[45],"like":[46],"reliability,":[48],"engineering,":[51],"fault":[53],"tolerance,":[54],"resilience":[57],"are":[58,66],"common":[59],"vernacular":[60],"main":[62],"stream.":[63],"And":[64],"we":[65],"now":[67],"able":[68],"to":[69],"achieve":[70],"levels":[71],"ultra-reliability":[73],"in":[74],"systems":[76],"uncompromising":[78],"criticality,":[79],"but":[80],"unfortunately":[81],"extreme":[83],"costs,":[84],"slowly.":[86]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}