{"id":"https://openalex.org/W4413349488","doi":"https://doi.org/10.1109/tim.2025.3597003","title":"Multi-Granularity Relation Enhancement Network for Tiny Defect Detection on Printed Circuit Board","display_name":"Multi-Granularity Relation Enhancement Network for Tiny Defect Detection on Printed Circuit Board","publication_year":2025,"publication_date":"2025-01-01","ids":{"openalex":"https://openalex.org/W4413349488","doi":"https://doi.org/10.1109/tim.2025.3597003"},"language":"en","primary_location":{"id":"doi:10.1109/tim.2025.3597003","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2025.3597003","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5044543764","display_name":"Feng Guo","orcid":"https://orcid.org/0009-0002-6095-5645"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Feng Guo","raw_affiliation_strings":["School of Computer Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China"],"affiliations":[{"raw_affiliation_string":"School of Computer Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019272801","display_name":"Zhongshu Chen","orcid":"https://orcid.org/0000-0002-4577-0952"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhongshu Chen","raw_affiliation_strings":["School of Mechanical and Electrical Engineering, University of Electronic Science and Technology of China, Chengdu, China"],"affiliations":[{"raw_affiliation_string":"School of Mechanical and Electrical Engineering, University of Electronic Science and Technology of China, Chengdu, China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100425556","display_name":"Biao Chen","orcid":"https://orcid.org/0000-0002-3794-4203"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Biao Chen","raw_affiliation_strings":["School of Information and Software Engineering, University of Electronic Science and Technology of China, Chengdu, China"],"affiliations":[{"raw_affiliation_string":"School of Information and Software Engineering, University of Electronic Science and Technology of China, Chengdu, China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071936558","display_name":"Mengmeng Jing","orcid":"https://orcid.org/0000-0002-0693-2197"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Mengmeng Jing","raw_affiliation_strings":["School of Information and Software Engineering, University of Electronic Science and Technology of China, Chengdu, China"],"affiliations":[{"raw_affiliation_string":"School of Information and Software Engineering, University of Electronic Science and Technology of China, Chengdu, China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5089989183","display_name":"Lin Zuo","orcid":"https://orcid.org/0000-0002-1598-1249"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Lin Zuo","raw_affiliation_strings":["School of Information and Software Engineering, University of Electronic Science and Technology of China, Chengdu, China"],"affiliations":[{"raw_affiliation_string":"School of Information and Software Engineering, University of Electronic Science and Technology of China, Chengdu, China","institution_ids":["https://openalex.org/I150229711"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5044543764"],"corresponding_institution_ids":["https://openalex.org/I150229711"],"apc_list":null,"apc_paid":null,"fwci":1.3271,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.85237646,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":97,"max":99},"biblio":{"volume":"74","issue":null,"first_page":"1","last_page":"11"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13049","display_name":"Surface Roughness and Optical Measurements","score":0.9200999736785889,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.8771966695785522},{"id":"https://openalex.org/keywords/relation","display_name":"Relation (database)","score":0.7086951732635498},{"id":"https://openalex.org/keywords/granularity","display_name":"Granularity","score":0.5958014726638794},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.49726346135139465},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4342752695083618},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.4113002121448517},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3933674991130829},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.32097840309143066},{"id":"https://openalex.org/keywords/data-mining","display_name":"Data mining","score":0.10120406746864319}],"concepts":[{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.8771966695785522},{"id":"https://openalex.org/C25343380","wikidata":"https://www.wikidata.org/wiki/Q277521","display_name":"Relation (database)","level":2,"score":0.7086951732635498},{"id":"https://openalex.org/C177774035","wikidata":"https://www.wikidata.org/wiki/Q1246948","display_name":"Granularity","level":2,"score":0.5958014726638794},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.49726346135139465},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4342752695083618},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4113002121448517},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3933674991130829},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.32097840309143066},{"id":"https://openalex.org/C124101348","wikidata":"https://www.wikidata.org/wiki/Q172491","display_name":"Data mining","level":1,"score":0.10120406746864319},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tim.2025.3597003","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2025.3597003","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G2885150354","display_name":null,"funder_award_id":"62276054","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":47,"referenced_works":["https://openalex.org/W639708223","https://openalex.org/W2897772777","https://openalex.org/W2941001797","https://openalex.org/W2948519073","https://openalex.org/W2962858109","https://openalex.org/W2963037989","https://openalex.org/W2997316506","https://openalex.org/W3034669389","https://openalex.org/W3046756309","https://openalex.org/W3163617518","https://openalex.org/W3172752666","https://openalex.org/W3174137462","https://openalex.org/W3215142653","https://openalex.org/W4206290629","https://openalex.org/W4214507171","https://openalex.org/W4229453634","https://openalex.org/W4294643328","https://openalex.org/W4312231279","https://openalex.org/W4312823573","https://openalex.org/W4313009154","https://openalex.org/W4313172897","https://openalex.org/W4319999503","https://openalex.org/W4361801149","https://openalex.org/W4363647489","https://openalex.org/W4382568144","https://openalex.org/W4385453033","https://openalex.org/W4385832222","https://openalex.org/W4386071535","https://openalex.org/W4386076325","https://openalex.org/W4387125416","https://openalex.org/W4387717659","https://openalex.org/W4388692279","https://openalex.org/W4390659789","https://openalex.org/W4390843766","https://openalex.org/W4391430296","https://openalex.org/W4392251676","https://openalex.org/W4392466036","https://openalex.org/W4392637490","https://openalex.org/W4394585994","https://openalex.org/W4394811179","https://openalex.org/W4401692510","https://openalex.org/W4402716047","https://openalex.org/W4402754006","https://openalex.org/W4403209846","https://openalex.org/W4403770406","https://openalex.org/W4403919744","https://openalex.org/W4404132945"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2931688134","https://openalex.org/W2377919138","https://openalex.org/W2378857091","https://openalex.org/W103652678","https://openalex.org/W4226090359","https://openalex.org/W2059697060","https://openalex.org/W936373746","https://openalex.org/W2975817033","https://openalex.org/W4256502920"],"abstract_inverted_index":{"Tiny":[0],"defect":[1,33,136],"detection":[2],"on":[3,61,113,142,160],"printed":[4],"circuit":[5],"boards":[6],"(PCBs)":[7],"is":[8,88,118],"a":[9,48,124],"crucial":[10],"task":[11],"to":[12,54,90,106,121],"ensure":[13],"the":[14,17,28,38,56,76,81,86,92,116,147],"quality":[15],"of":[16,31,58,72,94,128],"downstream":[18],"electronic":[19],"products.":[20],"Despite":[21],"promising":[22],"results,":[23],"prior":[24],"works":[25],"often":[26],"overlook":[27],"contextual":[29,78,101],"surroundings":[30],"candidate":[32],"proposals":[34,104,134],"and":[35,66,80,146],"relations":[36,132],"among":[37,133],"proposals,":[39,115],"hindering":[40],"their":[41],"performance.":[42],"To":[43],"this":[44],"end,":[45],"we":[46],"propose":[47],"Multi-Granularity":[49],"Relation":[50],"Enhancement":[51],"Network":[52],"(MGRE-Net)":[53],"enhance":[55],"representation":[57,127],"tiny":[59,158],"defects":[60,107,159],"PCBs":[62],"by":[63,98],"fusing":[64],"image-":[65],"instance-level":[67,96],"cross-domain":[68],"information,":[69],"which":[70],"consists":[71],"two":[73],"pivotal":[74],"mechanisms:":[75],"image-to-instance":[77],"enhancement":[79],"instance-to-instance":[82],"visual":[83],"reasoning.":[84,137],"Specifically,":[85],"former":[87],"proposed":[89],"reweigh":[91],"bias":[93],"each":[95],"proposal":[97],"aggregating":[99],"image-level":[100],"features,":[102],"whereby":[103],"related":[105],"are":[108,140],"assigned":[109],"higher":[110],"biases.":[111],"Based":[112],"reweighed":[114],"latter":[117],"further":[119],"designed":[120],"adaptively":[122],"encode":[123],"sparse":[125],"graphical":[126],"key":[129],"high-level":[130],"semantic":[131],"for":[135,156],"Extensive":[138],"experiments":[139],"conducted":[141],"four":[143],"industrial":[144],"datasets,":[145],"results":[148],"clearly":[149],"illustrate":[150],"that":[151],"MGRE-Net":[152],"surpasses":[153],"previous":[154],"baselines":[155],"detecting":[157],"PCBs.":[161]},"counts_by_year":[{"year":2026,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}