{"id":"https://openalex.org/W4411203568","doi":"https://doi.org/10.1109/tim.2025.3578714","title":"A New Methodology for Calculating the Statistical Distribution of Power Supply Noise in Chip-Package-PCB Co-Design","display_name":"A New Methodology for Calculating the Statistical Distribution of Power Supply Noise in Chip-Package-PCB Co-Design","publication_year":2025,"publication_date":"2025-01-01","ids":{"openalex":"https://openalex.org/W4411203568","doi":"https://doi.org/10.1109/tim.2025.3578714"},"language":"en","primary_location":{"id":"doi:10.1109/tim.2025.3578714","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2025.3578714","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5025066189","display_name":"Yuhuan Luo","orcid":"https://orcid.org/0000-0002-1934-6453"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuhuan Luo","raw_affiliation_strings":["Key Laboratory of High-Speed Circuit Design and EMC Ministry of Education, Xidian University, Xi’an, China"],"raw_orcid":"https://orcid.org/0000-0002-1934-6453","affiliations":[{"raw_affiliation_string":"Key Laboratory of High-Speed Circuit Design and EMC Ministry of Education, Xidian University, Xi’an, China","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012198483","display_name":"Xiuqin Chu","orcid":"https://orcid.org/0000-0001-5860-2002"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiuqin Chu","raw_affiliation_strings":["Key Laboratory of High-Speed Circuit Design and EMC Ministry of Education, Xidian University, Xi’an, China"],"raw_orcid":"https://orcid.org/0000-0001-5860-2002","affiliations":[{"raw_affiliation_string":"Key Laboratory of High-Speed Circuit Design and EMC Ministry of Education, Xidian University, Xi’an, China","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102080531","display_name":"Haobo Yuan","orcid":"https://orcid.org/0009-0002-8897-256X"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Haiyue Yuan","raw_affiliation_strings":["Key Laboratory of High-Speed Circuit Design and EMC Ministry of Education, Xidian University, Xi’an, China"],"raw_orcid":"https://orcid.org/0009-0002-8897-256X","affiliations":[{"raw_affiliation_string":"Key Laboratory of High-Speed Circuit Design and EMC Ministry of Education, Xidian University, Xi’an, China","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5076012197","display_name":"Tao Wei","orcid":"https://orcid.org/0009-0006-1834-6239"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Tao Wei","raw_affiliation_strings":["Key Laboratory of High-Speed Circuit Design and EMC Ministry of Education, Xidian University, Xi’an, China"],"raw_orcid":"https://orcid.org/0009-0006-1834-6239","affiliations":[{"raw_affiliation_string":"Key Laboratory of High-Speed Circuit Design and EMC Ministry of Education, Xidian University, Xi’an, China","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Yuhao Huang","orcid":"https://orcid.org/0009-0007-5721-4092"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuhao Huang","raw_affiliation_strings":["Key Laboratory of High-Speed Circuit Design and EMC Ministry of Education, Xidian University, Xi’an, China"],"raw_orcid":"https://orcid.org/0009-0007-5721-4092","affiliations":[{"raw_affiliation_string":"Key Laboratory of High-Speed Circuit Design and EMC Ministry of Education, Xidian University, Xi’an, China","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100625139","display_name":"Jun Wang","orcid":"https://orcid.org/0000-0002-3910-438X"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jun Wang","raw_affiliation_strings":["Key Laboratory of High-Speed Circuit Design and EMC Ministry of Education, Xidian University, Xi’an, China"],"raw_orcid":"https://orcid.org/0000-0002-3910-438X","affiliations":[{"raw_affiliation_string":"Key Laboratory of High-Speed Circuit Design and EMC Ministry of Education, Xidian University, Xi’an, China","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Feng Wu","orcid":"https://orcid.org/0009-0004-2317-4123"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Feng Wu","raw_affiliation_strings":["Key Laboratory of High-Speed Circuit Design and EMC Ministry of Education, Xidian University, Xi’an, China"],"raw_orcid":"https://orcid.org/0009-0004-2317-4123","affiliations":[{"raw_affiliation_string":"Key Laboratory of High-Speed Circuit Design and EMC Ministry of Education, Xidian University, Xi’an, China","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100710087","display_name":"Yushan Li","orcid":"https://orcid.org/0000-0002-9785-4752"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yushan Li","raw_affiliation_strings":["Key Laboratory of High-Speed Circuit Design and EMC Ministry of Education, Xidian University, Xi’an, China"],"raw_orcid":"https://orcid.org/0000-0002-9785-4752","affiliations":[{"raw_affiliation_string":"Key Laboratory of High-Speed Circuit Design and EMC Ministry of Education, Xidian University, Xi’an, China","institution_ids":["https://openalex.org/I149594827"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":8,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.09833939,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"74","issue":null,"first_page":"1","last_page":"13"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9975000023841858,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9975000023841858,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9896000027656555,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12971","display_name":"Material Properties and Processing","score":0.9776999950408936,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5930905938148499},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5723152160644531},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.5711944103240967},{"id":"https://openalex.org/keywords/noise","display_name":"Noise (video)","score":0.5543901324272156},{"id":"https://openalex.org/keywords/power-integrity","display_name":"Power integrity","score":0.4648745357990265},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.46364015340805054},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4523988962173462},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.45084643363952637},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.39102277159690857},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.33676356077194214},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.3234713077545166},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.2392377257347107},{"id":"https://openalex.org/keywords/signal-integrity","display_name":"Signal integrity","score":0.18995627760887146},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.17757970094680786},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.10628432035446167}],"concepts":[{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5930905938148499},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5723152160644531},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.5711944103240967},{"id":"https://openalex.org/C99498987","wikidata":"https://www.wikidata.org/wiki/Q2210247","display_name":"Noise (video)","level":3,"score":0.5543901324272156},{"id":"https://openalex.org/C2777561913","wikidata":"https://www.wikidata.org/wiki/Q19599527","display_name":"Power integrity","level":4,"score":0.4648745357990265},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.46364015340805054},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4523988962173462},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.45084643363952637},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.39102277159690857},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.33676356077194214},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3234713077545166},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.2392377257347107},{"id":"https://openalex.org/C44938667","wikidata":"https://www.wikidata.org/wiki/Q4503810","display_name":"Signal integrity","level":3,"score":0.18995627760887146},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.17757970094680786},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.10628432035446167},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tim.2025.3578714","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2025.3578714","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8600000143051147,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[{"id":"https://openalex.org/G1106345602","display_name":null,"funder_award_id":"XJS210203","funder_id":"https://openalex.org/F4320335787","funder_display_name":"Fundamental Research Funds for the Central Universities"},{"id":"https://openalex.org/G1661710729","display_name":null,"funder_award_id":"62471353","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G2332027","display_name":null,"funder_award_id":"62171338","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G4614593100","display_name":null,"funder_award_id":"2024GX-ZDCYL-05-02","funder_id":"https://openalex.org/F4320334010","funder_display_name":"Key Research and Development Program of Ningxia"},{"id":"https://openalex.org/G8625167228","display_name":null,"funder_award_id":"2024GXZDCYL-05-02","funder_id":"https://openalex.org/F4320336350","funder_display_name":"Key Research and Development Projects of Shaanxi Province"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320334010","display_name":"Key Research and Development Program of Ningxia","ror":null},{"id":"https://openalex.org/F4320335787","display_name":"Fundamental Research Funds for the Central Universities","ror":null},{"id":"https://openalex.org/F4320336350","display_name":"Key Research and Development Projects of Shaanxi Province","ror":null}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":27,"referenced_works":["https://openalex.org/W1967193715","https://openalex.org/W1967779689","https://openalex.org/W1974553939","https://openalex.org/W2014223528","https://openalex.org/W2052709557","https://openalex.org/W2090033514","https://openalex.org/W2096929444","https://openalex.org/W2101100398","https://openalex.org/W2130187293","https://openalex.org/W2133179629","https://openalex.org/W2517168959","https://openalex.org/W2599001773","https://openalex.org/W2942102836","https://openalex.org/W2971531823","https://openalex.org/W3013870600","https://openalex.org/W3014520412","https://openalex.org/W3024465369","https://openalex.org/W3034383991","https://openalex.org/W3043301001","https://openalex.org/W3150211325","https://openalex.org/W3200419572","https://openalex.org/W4240408910","https://openalex.org/W4315783291","https://openalex.org/W4317794295","https://openalex.org/W4391853731","https://openalex.org/W4392007377","https://openalex.org/W4392746425"],"related_works":["https://openalex.org/W4407575164","https://openalex.org/W2043558408","https://openalex.org/W2065289416","https://openalex.org/W2246813539","https://openalex.org/W2250058922","https://openalex.org/W2017236304","https://openalex.org/W2533759086","https://openalex.org/W2115579119","https://openalex.org/W2014223528","https://openalex.org/W2008603666"],"abstract_inverted_index":{"The":[0,23,157],"consumption":[1],"current":[2,92,110],"of":[3,80,99,117,122,131,151,170],"the":[4,8,27,39,43,56,77,89,115,119,129,137,147,152],"chip":[5,44,81],"flowing":[6],"through":[7],"power":[9,15,34,82,123,171],"distribution":[10,79,121],"network":[11],"(PDN)":[12],"will":[13,49],"generate":[14],"supply":[16,35,124,172],"noise,":[17,36,83],"leading":[18],"to":[19,30,41,74,164],"potential":[20],"system":[21],"failures.":[22],"industry":[24],"commonly":[25],"reduces":[26],"chip\u2019s":[28,90],"performance":[29],"cope":[31],"with":[32,140],"worst-case":[33],"or":[37],"modifies":[38],"PDN":[40],"ensure":[42],"operates":[45],"normally.":[46],"These":[47],"measures":[48],"have":[50],"a":[51,72,97,104],"significant":[52],"negative":[53],"impact":[54],"on":[55],"system\u2019s":[57],"performance,":[58],"power,":[59],"area,":[60],"and":[61,108,144,149],"cost":[62],"(PPAC).":[63],"To":[64],"address":[65],"this":[66,68],"challenge,":[67],"paper":[69],"innovatively":[70],"proposes":[71],"method":[73,154,158],"accurately":[75],"calculate":[76],"statistical":[78,120],"thereby":[84],"maximize":[85],"PPAC":[86],"improvement.":[87],"First,":[88],"load":[91],"excitation":[93],"is":[94,111,126],"decomposed":[95],"into":[96,162],"combination":[98],"multiple":[100,132],"pulse":[101,133],"currents":[102],"using":[103],"piecewise":[105],"linear":[106],"method,":[107],"each":[109],"encoded":[112],"accordingly.":[113],"Then,":[114],"process":[116],"calculating":[118],"noise":[125,173],"derived":[127],"from":[128],"response":[130],"currents.":[134],"By":[135],"comparing":[136],"computational":[138],"results":[139,143],"transient":[141],"simulation":[142],"measurement":[145],"data,":[146],"effectiveness":[148],"robustness":[150],"proposed":[153],"are":[155],"verified.":[156],"can":[159],"be":[160],"integrated":[161],"oscilloscopes":[163],"measure":[165],"probability":[166],"density":[167],"function":[168],"(PDF)":[169],"directly.":[174]},"counts_by_year":[],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}