{"id":"https://openalex.org/W4410950047","doi":"https://doi.org/10.1109/tim.2025.3575992","title":"Print Quality Assessment of Additively Manufactured Resonant Structures","display_name":"Print Quality Assessment of Additively Manufactured Resonant Structures","publication_year":2025,"publication_date":"2025-01-01","ids":{"openalex":"https://openalex.org/W4410950047","doi":"https://doi.org/10.1109/tim.2025.3575992"},"language":"en","primary_location":{"id":"doi:10.1109/tim.2025.3575992","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2025.3575992","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5073967677","display_name":"Logan M. Wilcox","orcid":"https://orcid.org/0009-0009-6385-0428"},"institutions":[{"id":"https://openalex.org/I20382870","display_name":"Missouri University of Science and Technology","ror":"https://ror.org/00scwqd12","country_code":"US","type":"education","lineage":["https://openalex.org/I20382870"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Logan M. Wilcox","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Microwave Sensing (μSense) Laboratory, Missouri University of Science and Technology, Rolla, MO, USA"],"raw_orcid":"https://orcid.org/0009-0009-6385-0428","affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Microwave Sensing (μSense) Laboratory, Missouri University of Science and Technology, Rolla, MO, USA","institution_ids":["https://openalex.org/I20382870"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067808479","display_name":"Alexander Hook","orcid":null},"institutions":[{"id":"https://openalex.org/I20382870","display_name":"Missouri University of Science and Technology","ror":"https://ror.org/00scwqd12","country_code":"US","type":"education","lineage":["https://openalex.org/I20382870"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Alexander Hook","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Microwave Sensing (μSense) Laboratory, Missouri University of Science and Technology, Rolla, MO, USA"],"raw_orcid":"https://orcid.org/0009-0005-3479-953X","affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Microwave Sensing (μSense) Laboratory, Missouri University of Science and Technology, Rolla, MO, USA","institution_ids":["https://openalex.org/I20382870"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5114553739","display_name":"Emma T. Bohannon","orcid":null},"institutions":[{"id":"https://openalex.org/I20382870","display_name":"Missouri University of Science and Technology","ror":"https://ror.org/00scwqd12","country_code":"US","type":"education","lineage":["https://openalex.org/I20382870"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Emma T. Bohannon","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Microwave Sensing (μSense) Laboratory, Missouri University of Science and Technology, Rolla, MO, USA"],"raw_orcid":"https://orcid.org/0009-0007-6568-0034","affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Microwave Sensing (μSense) Laboratory, Missouri University of Science and Technology, Rolla, MO, USA","institution_ids":["https://openalex.org/I20382870"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5099659212","display_name":"Cody Morrow","orcid":null},"institutions":[{"id":"https://openalex.org/I4210149909","display_name":"Texas Research Institute","ror":"https://ror.org/03r5ah485","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I4210149909"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Cody Morrow","raw_affiliation_strings":["Nondestructive Evaluation Division, Texas Research Institute (TRI), Austin, TX, USA"],"raw_orcid":"https://orcid.org/0009-0000-0960-3949","affiliations":[{"raw_affiliation_string":"Nondestructive Evaluation Division, Texas Research Institute (TRI), Austin, TX, USA","institution_ids":["https://openalex.org/I4210149909"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087415568","display_name":"Doyle T. Motes","orcid":"https://orcid.org/0009-0009-3483-4488"},"institutions":[{"id":"https://openalex.org/I4210149909","display_name":"Texas Research Institute","ror":"https://ror.org/03r5ah485","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I4210149909"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Doyle T. Motes","raw_affiliation_strings":["Nondestructive Evaluation Division, Texas Research Institute (TRI), Austin, TX, USA"],"raw_orcid":"https://orcid.org/0009-0009-3483-4488","affiliations":[{"raw_affiliation_string":"Nondestructive Evaluation Division, Texas Research Institute (TRI), Austin, TX, USA","institution_ids":["https://openalex.org/I4210149909"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5066941650","display_name":"Kristen M. Donnell","orcid":"https://orcid.org/0000-0001-8725-5484"},"institutions":[{"id":"https://openalex.org/I20382870","display_name":"Missouri University of Science and Technology","ror":"https://ror.org/00scwqd12","country_code":"US","type":"education","lineage":["https://openalex.org/I20382870"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kristen M. Donnell","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Microwave Sensing (μSense) Laboratory, Missouri University of Science and Technology, Rolla, MO, USA"],"raw_orcid":"https://orcid.org/0000-0001-8725-5484","affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Microwave Sensing (μSense) Laboratory, Missouri University of Science and Technology, Rolla, MO, USA","institution_ids":["https://openalex.org/I20382870"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.10281594,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"74","issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","score":0.9699000120162964,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12938","display_name":"Material Selection and Properties","score":0.9465000033378601,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/quality","display_name":"Quality (philosophy)","score":0.6162779331207275},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5419095754623413},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4117734432220459},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3829830288887024},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.35660749673843384},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.33535638451576233},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3335520029067993},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.3266279101371765},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.24209064245224}],"concepts":[{"id":"https://openalex.org/C2779530757","wikidata":"https://www.wikidata.org/wiki/Q1207505","display_name":"Quality (philosophy)","level":2,"score":0.6162779331207275},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5419095754623413},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4117734432220459},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3829830288887024},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.35660749673843384},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.33535638451576233},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3335520029067993},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3266279101371765},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.24209064245224},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tim.2025.3575992","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2025.3575992","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W2025138352","https://openalex.org/W2329312586","https://openalex.org/W2612266666","https://openalex.org/W2884190060","https://openalex.org/W3015650228","https://openalex.org/W4214749394","https://openalex.org/W4386494781","https://openalex.org/W4390604071","https://openalex.org/W4400114349","https://openalex.org/W4404132189","https://openalex.org/W4406322406"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2384667405","https://openalex.org/W2373216116","https://openalex.org/W2362665430","https://openalex.org/W2058040533","https://openalex.org/W3123396266","https://openalex.org/W4323667137","https://openalex.org/W2352466142","https://openalex.org/W2375981319","https://openalex.org/W2562923059"],"abstract_inverted_index":{"Due":[0],"to":[1,20,36,63,78,128],"the":[2,15,38,57,98,124,130],"increased":[3],"popularity":[4],"of":[5,11,56,116,123],"additive":[6],"manufacturing":[7],"(AM)":[8],"and":[9,80,97,100],"availability":[10],"electrically":[12],"conductive":[13],"filaments,":[14],"potential":[16,111],"for":[17,112],"using":[18,92],"AM":[19,83,87,117],"fabricate":[21],"high":[22],"frequency":[23],"resonant":[24,40,58,84,88,99,118,132],"structures":[25,31,89,119],"has":[26,109],"been":[27],"realized.":[28],"As":[29],"these":[30],"require":[32],"specific":[33],"operating":[34,46,125],"conditions":[35,126],"provide":[37],"desired":[39],"response":[41,59],"(such":[42],"as":[43,74],"substrate/superstrate":[44],"material,":[45],"frequency,":[47],"polarization,":[48],"etc.),":[49],"print":[50,113],"quality":[51,114],"validation":[52,115],"through":[53],"an":[54,75,82],"assessment":[55],"can":[60],"be":[61],"difficult":[62],"accomplish.":[64],"To":[65],"this":[66],"end,":[67],"active":[68],"microwave":[69],"thermography":[70],"(AMT)":[71],"is":[72],"proposed":[73],"alternative":[76],"technique":[77],"assess":[79],"validate":[81],"structure.":[85],"Two":[86],"were":[90],"manufactured":[91],"fused":[93],"deposition":[94],"modeling":[95],"(FDM)":[96],"AMT":[101,108],"responses":[102],"measured.":[103],"The":[104],"results":[105],"indicate":[106],"that":[107],"strong":[110],"without":[120],"complicated":[121],"reproduction":[122],"required":[127],"achieve":[129],"designed-for":[131],"response.":[133]},"counts_by_year":[],"updated_date":"2026-03-27T05:58:40.876381","created_date":"2025-10-10T00:00:00"}