{"id":"https://openalex.org/W4410394290","doi":"https://doi.org/10.1109/tim.2025.3570366","title":"A Lightweight Dual-Stream Enhanced Network With Multilevel Feature Guidance and Hybrid Knowledge Distillation for Steel Surface Defect Detection","display_name":"A Lightweight Dual-Stream Enhanced Network With Multilevel Feature Guidance and Hybrid Knowledge Distillation for Steel Surface Defect Detection","publication_year":2025,"publication_date":"2025-01-01","ids":{"openalex":"https://openalex.org/W4410394290","doi":"https://doi.org/10.1109/tim.2025.3570366"},"language":"en","primary_location":{"id":"doi:10.1109/tim.2025.3570366","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2025.3570366","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100326608","display_name":"Chuang Liu","orcid":"https://orcid.org/0000-0002-0920-745X"},"institutions":[{"id":"https://openalex.org/I90090648","display_name":"Shijiazhuang Tiedao University","ror":"https://ror.org/022e9e065","country_code":"CN","type":"education","lineage":["https://openalex.org/I90090648"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chuang Liu","raw_affiliation_strings":["School of Mechanical Engineering, Shijiazhuang Tiedao University, Shijiazhuang, China"],"raw_orcid":"https://orcid.org/0000-0002-0920-745X","affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Shijiazhuang Tiedao University, Shijiazhuang, China","institution_ids":["https://openalex.org/I90090648"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Quanchao Yang","orcid":"https://orcid.org/0009-0002-4970-9064"},"institutions":[{"id":"https://openalex.org/I90090648","display_name":"Shijiazhuang Tiedao University","ror":"https://ror.org/022e9e065","country_code":"CN","type":"education","lineage":["https://openalex.org/I90090648"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Quanchao Yang","raw_affiliation_strings":["School of Mechanical Engineering, Shijiazhuang Tiedao University, Shijiazhuang, China"],"raw_orcid":"https://orcid.org/0009-0002-4970-9064","affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Shijiazhuang Tiedao University, Shijiazhuang, China","institution_ids":["https://openalex.org/I90090648"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022564470","display_name":"Shuai Ma","orcid":"https://orcid.org/0000-0002-0325-9347"},"institutions":[{"id":"https://openalex.org/I90090648","display_name":"Shijiazhuang Tiedao University","ror":"https://ror.org/022e9e065","country_code":"CN","type":"education","lineage":["https://openalex.org/I90090648"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Shuai Ma","raw_affiliation_strings":["School of Mechanical Engineering, Shijiazhuang Tiedao University, Shijiazhuang, China"],"raw_orcid":"https://orcid.org/0000-0002-0325-9347","affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Shijiazhuang Tiedao University, Shijiazhuang, China","institution_ids":["https://openalex.org/I90090648"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Qiang Guo","orcid":"https://orcid.org/0009-0009-0308-9024"},"institutions":[{"id":"https://openalex.org/I90090648","display_name":"Shijiazhuang Tiedao University","ror":"https://ror.org/022e9e065","country_code":"CN","type":"education","lineage":["https://openalex.org/I90090648"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qiang Guo","raw_affiliation_strings":["School of Mechanical Engineering, Shijiazhuang Tiedao University, Shijiazhuang, China"],"raw_orcid":"https://orcid.org/0009-0009-0308-9024","affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Shijiazhuang Tiedao University, Shijiazhuang, China","institution_ids":["https://openalex.org/I90090648"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Pengchao Gao","orcid":"https://orcid.org/0009-0001-6449-6493"},"institutions":[{"id":"https://openalex.org/I90090648","display_name":"Shijiazhuang Tiedao University","ror":"https://ror.org/022e9e065","country_code":"CN","type":"education","lineage":["https://openalex.org/I90090648"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Pengchao Gao","raw_affiliation_strings":["School of Mechanical Engineering, Shijiazhuang Tiedao University, Shijiazhuang, China"],"raw_orcid":"https://orcid.org/0009-0001-6449-6493","affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Shijiazhuang Tiedao University, Shijiazhuang, China","institution_ids":["https://openalex.org/I90090648"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101548823","display_name":"Ruichen Wang","orcid":"https://orcid.org/0000-0003-0128-6402"},"institutions":[{"id":"https://openalex.org/I90090648","display_name":"Shijiazhuang Tiedao University","ror":"https://ror.org/022e9e065","country_code":"CN","type":"education","lineage":["https://openalex.org/I90090648"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ruichen Wang","raw_affiliation_strings":["School of Mechanical Engineering, Shijiazhuang Tiedao University, Shijiazhuang, China"],"raw_orcid":"https://orcid.org/0000-0003-0128-6402","affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Shijiazhuang Tiedao University, Shijiazhuang, China","institution_ids":["https://openalex.org/I90090648"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I90090648"],"apc_list":null,"apc_paid":null,"fwci":0.5997,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.67578236,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":97},"biblio":{"volume":"74","issue":null,"first_page":"1","last_page":"13"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13049","display_name":"Surface Roughness and Optical Measurements","score":0.9789000153541565,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.97079998254776,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/dual","display_name":"Dual (grammatical number)","score":0.6678992509841919},{"id":"https://openalex.org/keywords/distillation","display_name":"Distillation","score":0.6086940169334412},{"id":"https://openalex.org/keywords/feature","display_name":"Feature (linguistics)","score":0.5512991547584534},{"id":"https://openalex.org/keywords/feature-extraction","display_name":"Feature extraction","score":0.5153117179870605},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4568234086036682},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.44403570890426636},{"id":"https://openalex.org/keywords/surface","display_name":"Surface (topology)","score":0.4126681685447693},{"id":"https://openalex.org/keywords/pattern-recognition","display_name":"Pattern recognition (psychology)","score":0.3545567989349365},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.34422942996025085}],"concepts":[{"id":"https://openalex.org/C2780980858","wikidata":"https://www.wikidata.org/wiki/Q110022","display_name":"Dual (grammatical number)","level":2,"score":0.6678992509841919},{"id":"https://openalex.org/C204030448","wikidata":"https://www.wikidata.org/wiki/Q101017","display_name":"Distillation","level":2,"score":0.6086940169334412},{"id":"https://openalex.org/C2776401178","wikidata":"https://www.wikidata.org/wiki/Q12050496","display_name":"Feature (linguistics)","level":2,"score":0.5512991547584534},{"id":"https://openalex.org/C52622490","wikidata":"https://www.wikidata.org/wiki/Q1026626","display_name":"Feature extraction","level":2,"score":0.5153117179870605},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4568234086036682},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.44403570890426636},{"id":"https://openalex.org/C2776799497","wikidata":"https://www.wikidata.org/wiki/Q484298","display_name":"Surface (topology)","level":2,"score":0.4126681685447693},{"id":"https://openalex.org/C153180895","wikidata":"https://www.wikidata.org/wiki/Q7148389","display_name":"Pattern recognition (psychology)","level":2,"score":0.3545567989349365},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.34422942996025085},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C142362112","wikidata":"https://www.wikidata.org/wiki/Q735","display_name":"Art","level":0,"score":0.0},{"id":"https://openalex.org/C124952713","wikidata":"https://www.wikidata.org/wiki/Q8242","display_name":"Literature","level":1,"score":0.0},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tim.2025.3570366","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2025.3570366","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":53,"referenced_works":["https://openalex.org/W639708223","https://openalex.org/W2194775991","https://openalex.org/W2531409750","https://openalex.org/W2565639579","https://openalex.org/W2750432752","https://openalex.org/W2883780447","https://openalex.org/W2887783173","https://openalex.org/W2913074553","https://openalex.org/W2936864631","https://openalex.org/W2944303778","https://openalex.org/W2963140444","https://openalex.org/W2963163009","https://openalex.org/W2963351448","https://openalex.org/W2963857746","https://openalex.org/W2982083293","https://openalex.org/W2990763144","https://openalex.org/W3009013436","https://openalex.org/W3034971973","https://openalex.org/W3096609285","https://openalex.org/W3122173535","https://openalex.org/W3138516171","https://openalex.org/W4214524539","https://openalex.org/W4297902913","https://openalex.org/W4310076268","https://openalex.org/W4311054129","https://openalex.org/W4312980183","https://openalex.org/W4313141028","https://openalex.org/W4313413180","https://openalex.org/W4380358040","https://openalex.org/W4385245566","https://openalex.org/W4385453033","https://openalex.org/W4385482509","https://openalex.org/W4386047745","https://openalex.org/W4386076325","https://openalex.org/W4386108434","https://openalex.org/W4388954891","https://openalex.org/W4390873226","https://openalex.org/W4394670654","https://openalex.org/W4395063238","https://openalex.org/W4399205742","https://openalex.org/W4399871128","https://openalex.org/W4402519455","https://openalex.org/W4403770406","https://openalex.org/W4404199198","https://openalex.org/W6637373629","https://openalex.org/W6684191040","https://openalex.org/W6762718338","https://openalex.org/W6771062828","https://openalex.org/W6798838024","https://openalex.org/W6803118227","https://openalex.org/W6846863797","https://openalex.org/W6853168692","https://openalex.org/W6868582632"],"related_works":["https://openalex.org/W3026162553","https://openalex.org/W2317351040","https://openalex.org/W2344382886","https://openalex.org/W19111321","https://openalex.org/W2412887479","https://openalex.org/W32245304","https://openalex.org/W2953684491","https://openalex.org/W4285338581","https://openalex.org/W2768175398","https://openalex.org/W2015158429"],"abstract_inverted_index":{"The":[0,84],"advancement":[1],"of":[2,11],"deep":[3],"neural":[4],"networks":[5],"has":[6],"significantly":[7],"improved":[8],"the":[9,111,125],"precision":[10],"strip":[12],"surface":[13],"defect":[14],"detection":[15,62],"(SDD).":[16],"However,":[17],"current":[18],"methods":[19],"typically":[20],"face":[21],"difficulties":[22],"in":[23,32,52],"meeting":[24],"real-time":[25],"performance":[26],"and":[27,65,80,132],"computational":[28,39],"efficiency":[29],"requirements,":[30],"particularly":[31],"high-speed":[33],"industrial":[34,145],"manufacturing":[35],"environments":[36],"with":[37,135],"limited":[38],"resources.":[40],"To":[41],"address":[42],"these":[43],"challenges,":[44],"a":[45,53,69,104,120],"dual-stream":[46,55],"enhancement":[47],"strategy":[48],"is":[49,74],"proposed,":[50],"resulting":[51],"lightweight":[54,70,112],"enhanced":[56],"network":[57,73],"(LDENet)":[58],"that":[59],"effectively":[60],"balances":[61],"accuracy,":[63],"speed,":[64],"resource":[66],"efficiency.":[67],"Specifically,":[68],"PConv-stacked":[71],"backbone":[72],"introduced":[75],"to":[76],"minimize":[77],"model":[78],"complexity":[79],"improve":[81],"inference":[82],"speed.":[83],"Multi-layer":[85],"Coordinated":[86],"Adaptive":[87],"Feature":[88],"Fusion":[89],"(MCAF)":[90],"module":[91],"reduces":[92],"feature":[93],"redundancy":[94],"by":[95,115],"adaptively":[96],"integrating":[97],"important":[98],"information":[99,118],"across":[100],"multiple":[101],"layers.":[102],"Moreover,":[103],"hybrid":[105],"knowledge":[106],"distillation":[107],"(HKD)":[108],"method":[109],"improves":[110],"model's":[113],"capability":[114],"transferring":[116],"detailed":[117],"from":[119],"pre-trained":[121],"teacher":[122],"model.":[123],"On":[124],"NEU-DET":[126],"dataset,":[127],"LDENet":[128],"achieves":[129],"81.1":[130],"mAP":[131],"181":[133],"fps":[134],"only":[136],"1.41M":[137],"parameters,":[138],"demonstrating":[139],"its":[140],"suitability":[141],"for":[142],"real-time,":[143],"resource-constrained":[144],"applications.":[146]},"counts_by_year":[{"year":2026,"cited_by_count":1}],"updated_date":"2026-07-23T08:03:31.855105","created_date":"2025-10-10T00:00:00"}