{"id":"https://openalex.org/W4407937872","doi":"https://doi.org/10.1109/tim.2025.3545524","title":"A Dynamic Temperature Compensation Method for Piezoresistive Pressure Sensors Using Heat Transfer Analysis","display_name":"A Dynamic Temperature Compensation Method for Piezoresistive Pressure Sensors Using Heat Transfer Analysis","publication_year":2025,"publication_date":"2025-01-01","ids":{"openalex":"https://openalex.org/W4407937872","doi":"https://doi.org/10.1109/tim.2025.3545524"},"language":"en","primary_location":{"id":"doi:10.1109/tim.2025.3545524","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2025.3545524","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5065053891","display_name":"Chao Yuan","orcid":"https://orcid.org/0000-0001-9346-7256"},"institutions":[{"id":"https://openalex.org/I16609230","display_name":"Hunan University","ror":"https://ror.org/05htk5m33","country_code":"CN","type":"education","lineage":["https://openalex.org/I16609230"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Chao Yuan","raw_affiliation_strings":["College of Electrical and Information Engineering, Hunan University, Changsha, China"],"affiliations":[{"raw_affiliation_string":"College of Electrical and Information Engineering, Hunan University, Changsha, China","institution_ids":["https://openalex.org/I16609230"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5076043899","display_name":"Zhaoyang Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I16609230","display_name":"Hunan University","ror":"https://ror.org/05htk5m33","country_code":"CN","type":"education","lineage":["https://openalex.org/I16609230"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhaoyang Wang","raw_affiliation_strings":["College of Electrical and Information Engineering, Hunan University, Changsha, China"],"affiliations":[{"raw_affiliation_string":"College of Electrical and Information Engineering, Hunan University, Changsha, China","institution_ids":["https://openalex.org/I16609230"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063254424","display_name":"Chengxu Tang","orcid":null},"institutions":[{"id":"https://openalex.org/I16609230","display_name":"Hunan University","ror":"https://ror.org/05htk5m33","country_code":"CN","type":"education","lineage":["https://openalex.org/I16609230"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chengxu Tang","raw_affiliation_strings":["College of Electrical and Information Engineering, Hunan University, Changsha, China"],"affiliations":[{"raw_affiliation_string":"College of Electrical and Information Engineering, Hunan University, Changsha, China","institution_ids":["https://openalex.org/I16609230"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103518802","display_name":"Yun Huang","orcid":null},"institutions":[{"id":"https://openalex.org/I16609230","display_name":"Hunan University","ror":"https://ror.org/05htk5m33","country_code":"CN","type":"education","lineage":["https://openalex.org/I16609230"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yun Huang","raw_affiliation_strings":["College of Electrical and Information Engineering, Hunan University, Changsha, China"],"affiliations":[{"raw_affiliation_string":"College of Electrical and Information Engineering, Hunan University, Changsha, China","institution_ids":["https://openalex.org/I16609230"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100393708","display_name":"Qiao Li","orcid":"https://orcid.org/0000-0002-8940-9966"},"institutions":[{"id":"https://openalex.org/I16609230","display_name":"Hunan University","ror":"https://ror.org/05htk5m33","country_code":"CN","type":"education","lineage":["https://openalex.org/I16609230"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qiao Li","raw_affiliation_strings":["College of Electrical and Information Engineering, Hunan University, Changsha, China"],"affiliations":[{"raw_affiliation_string":"College of Electrical and Information Engineering, Hunan University, Changsha, China","institution_ids":["https://openalex.org/I16609230"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5065053891"],"corresponding_institution_ids":["https://openalex.org/I16609230"],"apc_list":null,"apc_paid":null,"fwci":2.2402,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.86709293,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":96,"max":97},"biblio":{"volume":"74","issue":null,"first_page":"1","last_page":"11"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9592000246047974,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9592000246047974,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13928","display_name":"Advanced Sensor Technologies Research","score":0.9416999816894531,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12564","display_name":"Sensor Technology and Measurement Systems","score":0.9369000196456909,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/compensation","display_name":"Compensation (psychology)","score":0.6826167106628418},{"id":"https://openalex.org/keywords/temperature-measurement","display_name":"Temperature measurement","score":0.6667443513870239},{"id":"https://openalex.org/keywords/piezoresistive-effect","display_name":"Piezoresistive effect","score":0.6346480846405029},{"id":"https://openalex.org/keywords/heat-transfer","display_name":"Heat transfer","score":0.5982372164726257},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.580590546131134},{"id":"https://openalex.org/keywords/pressure-sensor","display_name":"Pressure sensor","score":0.5296717882156372},{"id":"https://openalex.org/keywords/transfer-function","display_name":"Transfer function","score":0.45072153210639954},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.42325735092163086},{"id":"https://openalex.org/keywords/pressure-measurement","display_name":"Pressure measurement","score":0.42239364981651306},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.41888725757598877},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.3436376452445984},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.31690722703933716},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2634744942188263},{"id":"https://openalex.org/keywords/mechanics","display_name":"Mechanics","score":0.25432032346725464},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.21371990442276},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.14093729853630066},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.13050100207328796}],"concepts":[{"id":"https://openalex.org/C2780023022","wikidata":"https://www.wikidata.org/wiki/Q1338171","display_name":"Compensation (psychology)","level":2,"score":0.6826167106628418},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.6667443513870239},{"id":"https://openalex.org/C198490522","wikidata":"https://www.wikidata.org/wiki/Q1932915","display_name":"Piezoresistive effect","level":2,"score":0.6346480846405029},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.5982372164726257},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.580590546131134},{"id":"https://openalex.org/C41325743","wikidata":"https://www.wikidata.org/wiki/Q1261040","display_name":"Pressure sensor","level":2,"score":0.5296717882156372},{"id":"https://openalex.org/C81299745","wikidata":"https://www.wikidata.org/wiki/Q334269","display_name":"Transfer function","level":2,"score":0.45072153210639954},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.42325735092163086},{"id":"https://openalex.org/C80264047","wikidata":"https://www.wikidata.org/wiki/Q7424019","display_name":"Pressure measurement","level":2,"score":0.42239364981651306},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.41888725757598877},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3436376452445984},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.31690722703933716},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2634744942188263},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.25432032346725464},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.21371990442276},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.14093729853630066},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.13050100207328796},{"id":"https://openalex.org/C15744967","wikidata":"https://www.wikidata.org/wiki/Q9418","display_name":"Psychology","level":0,"score":0.0},{"id":"https://openalex.org/C11171543","wikidata":"https://www.wikidata.org/wiki/Q41630","display_name":"Psychoanalysis","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tim.2025.3545524","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2025.3545524","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.8399999737739563,"display_name":"Affordable and clean energy"}],"awards":[{"id":"https://openalex.org/G8554734826","display_name":null,"funder_award_id":"U24B20102","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":30,"referenced_works":["https://openalex.org/W1970478080","https://openalex.org/W1974184470","https://openalex.org/W2120255193","https://openalex.org/W2127100446","https://openalex.org/W2344110434","https://openalex.org/W2425610527","https://openalex.org/W2558300365","https://openalex.org/W2801370662","https://openalex.org/W2869467597","https://openalex.org/W2909539303","https://openalex.org/W2945264879","https://openalex.org/W2996512277","https://openalex.org/W2997394149","https://openalex.org/W2999770657","https://openalex.org/W3013076318","https://openalex.org/W3043605664","https://openalex.org/W3094998881","https://openalex.org/W3118267103","https://openalex.org/W3139061100","https://openalex.org/W3170113178","https://openalex.org/W3174898767","https://openalex.org/W3193447638","https://openalex.org/W4200292646","https://openalex.org/W4206964483","https://openalex.org/W4288758364","https://openalex.org/W4311252055","https://openalex.org/W4313343614","https://openalex.org/W4386212375","https://openalex.org/W4391428218","https://openalex.org/W4392251598"],"related_works":["https://openalex.org/W4231551819","https://openalex.org/W2089076881","https://openalex.org/W2576957273","https://openalex.org/W99992490","https://openalex.org/W2890232104","https://openalex.org/W2378386980","https://openalex.org/W2443919171","https://openalex.org/W4285807532","https://openalex.org/W4319718036","https://openalex.org/W2061914748"],"abstract_inverted_index":{"Piezoresistive":[0],"pressure":[1,62,103,147],"sensors":[2],"are":[3],"prone":[4],"to":[5,37,82],"temperature":[6,15,28,43,57,90,126,153],"drift.":[7],"The":[8,69,149],"existing":[9],"software":[10],"compensation":[11,32,58,154],"methods":[12,23],"typically":[13],"correct":[14],"drift":[16,75,143],"based":[17],"on":[18],"environmental":[19,46],"temperature.":[20,47,168],"While":[21],"these":[22],"often":[24],"achieve":[25],"excellent":[26],"static":[27],"compensation,":[29],"their":[30],"dynamic":[31,56],"performance":[33,150],"is":[34,114,156],"limited":[35],"due":[36],"the":[38,41,45,73,77,87,94,101,111,119,125,128,141,145,152],"lag":[39],"between":[40],"chip":[42,79],"and":[44,97,164],"To":[48],"address":[49],"this":[50,52,117],"issue,":[51],"article":[53],"proposes":[54],"a":[55,105],"method":[59,121],"for":[60,110,140],"piezoresistive":[61,78,102,129,146],"sensors,":[63],"grounded":[64],"in":[65,80,167],"heat":[66,95],"transfer":[67],"analysis.":[68],"approach":[70],"accurately":[71],"predicts":[72],"thermal":[74,107,142],"of":[76,89,127,144,151],"relation":[81],"ambient":[83,135],"temperature,":[84],"significantly":[85],"enhancing":[86],"precision":[88],"compensation.":[91],"By":[92],"examining":[93],"convection":[96],"conduction":[98],"processes":[99],"within":[100],"sensor,":[104],"transient":[106],"impedance":[108],"network":[109],"sensor":[112],"core":[113],"constructed.":[115],"Utilizing":[116],"network,":[118],"proposed":[120],"can":[122],"precisely":[123],"forecast":[124],"chip.":[130],"Even":[131],"under":[132],"dynamically":[133],"changing":[134],"conditions,":[136],"it":[137],"effectively":[138],"compensates":[139],"sensor.":[148],"strategy":[155],"validated":[157],"through":[158],"tests":[159],"involving":[160],"both":[161],"step":[162],"changes":[163],"continuous":[165],"variations":[166]},"counts_by_year":[{"year":2025,"cited_by_count":3}],"updated_date":"2025-12-28T23:10:05.387466","created_date":"2025-10-10T00:00:00"}