{"id":"https://openalex.org/W4399527748","doi":"https://doi.org/10.1109/tim.2024.3403192","title":"Toughness Measurement of Microscale Coating/Silicon MEMS System Using Pillar Splitting Method","display_name":"Toughness Measurement of Microscale Coating/Silicon MEMS System Using Pillar Splitting Method","publication_year":2024,"publication_date":"2024-01-01","ids":{"openalex":"https://openalex.org/W4399527748","doi":"https://doi.org/10.1109/tim.2024.3403192"},"language":"en","primary_location":{"id":"doi:10.1109/tim.2024.3403192","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2024.3403192","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5047021174","display_name":"Yuanlin Xia","orcid":"https://orcid.org/0000-0001-5799-0648"},"institutions":[{"id":"https://openalex.org/I24185976","display_name":"Sichuan University","ror":"https://ror.org/011ashp19","country_code":"CN","type":"education","lineage":["https://openalex.org/I24185976"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Yuanlin Xia","raw_affiliation_strings":["School of Mechanical Engineering, Sichuan University, Chengdu, China"],"raw_orcid":"https://orcid.org/0000-0001-5799-0648","affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Sichuan University, Chengdu, China","institution_ids":["https://openalex.org/I24185976"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060930842","display_name":"Yuan Liu","orcid":"https://orcid.org/0000-0002-3572-1380"},"institutions":[{"id":"https://openalex.org/I24185976","display_name":"Sichuan University","ror":"https://ror.org/011ashp19","country_code":"CN","type":"education","lineage":["https://openalex.org/I24185976"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuan Liu","raw_affiliation_strings":["School of Mechanical Engineering, Sichuan University, Chengdu, China"],"raw_orcid":"https://orcid.org/0000-0002-3572-1380","affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Sichuan University, Chengdu, China","institution_ids":["https://openalex.org/I24185976"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009719292","display_name":"Yinfeng Xia","orcid":"https://orcid.org/0000-0002-4638-4009"},"institutions":[{"id":"https://openalex.org/I24185976","display_name":"Sichuan University","ror":"https://ror.org/011ashp19","country_code":"CN","type":"education","lineage":["https://openalex.org/I24185976"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yinfeng Xia","raw_affiliation_strings":["School of Mechanical Engineering, Sichuan University, Chengdu, China"],"raw_orcid":"https://orcid.org/0000-0002-4638-4009","affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Sichuan University, Chengdu, China","institution_ids":["https://openalex.org/I24185976"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102790963","display_name":"Wenfeng Liu","orcid":"https://orcid.org/0000-0003-2496-9505"},"institutions":[{"id":"https://openalex.org/I24185976","display_name":"Sichuan University","ror":"https://ror.org/011ashp19","country_code":"CN","type":"education","lineage":["https://openalex.org/I24185976"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wenfeng Liu","raw_affiliation_strings":["School of Mechanical Engineering, Sichuan University, Chengdu, China"],"raw_orcid":"https://orcid.org/0000-0003-2496-9505","affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Sichuan University, Chengdu, China","institution_ids":["https://openalex.org/I24185976"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100635243","display_name":"Cao Xia","orcid":"https://orcid.org/0000-0003-2819-7709"},"institutions":[{"id":"https://openalex.org/I24185976","display_name":"Sichuan University","ror":"https://ror.org/011ashp19","country_code":"CN","type":"education","lineage":["https://openalex.org/I24185976"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Cao Xia","raw_affiliation_strings":["School of Mechanical Engineering, Sichuan University, Chengdu, China"],"raw_orcid":"https://orcid.org/0000-0003-2819-7709","affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Sichuan University, Chengdu, China","institution_ids":["https://openalex.org/I24185976"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068027278","display_name":"Jiaxing Tan","orcid":"https://orcid.org/0000-0003-4585-4926"},"institutions":[{"id":"https://openalex.org/I24185976","display_name":"Sichuan University","ror":"https://ror.org/011ashp19","country_code":"CN","type":"education","lineage":["https://openalex.org/I24185976"]},{"id":"https://openalex.org/I4210089761","display_name":"West China Hospital of Sichuan University","ror":"https://ror.org/007mrxy13","country_code":"CN","type":"healthcare","lineage":["https://openalex.org/I4210089761"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jiaxing Tan","raw_affiliation_strings":["Department of Medicine, West China Hospital, Division of Nephrology, Sichuan University, Chengdu, China"],"raw_orcid":"https://orcid.org/0000-0003-4585-4926","affiliations":[{"raw_affiliation_string":"Department of Medicine, West China Hospital, Division of Nephrology, Sichuan University, Chengdu, China","institution_ids":["https://openalex.org/I24185976","https://openalex.org/I4210089761"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5075684041","display_name":"Zhuqing Wang","orcid":"https://orcid.org/0000-0002-7513-5773"},"institutions":[{"id":"https://openalex.org/I24185976","display_name":"Sichuan University","ror":"https://ror.org/011ashp19","country_code":"CN","type":"education","lineage":["https://openalex.org/I24185976"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhuqing Wang","raw_affiliation_strings":["School of Mechanical Engineering, Sichuan University, Chengdu, China"],"raw_orcid":"https://orcid.org/0000-0002-7513-5773","affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Sichuan University, Chengdu, China","institution_ids":["https://openalex.org/I24185976"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5047021174"],"corresponding_institution_ids":["https://openalex.org/I24185976"],"apc_list":null,"apc_paid":null,"fwci":0.2003,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.4793571,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":"73","issue":null,"first_page":"1","last_page":"11"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10205","display_name":"Advanced Fiber Optic Sensors","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10205","display_name":"Advanced Fiber Optic Sensors","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13049","display_name":"Surface Roughness and Optical Measurements","score":0.9947999715805054,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.7984927892684937},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7865941524505615},{"id":"https://openalex.org/keywords/pillar","display_name":"Pillar","score":0.7731682062149048},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.6759313344955444},{"id":"https://openalex.org/keywords/coating","display_name":"Coating","score":0.5856267809867859},{"id":"https://openalex.org/keywords/scale","display_name":"Scale (ratio)","score":0.45227769017219543},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.428253710269928},{"id":"https://openalex.org/keywords/toughness","display_name":"Toughness","score":0.4260942041873932},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.4085468351840973},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3653624653816223},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.2923082113265991},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.16726967692375183}],"concepts":[{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.7984927892684937},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7865941524505615},{"id":"https://openalex.org/C105289051","wikidata":"https://www.wikidata.org/wiki/Q1930094","display_name":"Pillar","level":2,"score":0.7731682062149048},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.6759313344955444},{"id":"https://openalex.org/C2781448156","wikidata":"https://www.wikidata.org/wiki/Q1570182","display_name":"Coating","level":2,"score":0.5856267809867859},{"id":"https://openalex.org/C2778755073","wikidata":"https://www.wikidata.org/wiki/Q10858537","display_name":"Scale (ratio)","level":2,"score":0.45227769017219543},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.428253710269928},{"id":"https://openalex.org/C99595764","wikidata":"https://www.wikidata.org/wiki/Q486802","display_name":"Toughness","level":2,"score":0.4260942041873932},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4085468351840973},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3653624653816223},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.2923082113265991},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16726967692375183},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tim.2024.3403192","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2024.3403192","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G5408162518","display_name":null,"funder_award_id":"2023YFB3210500","funder_id":"https://openalex.org/F4320335777","funder_display_name":"National Key Research and Development Program of China"}],"funders":[{"id":"https://openalex.org/F4320335777","display_name":"National Key Research and Development Program of China","ror":null}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2272290532","https://openalex.org/W2495348380","https://openalex.org/W604547544","https://openalex.org/W4230293041","https://openalex.org/W2377141674","https://openalex.org/W2352149692","https://openalex.org/W4390351107","https://openalex.org/W2368266917","https://openalex.org/W2359627721","https://openalex.org/W4390520112"],"abstract_inverted_index":{"This":[0,159],"work":[1,160],"innovatively":[2],"employed":[3],"the":[4,10,42,92,102,112,123,127,135,141,155,162,166],"pillar":[5,96,113,128,156,167],"splitting":[6,97,114,157,168],"method":[7,81,169],"to":[8,131,181],"extract":[9],"fracture":[11,105,124,136,171,182],"toughness":[12,125,137,172],"of":[13,19,59,119,126,164,174,185],"silicon":[14,55],"microstructures":[15],"with":[16,34,57,134,140],"full":[17],"coating":[18,33,142],"diamond":[20],"like":[21],"carbon":[22],"(DLC)":[23],"introduced":[24],"by":[25,40,147],"plasma-enhanced":[26],"chemical":[27],"vapor":[28],"deposition":[29,43],"(PECVD).":[30],"The":[31,88],"DLC":[32],"different":[35],"hardness":[36],"and":[37,48,62,109,177],"elastic":[38],"modulus":[39],"adjusting":[41],"bias":[44],"voltage":[45],"at":[46],"-200":[47],"-600":[49],"V":[50],"was":[51,98,115,145],"grown":[52],"on":[53],"bare":[54],"pillars":[56],"diameters":[58],"5,":[60],"8,":[61],"<inline-formula":[63,73],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[64,74],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">":[65,75],"<tex-math":[66,76],"notation=\"LaTeX\">$10~\\mu":[67],"$":[68,78],"</tex-math></inline-formula>m.":[69],"We":[70],"established":[71],"a":[72],"notation=\"LaTeX\">$\\gamma":[77],"</tex-math></inline-formula>":[79],"selection":[80],"specifically":[82],"tailored":[83],"for":[84,170],"laminated":[85],"composite":[86,187],"structures.":[87,188],"discontinuity":[89],"observed":[90],"in":[91,95,100,111],"force-displacement":[93],"curve":[94],"reported,":[99],"which":[101,144],"interrelationship":[103],"between":[104],"toughness,":[106],"crack":[107],"nucleation,":[108],"propagation":[110],"analyzed.":[116],"Both":[117],"types":[118],"coatings":[120],"significantly":[121],"improved":[122],"microstructure":[129],"compared":[130],"uncoated":[132],"samples,":[133],"monotonically":[138],"increasing":[139],"hardness,":[143],"confirmed":[146],"finite":[148],"element":[149],"simulations,":[150],"exhibiting":[151],"similar":[152],"trends":[153],"as":[154],"experiments.":[158],"validates":[161],"feasibility":[163],"using":[165],"characterization":[173],"coating/substrate":[175],"microsystems":[176],"can":[178],"be":[179],"applied":[180],"behavior":[183],"testing":[184],"other":[186]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2025-12-23T23:11:35.936235","created_date":"2025-10-10T00:00:00"}