{"id":"https://openalex.org/W4394586003","doi":"https://doi.org/10.1109/tim.2024.3385819","title":"Anomaly Detection and Fault Classification of Printed Circuit Boards Based on Multimodal Features of the Infrared Thermal Imaging","display_name":"Anomaly Detection and Fault Classification of Printed Circuit Boards Based on Multimodal Features of the Infrared Thermal Imaging","publication_year":2024,"publication_date":"2024-01-01","ids":{"openalex":"https://openalex.org/W4394586003","doi":"https://doi.org/10.1109/tim.2024.3385819"},"language":"en","primary_location":{"id":"doi:10.1109/tim.2024.3385819","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2024.3385819","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101719719","display_name":"Zhangwei Wang","orcid":"https://orcid.org/0000-0003-3700-4534"},"institutions":[{"id":"https://openalex.org/I82880672","display_name":"Beihang University","ror":"https://ror.org/00wk2mp56","country_code":"CN","type":"education","lineage":["https://openalex.org/I82880672"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhangwei Wang","raw_affiliation_strings":["School of Automation Science and Electrical Engineering, Beihang University, Beijing, China"],"raw_orcid":"https://orcid.org/0000-0003-3700-4534","affiliations":[{"raw_affiliation_string":"School of Automation Science and Electrical Engineering, Beihang University, Beijing, China","institution_ids":["https://openalex.org/I82880672"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035316912","display_name":"Haiwen Yuan","orcid":"https://orcid.org/0000-0002-9667-8363"},"institutions":[{"id":"https://openalex.org/I82880672","display_name":"Beihang University","ror":"https://ror.org/00wk2mp56","country_code":"CN","type":"education","lineage":["https://openalex.org/I82880672"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Haiwen Yuan","raw_affiliation_strings":["School of Automation Science and Electrical Engineering, Beihang University, Beijing, China"],"raw_orcid":"https://orcid.org/0000-0002-9667-8363","affiliations":[{"raw_affiliation_string":"School of Automation Science and Electrical Engineering, Beihang University, Beijing, China","institution_ids":["https://openalex.org/I82880672"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075753301","display_name":"Jianxun Lv","orcid":"https://orcid.org/0000-0002-6840-3485"},"institutions":[{"id":"https://openalex.org/I82880672","display_name":"Beihang University","ror":"https://ror.org/00wk2mp56","country_code":"CN","type":"education","lineage":["https://openalex.org/I82880672"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jianxun Lv","raw_affiliation_strings":["School of Automation Science and Electrical Engineering, Beihang University, Beijing, China"],"raw_orcid":"https://orcid.org/0000-0002-6840-3485","affiliations":[{"raw_affiliation_string":"School of Automation Science and Electrical Engineering, Beihang University, Beijing, China","institution_ids":["https://openalex.org/I82880672"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013481747","display_name":"Chengxin Liu","orcid":"https://orcid.org/0000-0003-3723-4209"},"institutions":[{"id":"https://openalex.org/I82880672","display_name":"Beihang University","ror":"https://ror.org/00wk2mp56","country_code":"CN","type":"education","lineage":["https://openalex.org/I82880672"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chengxin Liu","raw_affiliation_strings":["School of Automation Science and Electrical Engineering, Beihang University, Beijing, China"],"raw_orcid":"https://orcid.org/0000-0003-3723-4209","affiliations":[{"raw_affiliation_string":"School of Automation Science and Electrical Engineering, Beihang University, Beijing, China","institution_ids":["https://openalex.org/I82880672"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040940480","display_name":"Hai Xu","orcid":"https://orcid.org/0000-0001-5209-3497"},"institutions":[{"id":"https://openalex.org/I4210147760","display_name":"Wuhu Institute of Technology","ror":"https://ror.org/055hnk386","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210147760"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hai Xu","raw_affiliation_strings":["Wuhu Machinery Factory, Wuhu, China"],"raw_orcid":"https://orcid.org/0000-0001-5209-3497","affiliations":[{"raw_affiliation_string":"Wuhu Machinery Factory, Wuhu, China","institution_ids":["https://openalex.org/I4210147760"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5085219584","display_name":"Jinmeng Li","orcid":"https://orcid.org/0000-0001-6178-1048"},"institutions":[{"id":"https://openalex.org/I4210147760","display_name":"Wuhu Institute of Technology","ror":"https://ror.org/055hnk386","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210147760"]},{"id":"https://openalex.org/I9842412","display_name":"Nanjing University of Aeronautics and Astronautics","ror":"https://ror.org/01scyh794","country_code":"CN","type":"education","lineage":["https://openalex.org/I9842412"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jinmeng Li","raw_affiliation_strings":["Wuhu Machinery Factory, Wuhu, China","School of Automation Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing, China"],"raw_orcid":"https://orcid.org/0000-0001-6178-1048","affiliations":[{"raw_affiliation_string":"Wuhu Machinery Factory, Wuhu, China","institution_ids":["https://openalex.org/I4210147760"]},{"raw_affiliation_string":"School of Automation Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing, China","institution_ids":["https://openalex.org/I9842412"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":4.3818,"has_fulltext":false,"cited_by_count":21,"citation_normalized_percentile":{"value":0.94267873,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":96,"max":100},"biblio":{"volume":"73","issue":null,"first_page":"1","last_page":"13"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9896000027656555,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9896000027656555,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11856","display_name":"Thermography and Photoacoustic Techniques","score":0.9882000088691711,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10876","display_name":"Fault Detection and Control Systems","score":0.9711999893188477,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.6045858860015869},{"id":"https://openalex.org/keywords/anomaly-detection","display_name":"Anomaly detection","score":0.58099365234375},{"id":"https://openalex.org/keywords/infrared","display_name":"Infrared","score":0.555128812789917},{"id":"https://openalex.org/keywords/fault-detection-and-isolation","display_name":"Fault detection and isolation","score":0.49396568536758423},{"id":"https://openalex.org/keywords/fault","display_name":"Fault (geology)","score":0.46276822686195374},{"id":"https://openalex.org/keywords/thermal-infrared","display_name":"Thermal infrared","score":0.4156815707683563},{"id":"https://openalex.org/keywords/anomaly","display_name":"Anomaly (physics)","score":0.4112769067287445},{"id":"https://openalex.org/keywords/pattern-recognition","display_name":"Pattern recognition (psychology)","score":0.3830905556678772},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.35860681533813477},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.35526466369628906},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.34502488374710083},{"id":"https://openalex.org/keywords/remote-sensing","display_name":"Remote sensing","score":0.3362465500831604},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2773919403553009},{"id":"https://openalex.org/keywords/geology","display_name":"Geology","score":0.233708918094635},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.20750519633293152},{"id":"https://openalex.org/keywords/seismology","display_name":"Seismology","score":0.17315435409545898},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.16149550676345825},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.15931344032287598}],"concepts":[{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.6045858860015869},{"id":"https://openalex.org/C739882","wikidata":"https://www.wikidata.org/wiki/Q3560506","display_name":"Anomaly detection","level":2,"score":0.58099365234375},{"id":"https://openalex.org/C158355884","wikidata":"https://www.wikidata.org/wiki/Q11388","display_name":"Infrared","level":2,"score":0.555128812789917},{"id":"https://openalex.org/C152745839","wikidata":"https://www.wikidata.org/wiki/Q5438153","display_name":"Fault detection and isolation","level":3,"score":0.49396568536758423},{"id":"https://openalex.org/C175551986","wikidata":"https://www.wikidata.org/wiki/Q47089","display_name":"Fault (geology)","level":2,"score":0.46276822686195374},{"id":"https://openalex.org/C2984335091","wikidata":"https://www.wikidata.org/wiki/Q11388","display_name":"Thermal infrared","level":3,"score":0.4156815707683563},{"id":"https://openalex.org/C12997251","wikidata":"https://www.wikidata.org/wiki/Q567560","display_name":"Anomaly (physics)","level":2,"score":0.4112769067287445},{"id":"https://openalex.org/C153180895","wikidata":"https://www.wikidata.org/wiki/Q7148389","display_name":"Pattern recognition (psychology)","level":2,"score":0.3830905556678772},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.35860681533813477},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.35526466369628906},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.34502488374710083},{"id":"https://openalex.org/C62649853","wikidata":"https://www.wikidata.org/wiki/Q199687","display_name":"Remote sensing","level":1,"score":0.3362465500831604},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2773919403553009},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.233708918094635},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.20750519633293152},{"id":"https://openalex.org/C165205528","wikidata":"https://www.wikidata.org/wiki/Q83371","display_name":"Seismology","level":1,"score":0.17315435409545898},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.16149550676345825},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.15931344032287598},{"id":"https://openalex.org/C26873012","wikidata":"https://www.wikidata.org/wiki/Q214781","display_name":"Condensed matter physics","level":1,"score":0.0},{"id":"https://openalex.org/C172707124","wikidata":"https://www.wikidata.org/wiki/Q423488","display_name":"Actuator","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tim.2024.3385819","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2024.3385819","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Climate action","id":"https://metadata.un.org/sdg/13","score":0.5199999809265137}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":36,"referenced_works":["https://openalex.org/W2007639067","https://openalex.org/W2037712846","https://openalex.org/W2039051707","https://openalex.org/W2124005670","https://openalex.org/W2131081720","https://openalex.org/W2147141800","https://openalex.org/W2161969291","https://openalex.org/W2491193801","https://openalex.org/W2593116849","https://openalex.org/W2740924709","https://openalex.org/W2767198322","https://openalex.org/W2887122927","https://openalex.org/W2946025058","https://openalex.org/W2965018937","https://openalex.org/W2981293705","https://openalex.org/W2993309541","https://openalex.org/W2998674405","https://openalex.org/W3005042541","https://openalex.org/W3014811330","https://openalex.org/W3095442113","https://openalex.org/W3125475797","https://openalex.org/W3162082170","https://openalex.org/W3209181089","https://openalex.org/W4200614116","https://openalex.org/W4210407621","https://openalex.org/W4246733687","https://openalex.org/W4283070967","https://openalex.org/W4288064754","https://openalex.org/W4289779494","https://openalex.org/W4312375401","https://openalex.org/W4313064927","https://openalex.org/W4379875138","https://openalex.org/W4383747283","https://openalex.org/W4387789991","https://openalex.org/W4387872575","https://openalex.org/W4388280012"],"related_works":["https://openalex.org/W2806741695","https://openalex.org/W4290647774","https://openalex.org/W3189286258","https://openalex.org/W3207797160","https://openalex.org/W3210364259","https://openalex.org/W4300558037","https://openalex.org/W2912112202","https://openalex.org/W2667207928","https://openalex.org/W4377864969","https://openalex.org/W3030345572"],"abstract_inverted_index":{"A":[0],"heightened":[1],"demand":[2],"for":[3,78,134],"improved":[4],"printed":[5],"circuit":[6,143],"board":[7],"(PCB)":[8],"fault":[9,51,69,82,102,135,153],"detection":[10,52,80,128,151,177],"arises":[11],"with":[12],"the":[13,62,115],"increasing":[14],"integration":[15],"and":[16,28,64,81,101,120,131,152,167,171,179],"enhanced":[17],"functionality":[18],"of":[19,44,67,84,94,129],"PCBs.":[20,85],"Traditional":[21],"visible":[22,45],"light":[23],"image":[24],"analysis":[25],"demonstrates":[26],"accuracy":[27,155,178],"safety":[29],"advantages":[30],"in":[31,38,148,182],"non-intrusive":[32],"detection.":[33,70],"However,":[34],"it":[35],"exhibits":[36],"limitations":[37],"detecting":[39],"obscured":[40],"faults":[41],"or":[42],"lack":[43],"defects.":[46],"The":[47,71,86,109],"study":[48],"proposes":[49],"a":[50,140,145],"framework":[53,77,87,110],"based":[54,104],"on":[55,105,139],"infrared":[56,75,90],"thermal":[57,91],"imaging,":[58],"aiming":[59],"to":[60,157],"enhance":[61],"practicality":[63],"engineering":[65,183],"efficiency":[66],"PCB":[68,149,169],"paper":[72],"introduces":[73],"an":[74,165],"thermography-based":[76],"anomaly":[79,99,150,176],"classification":[83,103,154],"encompasses":[88],"preprocessing":[89],"images,":[92],"extraction":[93,160],"multimodal":[95],"feature":[96,159],"vectors,":[97],"density-based":[98],"detection,":[100],"deviation":[106],"matrix":[107],"clustering.":[108],"extracts":[111],"multi-modal":[112],"features":[113],"from":[114],"residual":[116,121],"temperature":[117,122],"scalar":[118],"fields":[119],"gradient":[123],"vector":[124],"fields,":[125],"employing":[126],"multi-scale":[127],"global":[130],"local":[132],"images":[133],"classification.":[136],"Experimental":[137],"validation":[138],"two-phase":[141],"drive":[142],"illustrates":[144],"significant":[146],"enhancement":[147],"compared":[156],"existing":[158],"techniques.":[161],"This":[162],"research":[163],"provides":[164],"innovative":[166],"practical":[168],"manufacturing":[170],"maintenance":[172],"tool,":[173],"effectively":[174],"elevating":[175],"operational":[180],"feasibility":[181],"practices.":[184]},"counts_by_year":[{"year":2026,"cited_by_count":4},{"year":2025,"cited_by_count":14},{"year":2024,"cited_by_count":3}],"updated_date":"2026-08-12T21:12:35.861297","created_date":"2025-10-10T00:00:00"}