{"id":"https://openalex.org/W3119995633","doi":"https://doi.org/10.1109/tim.2021.3051666","title":"Detection of Site to Site Variations from Volume Measurement Data in Multi-site Semiconductor Testing","display_name":"Detection of Site to Site Variations from Volume Measurement Data in Multi-site Semiconductor Testing","publication_year":2021,"publication_date":"2021-01-01","ids":{"openalex":"https://openalex.org/W3119995633","doi":"https://doi.org/10.1109/tim.2021.3051666","mag":"3119995633"},"language":"en","primary_location":{"id":"doi:10.1109/tim.2021.3051666","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2021.3051666","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5084435377","display_name":"Praise O. Farayola","orcid":"https://orcid.org/0000-0002-2853-4763"},"institutions":[{"id":"https://openalex.org/I173911158","display_name":"Iowa State University","ror":"https://ror.org/04rswrd78","country_code":"US","type":"education","lineage":["https://openalex.org/I173911158"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Praise O. Farayola","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Iowa State University, Ames, IA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Iowa State University, Ames, IA, USA","institution_ids":["https://openalex.org/I173911158"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023673688","display_name":"Shravan K. Chaganti","orcid":"https://orcid.org/0000-0001-5930-5894"},"institutions":[{"id":"https://openalex.org/I173911158","display_name":"Iowa State University","ror":"https://ror.org/04rswrd78","country_code":"US","type":"education","lineage":["https://openalex.org/I173911158"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Shravan K. Chaganti","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Iowa State University, Ames, IA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Iowa State University, Ames, IA, USA","institution_ids":["https://openalex.org/I173911158"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072580224","display_name":"Abdullah O. Obaidi","orcid":null},"institutions":[{"id":"https://openalex.org/I173911158","display_name":"Iowa State University","ror":"https://ror.org/04rswrd78","country_code":"US","type":"education","lineage":["https://openalex.org/I173911158"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Abdullah O. Obaidi","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Iowa State University, Ames, IA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Iowa State University, Ames, IA, USA","institution_ids":["https://openalex.org/I173911158"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081596132","display_name":"Abalhassan Sheikh","orcid":"https://orcid.org/0000-0001-8106-4732"},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Abalhassan Sheikh","raw_affiliation_strings":["Texas Instruments Inc, Sugar Land, TX, USA"],"affiliations":[{"raw_affiliation_string":"Texas Instruments Inc, Sugar Land, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101754185","display_name":"Srivaths Ravi","orcid":"https://orcid.org/0000-0002-1306-2361"},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Srivaths Ravi","raw_affiliation_strings":["Texas Instruments Inc, Sugar Land, TX, USA"],"affiliations":[{"raw_affiliation_string":"Texas Instruments Inc, Sugar Land, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101873076","display_name":"Degang Chen","orcid":"https://orcid.org/0000-0002-5938-6329"},"institutions":[{"id":"https://openalex.org/I173911158","display_name":"Iowa State University","ror":"https://ror.org/04rswrd78","country_code":"US","type":"education","lineage":["https://openalex.org/I173911158"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Degang Chen","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Iowa State University, Ames, IA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Iowa State University, Ames, IA, USA","institution_ids":["https://openalex.org/I173911158"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5084435377"],"corresponding_institution_ids":["https://openalex.org/I173911158"],"apc_list":null,"apc_paid":null,"fwci":1.4038,"has_fulltext":false,"cited_by_count":16,"citation_normalized_percentile":{"value":0.80517365,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":95,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"1"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/robustness","display_name":"Robustness (evolution)","score":0.6546437740325928},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5375786423683167},{"id":"https://openalex.org/keywords/parametric-statistics","display_name":"Parametric statistics","score":0.48903688788414},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4412086009979248},{"id":"https://openalex.org/keywords/real-time-computing","display_name":"Real-time computing","score":0.43728041648864746},{"id":"https://openalex.org/keywords/throughput","display_name":"Throughput","score":0.4317641258239746},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3455401659011841},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.34307366609573364},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.30202144384384155}],"concepts":[{"id":"https://openalex.org/C63479239","wikidata":"https://www.wikidata.org/wiki/Q7353546","display_name":"Robustness (evolution)","level":3,"score":0.6546437740325928},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5375786423683167},{"id":"https://openalex.org/C117251300","wikidata":"https://www.wikidata.org/wiki/Q1849855","display_name":"Parametric statistics","level":2,"score":0.48903688788414},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4412086009979248},{"id":"https://openalex.org/C79403827","wikidata":"https://www.wikidata.org/wiki/Q3988","display_name":"Real-time computing","level":1,"score":0.43728041648864746},{"id":"https://openalex.org/C157764524","wikidata":"https://www.wikidata.org/wiki/Q1383412","display_name":"Throughput","level":3,"score":0.4317641258239746},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3455401659011841},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.34307366609573364},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.30202144384384155},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0},{"id":"https://openalex.org/C104317684","wikidata":"https://www.wikidata.org/wiki/Q7187","display_name":"Gene","level":2,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tim.2021.3051666","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2021.3051666","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5899999737739563,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":25,"referenced_works":["https://openalex.org/W1553440939","https://openalex.org/W1862469596","https://openalex.org/W1947418710","https://openalex.org/W1998943402","https://openalex.org/W2017761002","https://openalex.org/W2019716132","https://openalex.org/W2040695849","https://openalex.org/W2062522093","https://openalex.org/W2086066321","https://openalex.org/W2116428497","https://openalex.org/W2123818150","https://openalex.org/W2131245942","https://openalex.org/W2137111541","https://openalex.org/W2140328213","https://openalex.org/W2148547854","https://openalex.org/W2162342991","https://openalex.org/W2169894359","https://openalex.org/W2396953144","https://openalex.org/W2498233082","https://openalex.org/W2509695479","https://openalex.org/W2781391663","https://openalex.org/W2871035070","https://openalex.org/W2913356818","https://openalex.org/W2969667166","https://openalex.org/W3033429261"],"related_works":["https://openalex.org/W2899084033","https://openalex.org/W160116885","https://openalex.org/W2406319360","https://openalex.org/W2059929079","https://openalex.org/W2038850720","https://openalex.org/W2625512991","https://openalex.org/W2526884355","https://openalex.org/W2044765982","https://openalex.org/W2011083790","https://openalex.org/W2468479845"],"abstract_inverted_index":{"The":[0],"rising":[1],"analog":[2,17],"content":[3],"in":[4,87,117,197],"mixed-signal":[5],"integrated":[6],"circuits":[7],"(ICs)":[8],"is":[9,143],"driving":[10],"an":[11,161],"increased":[12],"need":[13,145],"for":[14,76,146,208],"measurement":[15,31,49,72,156,182,195,229],"of":[16,83,98,181,189,212,217],"parametric":[18],"specifications":[19],"during":[20],"manufacturing":[21],"test,":[22],"thereby":[23],"significantly":[24],"increasing":[25,45],"overall":[26],"chip":[27],"cost.":[28],"Multisite":[29],"(parallel)":[30],"alleviates":[32],"this":[33],"issue":[34],"by":[35],"measuring":[36],"multiple":[37],"chips":[38],"at":[39,101],"the":[40,81,187,198,218],"same":[41],"time,":[42],"hence":[43],"massively":[44],"throughput":[46],"and":[47,57,60,73,114,127,137,152,172,215,227],"reducing":[48],"time":[50],"per":[51],"chip.":[52],"For":[53],"successful":[54],"multisite":[55,66],"test":[56,61,74,99],"measurement,":[58],"product":[59],"engineers":[62],"have":[63],"to":[64,89,96,124,134,150,170,178,202,224],"design":[65],"boards":[67],"that":[68,164,193],"can":[69],"ensure":[70],"robust":[71,209],"quality":[75],"each":[77],"site.":[78],"However,":[79],"as":[80,111],"number":[82],"sites":[84],"increases,":[85],"variations":[86,105],"site":[88,90,128],"behavior":[91],"are":[92,130,220],"often":[93],"seen,":[94],"leading":[95,133],"degradation":[97],"results":[100],"some":[102],"sites.":[103],"These":[104],"result":[106],"from":[107,155],"various":[108],"artifacts":[109],"such":[110],"nonhomogenous":[112],"layout":[113],"routing,":[115],"compromises":[116],"component":[118],"placement,":[119],"etc.":[120],"Very":[121],"often,":[122],"methods":[123,169],"detect":[125,173],"board":[126],"anomalies":[129],"ad":[131],"hoc,":[132],"a":[135,144,147,203],"time-consuming":[136],"expensive":[138],"diagnosis":[139],"cycle.":[140],"Therefore,":[141],"there":[142],"cost-effective":[148],"approach":[149],"investigate":[151],"identify":[153],"SSV":[154,174],"data.":[157,183,230],"This":[158],"work":[159],"proposes":[160],"automated":[162],"technique":[163],"leverages":[165],"advanced":[166],"statistical":[167,204],"learning":[168],"pronounce":[171],"not":[175],"always":[176],"visible":[177],"human":[179],"inspections":[180],"Specifically,":[184],"we":[185],"contribute":[186],"concept":[188],"using":[190],"domain":[191],"transformation":[192],"converts":[194],"data":[196],"specification":[199],"value":[200],"space":[201],"parameter":[205],"space,":[206],"allowing":[207],"automatic":[210],"detectability":[211],"SSV.":[213],"Robustness":[214],"accuracy":[216],"method":[219],"confirmed":[221],"after":[222],"application":[223],"real-world":[225],"industrial":[226],"simulated":[228]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2023,"cited_by_count":5},{"year":2022,"cited_by_count":6},{"year":2021,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}