{"id":"https://openalex.org/W3092007399","doi":"https://doi.org/10.1109/tim.2020.3029361","title":"Determination of Thermal Conductivities for Thin-Film Materials in CMOS MEMS Process","display_name":"Determination of Thermal Conductivities for Thin-Film Materials in CMOS MEMS Process","publication_year":2020,"publication_date":"2020-10-07","ids":{"openalex":"https://openalex.org/W3092007399","doi":"https://doi.org/10.1109/tim.2020.3029361","mag":"3092007399"},"language":"en","primary_location":{"id":"doi:10.1109/tim.2020.3029361","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2020.3029361","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5045896022","display_name":"Wei Xu","orcid":"https://orcid.org/0000-0001-6196-3693"},"institutions":[{"id":"https://openalex.org/I180726961","display_name":"Shenzhen University","ror":"https://ror.org/01vy4gh70","country_code":"CN","type":"education","lineage":["https://openalex.org/I180726961"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Wei Xu","raw_affiliation_strings":["College of Electronics and Information Engineering, Shenzhen University, Shenzhen, China"],"raw_orcid":"https://orcid.org/0000-0001-6196-3693","affiliations":[{"raw_affiliation_string":"College of Electronics and Information Engineering, Shenzhen University, Shenzhen, China","institution_ids":["https://openalex.org/I180726961"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5014078865","display_name":"Xiaoyi Wang","orcid":"https://orcid.org/0000-0002-6286-3085"},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Xiaoyi Wang","raw_affiliation_strings":["Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Hong Kong, China"],"raw_orcid":"https://orcid.org/0000-0002-6286-3085","affiliations":[{"raw_affiliation_string":"Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Hong Kong, China","institution_ids":["https://openalex.org/I200769079"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065818226","display_name":"Xiaojin Zhao","orcid":"https://orcid.org/0000-0002-9965-3516"},"institutions":[{"id":"https://openalex.org/I180726961","display_name":"Shenzhen University","ror":"https://ror.org/01vy4gh70","country_code":"CN","type":"education","lineage":["https://openalex.org/I180726961"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiaojin Zhao","raw_affiliation_strings":["College of Electronics and Information Engineering, Shenzhen University, Shenzhen, China"],"raw_orcid":"https://orcid.org/0000-0002-9965-3516","affiliations":[{"raw_affiliation_string":"College of Electronics and Information Engineering, Shenzhen University, Shenzhen, China","institution_ids":["https://openalex.org/I180726961"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5091047821","display_name":"Yatao Yang","orcid":"https://orcid.org/0000-0003-0934-6967"},"institutions":[{"id":"https://openalex.org/I180726961","display_name":"Shenzhen University","ror":"https://ror.org/01vy4gh70","country_code":"CN","type":"education","lineage":["https://openalex.org/I180726961"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yatao Yang","raw_affiliation_strings":["College of Electronics and Information Engineering, Shenzhen University, Shenzhen, China"],"raw_orcid":"https://orcid.org/0000-0003-0934-6967","affiliations":[{"raw_affiliation_string":"College of Electronics and Information Engineering, Shenzhen University, Shenzhen, China","institution_ids":["https://openalex.org/I180726961"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5063522793","display_name":"Yi-Kuen Lee","orcid":"https://orcid.org/0000-0002-7473-4344"},"institutions":[{"id":"https://openalex.org/I200769079","display_name":"Hong Kong University of Science and Technology","ror":"https://ror.org/00q4vv597","country_code":"HK","type":"education","lineage":["https://openalex.org/I200769079"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Yi-Kuen Lee","raw_affiliation_strings":["Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Hong Kong, China"],"raw_orcid":"https://orcid.org/0000-0002-7473-4344","affiliations":[{"raw_affiliation_string":"Department of Mechanical and Aerospace Engineering, Hong Kong University of Science and Technology, Hong Kong, China","institution_ids":["https://openalex.org/I200769079"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5045896022"],"corresponding_institution_ids":["https://openalex.org/I180726961"],"apc_list":null,"apc_paid":null,"fwci":0.4071,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.54638242,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":"70","issue":null,"first_page":"1","last_page":"9"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.8498175144195557},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8293973207473755},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.6729946136474609},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"Thermal conductivity","score":0.667100191116333},{"id":"https://openalex.org/keywords/thin-film","display_name":"Thin film","score":0.5936076641082764},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.5594773888587952},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5319818258285522},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.48153048753738403},{"id":"https://openalex.org/keywords/oxide","display_name":"Oxide","score":0.46973904967308044},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4298180043697357},{"id":"https://openalex.org/keywords/aluminium","display_name":"Aluminium","score":0.4126034379005432},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4119536280632019},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3088313341140747},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.24858281016349792},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.16103866696357727}],"concepts":[{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.8498175144195557},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8293973207473755},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.6729946136474609},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.667100191116333},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.5936076641082764},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.5594773888587952},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5319818258285522},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.48153048753738403},{"id":"https://openalex.org/C2779851234","wikidata":"https://www.wikidata.org/wiki/Q50690","display_name":"Oxide","level":2,"score":0.46973904967308044},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4298180043697357},{"id":"https://openalex.org/C513153333","wikidata":"https://www.wikidata.org/wiki/Q663","display_name":"Aluminium","level":2,"score":0.4126034379005432},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4119536280632019},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3088313341140747},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.24858281016349792},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.16103866696357727},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/tim.2020.3029361","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2020.3029361","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"},{"id":"pmh:oai:repository.hkust.edu.hk:1783.1-108925","is_oa":false,"landing_page_url":"https://repository.hkust.edu.hk/ir/Record/1783.1-108925","pdf_url":null,"source":{"id":"https://openalex.org/S4306401796","display_name":"Rare & Special e-Zone (The Hong Kong University of Science and Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I200769079","host_organization_name":"Hong Kong University of Science and Technology","host_organization_lineage":["https://openalex.org/I200769079"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Article"},{"id":"pmh:oai:repository.ust.hk:1783.1-108925","is_oa":false,"landing_page_url":"http://repository.ust.hk/ir/Record/1783.1-108925","pdf_url":null,"source":{"id":"https://openalex.org/S4306401796","display_name":"Rare & Special e-Zone (The Hong Kong University of Science and Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I200769079","host_organization_name":"Hong Kong University of Science and Technology","host_organization_lineage":["https://openalex.org/I200769079"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.5699999928474426,"display_name":"Affordable and clean energy"}],"awards":[{"id":"https://openalex.org/G7314719752","display_name":null,"funder_award_id":"2020A1515011555","funder_id":"https://openalex.org/F4320321921","funder_display_name":"Natural Science Foundation of Guangdong Province"}],"funders":[{"id":"https://openalex.org/F4320321921","display_name":"Natural Science Foundation of Guangdong Province","ror":null}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":32,"referenced_works":["https://openalex.org/W1669009280","https://openalex.org/W1965295937","https://openalex.org/W1975239984","https://openalex.org/W1988373384","https://openalex.org/W1999756238","https://openalex.org/W2018189177","https://openalex.org/W2027260457","https://openalex.org/W2028003145","https://openalex.org/W2031411880","https://openalex.org/W2052689493","https://openalex.org/W2062773254","https://openalex.org/W2063562156","https://openalex.org/W2094240247","https://openalex.org/W2101916562","https://openalex.org/W2106851937","https://openalex.org/W2130568097","https://openalex.org/W2132162076","https://openalex.org/W2132905138","https://openalex.org/W2140436747","https://openalex.org/W2160849628","https://openalex.org/W2180571009","https://openalex.org/W2278418127","https://openalex.org/W2399632194","https://openalex.org/W2514858717","https://openalex.org/W2606703202","https://openalex.org/W2769324703","https://openalex.org/W2793331045","https://openalex.org/W2884972080","https://openalex.org/W3099752842","https://openalex.org/W3184518629","https://openalex.org/W6745480060","https://openalex.org/W6749395241"],"related_works":["https://openalex.org/W2272290532","https://openalex.org/W2120483398","https://openalex.org/W1530711136","https://openalex.org/W3014521742","https://openalex.org/W1763916368","https://openalex.org/W2391127530","https://openalex.org/W2045074154","https://openalex.org/W2977898879","https://openalex.org/W2501578203","https://openalex.org/W2113108952"],"abstract_inverted_index":{"The":[0,101,149],"determination":[1],"of":[2,19,69,97,104,114,170],"thermal":[3,34,47,67,79,102,139,173],"conductivities":[4,68,103,140,174],"for":[5,52,121,175],"complementary":[6],"metal-oxide-semiconductor":[7],"(CMOS)":[8],"thin-film":[9,71,105,176],"materials":[10,72,106,157,177],"is":[11],"very":[12],"important":[13],"as":[14],"the":[15,66,74,87,118,145,152,161,168,172,179],"operation":[16],"and":[17,23,56,84,125,133,155,164],"failure":[18],"integrated":[20],"circuits":[21],"(ICs)":[22],"CMOS":[24,61,180],"microelectromechanical":[25],"systems":[26],"(MEMS)":[27],"devices":[28,51],"are":[29,158],"most":[30],"likely":[31],"limited":[32],"by":[33,86],"issues,":[35],"that":[36],"is,":[37],"heat":[38],"transfer.":[39],"In":[40],"this":[41],"article,":[42],"we":[43],"present":[44],"four":[45],"micro":[46],"conductivity":[48],"measurement":[49],"(\u03bcTCM)":[50],"silicon":[53,122],"oxide,":[54,123],"polysilicon,":[55,124],"aluminum":[57,126],"thin":[58,153],"films":[59],"using":[60],"MEMS":[62,181],"technology.":[63],"To":[64],"determine":[65],"those":[70],"from":[73],"\u03bcTCM":[75],"devices,":[76],"a":[77,111],"linear":[78],"resistance":[80],"model":[81],"was":[82],"proposed":[83],"validated":[85],"computational":[88],"fluid":[89],"dynamics":[90],"(CFD)":[91],"study,":[92],"which":[93,166],"showed":[94],"an":[95],"error":[96],"less":[98],"than":[99,144],"5.5%.":[100],"were":[107,130,141],"then":[108],"measured":[109,119,138],"over":[110],"temperature":[112,129],"range":[113],"210-362":[115],"K,":[116],"while":[117],"results":[120],"at":[127],"room":[128],"1.32,":[131],"21.22,":[132],"70.2":[134],"W/mK,":[135],"respectively.":[136],"Those":[137],"significantly":[142],"smaller":[143],"available":[146],"bulk":[147,156],"values.":[148],"discrepancies":[150],"between":[151],"film":[154],"consistent":[159],"with":[160],"reported":[162],"data":[163],"trends,":[165],"reveals":[167],"importance":[169],"determining":[171],"in":[178],"process.":[182]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":4},{"year":2021,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}