{"id":"https://openalex.org/W2972236101","doi":"https://doi.org/10.1109/tim.2019.2937425","title":"Small Anechoic Chamber Design Method for On-Line and On-Site Passive Intermodulation Measurement","display_name":"Small Anechoic Chamber Design Method for On-Line and On-Site Passive Intermodulation Measurement","publication_year":2019,"publication_date":"2019-09-02","ids":{"openalex":"https://openalex.org/W2972236101","doi":"https://doi.org/10.1109/tim.2019.2937425","mag":"2972236101"},"language":"en","primary_location":{"id":"doi:10.1109/tim.2019.2937425","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2019.2937425","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5047599213","display_name":"Zhanghua Cai","orcid":null},"institutions":[{"id":"https://openalex.org/I16609230","display_name":"Hunan University","ror":"https://ror.org/05htk5m33","country_code":"CN","type":"education","lineage":["https://openalex.org/I16609230"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Zhanghua Cai","raw_affiliation_strings":["School of Electrical and Information Engineering, Hunan University, Changsha, China"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Information Engineering, Hunan University, Changsha, China","institution_ids":["https://openalex.org/I16609230"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101547454","display_name":"Yantao Zhou","orcid":"https://orcid.org/0000-0002-8654-4417"},"institutions":[{"id":"https://openalex.org/I16609230","display_name":"Hunan University","ror":"https://ror.org/05htk5m33","country_code":"CN","type":"education","lineage":["https://openalex.org/I16609230"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yantao Zhou","raw_affiliation_strings":["School of Electrical and Information Engineering, Hunan University, Changsha, China"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Information Engineering, Hunan University, Changsha, China","institution_ids":["https://openalex.org/I16609230"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103115005","display_name":"Lie Liu","orcid":"https://orcid.org/0000-0002-2428-5827"},"institutions":[{"id":"https://openalex.org/I16609230","display_name":"Hunan University","ror":"https://ror.org/05htk5m33","country_code":"CN","type":"education","lineage":["https://openalex.org/I16609230"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Lie Liu","raw_affiliation_strings":["General Test Systems Inc., Shenzhen, China","School of Electrical and Information Engineering, Hunan University, Changsha, China"],"affiliations":[{"raw_affiliation_string":"General Test Systems Inc., Shenzhen, China","institution_ids":[]},{"raw_affiliation_string":"School of Electrical and Information Engineering, Hunan University, Changsha, China","institution_ids":["https://openalex.org/I16609230"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046347508","display_name":"Yihong Qi","orcid":"https://orcid.org/0000-0003-0564-5046"},"institutions":[{"id":"https://openalex.org/I16609230","display_name":"Hunan University","ror":"https://ror.org/05htk5m33","country_code":"CN","type":"education","lineage":["https://openalex.org/I16609230"]},{"id":"https://openalex.org/I20382870","display_name":"Missouri University of Science and Technology","ror":"https://ror.org/00scwqd12","country_code":"US","type":"education","lineage":["https://openalex.org/I20382870"]}],"countries":["CN","US"],"is_corresponding":false,"raw_author_name":"Yihong Qi","raw_affiliation_strings":["EMC Laboratory, Missouri University of Science and Technology, Rolla, USA","General Test Systems Inc., Shenzhen, China","School of Electrical and Information Engineering, Hunan University, Changsha, China"],"affiliations":[{"raw_affiliation_string":"EMC Laboratory, Missouri University of Science and Technology, Rolla, USA","institution_ids":["https://openalex.org/I20382870"]},{"raw_affiliation_string":"General Test Systems Inc., Shenzhen, China","institution_ids":[]},{"raw_affiliation_string":"School of Electrical and Information Engineering, Hunan University, Changsha, China","institution_ids":["https://openalex.org/I16609230"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101428889","display_name":"Wei Yu","orcid":"https://orcid.org/0000-0002-6882-0043"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Wei Yu","raw_affiliation_strings":["General Test Systems Inc., Shenzhen, China"],"affiliations":[{"raw_affiliation_string":"General Test Systems Inc., Shenzhen, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100761733","display_name":"Jun Fan","orcid":"https://orcid.org/0000-0001-5674-033X"},"institutions":[{"id":"https://openalex.org/I20382870","display_name":"Missouri University of Science and Technology","ror":"https://ror.org/00scwqd12","country_code":"US","type":"education","lineage":["https://openalex.org/I20382870"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jun Fan","raw_affiliation_strings":["EMC Laboratory, Missouri University of Science and Technology, Rolla, USA"],"affiliations":[{"raw_affiliation_string":"EMC Laboratory, Missouri University of Science and Technology, Rolla, USA","institution_ids":["https://openalex.org/I20382870"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077382023","display_name":"Ming Yu","orcid":"https://orcid.org/0000-0002-9678-2347"},"institutions":[{"id":"https://openalex.org/I177725633","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48","country_code":"CN","type":"education","lineage":["https://openalex.org/I177725633"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ming Yu","raw_affiliation_strings":["The Chinese University of Hong Kong, Hong Kong"],"affiliations":[{"raw_affiliation_string":"The Chinese University of Hong Kong, Hong Kong","institution_ids":["https://openalex.org/I177725633"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5015801840","display_name":"Qingchun Luo","orcid":"https://orcid.org/0000-0003-2961-3276"},"institutions":[{"id":"https://openalex.org/I16609230","display_name":"Hunan University","ror":"https://ror.org/05htk5m33","country_code":"CN","type":"education","lineage":["https://openalex.org/I16609230"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qingchun Luo","raw_affiliation_strings":["General Test Systems Inc., Shenzhen, China","School of Electrical and Information Engineering, Hunan University, Changsha, China"],"affiliations":[{"raw_affiliation_string":"General Test Systems Inc., Shenzhen, China","institution_ids":[]},{"raw_affiliation_string":"School of Electrical and Information Engineering, Hunan University, Changsha, China","institution_ids":["https://openalex.org/I16609230"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":8,"corresponding_author_ids":["https://openalex.org/A5047599213"],"corresponding_institution_ids":["https://openalex.org/I16609230"],"apc_list":null,"apc_paid":null,"fwci":1.3112,"has_fulltext":false,"cited_by_count":15,"citation_normalized_percentile":{"value":0.78514364,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":93,"max":99},"biblio":{"volume":"69","issue":"6","first_page":"3377","last_page":"3387"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12371","display_name":"Electrical Contact Performance and Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12371","display_name":"Electrical Contact Performance and Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12791","display_name":"Full-Duplex Wireless Communications","score":0.9948999881744385,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10986","display_name":"RFID technology advancements","score":0.9872999787330627,"subfield":{"id":"https://openalex.org/subfields/2214","display_name":"Media Technology"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/anechoic-chamber","display_name":"Anechoic chamber","score":0.9388630986213684},{"id":"https://openalex.org/keywords/enclosure","display_name":"Enclosure","score":0.7340865731239319},{"id":"https://openalex.org/keywords/electromagnetic-shielding","display_name":"Electromagnetic shielding","score":0.7075005769729614},{"id":"https://openalex.org/keywords/intermodulation","display_name":"Intermodulation","score":0.6039754152297974},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.5336578488349915},{"id":"https://openalex.org/keywords/reflection","display_name":"Reflection (computer programming)","score":0.4916084408760071},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4821174144744873},{"id":"https://openalex.org/keywords/electromagnetic-compatibility","display_name":"Electromagnetic compatibility","score":0.4804781973361969},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.4746730327606201},{"id":"https://openalex.org/keywords/device-under-test","display_name":"Device under test","score":0.43885260820388794},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.40600383281707764},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.27367258071899414},{"id":"https://openalex.org/keywords/scattering-parameters","display_name":"Scattering parameters","score":0.2363879680633545},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.15047991275787354}],"concepts":[{"id":"https://openalex.org/C149712133","wikidata":"https://www.wikidata.org/wiki/Q332774","display_name":"Anechoic chamber","level":2,"score":0.9388630986213684},{"id":"https://openalex.org/C98375054","wikidata":"https://www.wikidata.org/wiki/Q442709","display_name":"Enclosure","level":2,"score":0.7340865731239319},{"id":"https://openalex.org/C2265751","wikidata":"https://www.wikidata.org/wiki/Q332007","display_name":"Electromagnetic shielding","level":2,"score":0.7075005769729614},{"id":"https://openalex.org/C11773624","wikidata":"https://www.wikidata.org/wiki/Q2142232","display_name":"Intermodulation","level":4,"score":0.6039754152297974},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.5336578488349915},{"id":"https://openalex.org/C65682993","wikidata":"https://www.wikidata.org/wiki/Q1056451","display_name":"Reflection (computer programming)","level":2,"score":0.4916084408760071},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4821174144744873},{"id":"https://openalex.org/C125470083","wikidata":"https://www.wikidata.org/wiki/Q747288","display_name":"Electromagnetic compatibility","level":2,"score":0.4804781973361969},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4746730327606201},{"id":"https://openalex.org/C76249512","wikidata":"https://www.wikidata.org/wiki/Q1206780","display_name":"Device under test","level":3,"score":0.43885260820388794},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.40600383281707764},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.27367258071899414},{"id":"https://openalex.org/C195266298","wikidata":"https://www.wikidata.org/wiki/Q2165620","display_name":"Scattering parameters","level":2,"score":0.2363879680633545},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.15047991275787354},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C194257627","wikidata":"https://www.wikidata.org/wiki/Q211554","display_name":"Amplifier","level":3,"score":0.0},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tim.2019.2937425","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2019.2937425","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G1907133024","display_name":null,"funder_award_id":"61671203","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":41,"referenced_works":["https://openalex.org/W1999666083","https://openalex.org/W2027980693","https://openalex.org/W2060507758","https://openalex.org/W2067198265","https://openalex.org/W2109436221","https://openalex.org/W2118605288","https://openalex.org/W2129692328","https://openalex.org/W2136094024","https://openalex.org/W2139822749","https://openalex.org/W2142914411","https://openalex.org/W2150594630","https://openalex.org/W2151310819","https://openalex.org/W2168123403","https://openalex.org/W2271656190","https://openalex.org/W2588488768","https://openalex.org/W2589080589","https://openalex.org/W2605535526","https://openalex.org/W2609085385","https://openalex.org/W2619860584","https://openalex.org/W2726191914","https://openalex.org/W2738909342","https://openalex.org/W2742430019","https://openalex.org/W2777143399","https://openalex.org/W2779095736","https://openalex.org/W2781583183","https://openalex.org/W2790874631","https://openalex.org/W2790990037","https://openalex.org/W2792287503","https://openalex.org/W2792690385","https://openalex.org/W2806019881","https://openalex.org/W2845419609","https://openalex.org/W2891239067","https://openalex.org/W2902111434","https://openalex.org/W2903706966","https://openalex.org/W2909606073","https://openalex.org/W2911710134","https://openalex.org/W2919488268","https://openalex.org/W2989296735","https://openalex.org/W3012389650","https://openalex.org/W4285719527","https://openalex.org/W6694287628"],"related_works":["https://openalex.org/W2147869365","https://openalex.org/W2553711295","https://openalex.org/W2295662009","https://openalex.org/W2810737917","https://openalex.org/W2989296735","https://openalex.org/W2157476128","https://openalex.org/W2046695975","https://openalex.org/W4360901062","https://openalex.org/W2545165592","https://openalex.org/W2972236101"],"abstract_inverted_index":{"A":[0],"design":[1,94,115,177,204,216],"method":[2,82],"is":[3,43,92,122],"proposed":[4],"in":[5,74,100],"this":[6,111,150],"article":[7],"for":[8,154],"on-line":[9,155],"(online":[10],"measurement:":[11,19],"measurement":[12,20,27,56,91,219],"when":[13,21],"producing":[14],"devices)":[15,23],"and":[16,49,77,156,166,193],"on-site":[17,157],"(on-site":[18],"using":[22,149],"passive":[24],"intermodulation":[25],"(PIM)":[26],"with":[28,170],"a":[29,34,95],"small-size":[30],"anechoic":[31,41,132],"chamber.":[32,141],"In":[33,110],"PIM":[35,68,90,97,105,119,127,158,173,187,208,218],"measurement,":[36],"the":[37,62,72,85,104,118,126,131,137,140,146,162,181,186,195,199,203,215,225],"role":[38],"of":[39,87,117,130,135,139,198],"an":[40,54,113],"chamber":[42,63,88,99,121,133,147,200],"to":[44,71,83,89,93,102,190,213,223],"shield":[45],"extraneous":[46],"electromagnetic":[47],"signal":[48],"reduce":[50,103,145],"reflection,":[51],"so":[52],"that":[53,201],"accurate":[55],"result":[57],"can":[58,143],"be":[59],"obtained.":[60],"However,":[61],"itself":[64],"may":[65],"introduce":[66],"new":[67],"sources":[69],"due":[70,189],"nonlinearity":[73],"absorbing":[75,164],"material":[76,165],"shielding":[78,167],"enclosure.":[79],"The":[80,176],"traditional":[81],"lower":[84],"influence":[86],"large-size":[96],"test":[98,120,209],"order":[101],"level":[106,129,188],"by":[107,124],"path":[108],"loss.":[109],"article,":[112],"innovative":[114],"concept":[116,178],"presented":[123],"controlling":[125],"source":[128],"instead":[134],"increasing":[136],"size":[138,148,197],"It":[142],"significantly":[144],"method,":[151],"particularly":[152],"suitable":[153],"measurement.":[159],"To":[160],"implement":[161],"concept,":[163],"enclosure":[168],"structure":[169],"extremely":[171],"low":[172],"are":[174,211,221],"developed.":[175],"includes":[179],"defining":[180],"worst-case":[182],"reflection":[183],"level,":[184],"estimating":[185],"reflected":[191],"signals,":[192],"determining":[194],"smallest":[196],"meets":[202],"specifications.":[205],"Finally,":[206],"two":[207],"chambers":[210],"built":[212],"demonstrate":[214],"concept.":[217],"results":[220],"given":[222],"verify":[224],"theoretical":[226],"analysis.":[227]},"counts_by_year":[{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":3},{"year":2022,"cited_by_count":7},{"year":2021,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}