{"id":"https://openalex.org/W2139214030","doi":"https://doi.org/10.1109/tim.2011.2134670","title":"Novel Testing Instrument for Lead-Free Solder Characterization","display_name":"Novel Testing Instrument for Lead-Free Solder Characterization","publication_year":2011,"publication_date":"2011-05-13","ids":{"openalex":"https://openalex.org/W2139214030","doi":"https://doi.org/10.1109/tim.2011.2134670","mag":"2139214030"},"language":"en","primary_location":{"id":"doi:10.1109/tim.2011.2134670","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2011.2134670","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5005956995","display_name":"D. Di Maio","orcid":null},"institutions":[{"id":"https://openalex.org/I134421475","display_name":"National Physical Laboratory","ror":"https://ror.org/015w2mp89","country_code":"GB","type":"facility","lineage":["https://openalex.org/I134421475"]}],"countries":["GB"],"is_corresponding":true,"raw_author_name":"D. Di Maio","raw_affiliation_strings":["National Physical Laboratory, Teddington, UK","Nat. Phys. Lab., Teddington, UK"],"affiliations":[{"raw_affiliation_string":"National Physical Laboratory, Teddington, UK","institution_ids":["https://openalex.org/I134421475"]},{"raw_affiliation_string":"Nat. Phys. Lab., Teddington, UK","institution_ids":["https://openalex.org/I134421475"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013120174","display_name":"Owen Thomas","orcid":null},"institutions":[{"id":"https://openalex.org/I134421475","display_name":"National Physical Laboratory","ror":"https://ror.org/015w2mp89","country_code":"GB","type":"facility","lineage":["https://openalex.org/I134421475"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"O. Thomas","raw_affiliation_strings":["National Physical Laboratory, Teddington, UK","Nat. Phys. Lab., Teddington, UK"],"affiliations":[{"raw_affiliation_string":"National Physical Laboratory, Teddington, UK","institution_ids":["https://openalex.org/I134421475"]},{"raw_affiliation_string":"Nat. Phys. Lab., Teddington, UK","institution_ids":["https://openalex.org/I134421475"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060598324","display_name":"M Dusek","orcid":null},"institutions":[{"id":"https://openalex.org/I134421475","display_name":"National Physical Laboratory","ror":"https://ror.org/015w2mp89","country_code":"GB","type":"facility","lineage":["https://openalex.org/I134421475"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"M. Dusek","raw_affiliation_strings":["National Physical Laboratory, Teddington, UK","Nat. Phys. Lab., Teddington, UK"],"affiliations":[{"raw_affiliation_string":"National Physical Laboratory, Teddington, UK","institution_ids":["https://openalex.org/I134421475"]},{"raw_affiliation_string":"Nat. Phys. Lab., Teddington, UK","institution_ids":["https://openalex.org/I134421475"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5102787351","display_name":"Christopher G. Hunt","orcid":"https://orcid.org/0000-0002-4799-7085"},"institutions":[{"id":"https://openalex.org/I134421475","display_name":"National Physical Laboratory","ror":"https://ror.org/015w2mp89","country_code":"GB","type":"facility","lineage":["https://openalex.org/I134421475"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"C. Hunt","raw_affiliation_strings":["National Physical Laboratory, Teddington, UK","Nat. Phys. Lab., Teddington, UK"],"affiliations":[{"raw_affiliation_string":"National Physical Laboratory, Teddington, UK","institution_ids":["https://openalex.org/I134421475"]},{"raw_affiliation_string":"Nat. Phys. Lab., Teddington, UK","institution_ids":["https://openalex.org/I134421475"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5005956995"],"corresponding_institution_ids":["https://openalex.org/I134421475"],"apc_list":null,"apc_paid":null,"fwci":0.7949,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":{"value":0.76969416,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"60","issue":"10","first_page":"3444","last_page":"3450"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9958000183105469,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.8582905530929565},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7219913601875305},{"id":"https://openalex.org/keywords/creep","display_name":"Creep","score":0.5518593788146973},{"id":"https://openalex.org/keywords/temperature-cycling","display_name":"Temperature cycling","score":0.5217379331588745},{"id":"https://openalex.org/keywords/digital-image-correlation","display_name":"Digital image correlation","score":0.4455462694168091},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.43414217233657837},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"Electronic packaging","score":0.4146963059902191},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.3628993034362793},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3470029830932617},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.34363359212875366},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.25401586294174194},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1329340934753418},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.11927953362464905}],"concepts":[{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.8582905530929565},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7219913601875305},{"id":"https://openalex.org/C149912024","wikidata":"https://www.wikidata.org/wiki/Q462188","display_name":"Creep","level":2,"score":0.5518593788146973},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.5217379331588745},{"id":"https://openalex.org/C115635565","wikidata":"https://www.wikidata.org/wiki/Q860900","display_name":"Digital image correlation","level":2,"score":0.4455462694168091},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.43414217233657837},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.4146963059902191},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3628993034362793},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3470029830932617},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.34363359212875366},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.25401586294174194},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1329340934753418},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.11927953362464905},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tim.2011.2134670","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tim.2011.2134670","pdf_url":null,"source":{"id":"https://openalex.org/S10892749","display_name":"IEEE Transactions on Instrumentation and Measurement","issn_l":"0018-9456","issn":["0018-9456","1557-9662"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Instrumentation and Measurement","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320322897","display_name":"Department for Business, Innovation and Skills","ror":"https://ror.org/019ya6433"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":38,"referenced_works":["https://openalex.org/W653791981","https://openalex.org/W771912474","https://openalex.org/W1602919844","https://openalex.org/W1974390424","https://openalex.org/W1975297983","https://openalex.org/W1992579178","https://openalex.org/W1992729845","https://openalex.org/W1993661304","https://openalex.org/W1997878566","https://openalex.org/W2004425845","https://openalex.org/W2006438184","https://openalex.org/W2011637070","https://openalex.org/W2011666675","https://openalex.org/W2014207470","https://openalex.org/W2016201835","https://openalex.org/W2016510711","https://openalex.org/W2029515162","https://openalex.org/W2030861195","https://openalex.org/W2042875002","https://openalex.org/W2049262320","https://openalex.org/W2053025267","https://openalex.org/W2069165073","https://openalex.org/W2075482958","https://openalex.org/W2076212318","https://openalex.org/W2081089797","https://openalex.org/W2086753069","https://openalex.org/W2113397339","https://openalex.org/W2121833465","https://openalex.org/W2125103169","https://openalex.org/W2132784634","https://openalex.org/W2136315060","https://openalex.org/W2149711130","https://openalex.org/W2153993485","https://openalex.org/W2171087122","https://openalex.org/W2288306815","https://openalex.org/W2496416454","https://openalex.org/W6654186940","https://openalex.org/W6959955217"],"related_works":["https://openalex.org/W1634269331","https://openalex.org/W2041333522","https://openalex.org/W101095401","https://openalex.org/W2151533009","https://openalex.org/W3191141382","https://openalex.org/W2353288894","https://openalex.org/W2080643270","https://openalex.org/W2054726112","https://openalex.org/W4321495614","https://openalex.org/W2093622851"],"abstract_inverted_index":{"The":[0,52,150,208],"European":[1],"Union":[2],"Restriction":[3],"of":[4,8,14,31,54,63,69,84,125,212,223],"Hazardous":[5],"Substances":[6],"Directive":[7],"2006":[9],"has":[10,21],"revolutionized":[11],"the":[12,37,44,61,67,82,95,122,159,179],"use":[13,62],"materials":[15],"for":[16,41,49,65,177,234],"electronic":[17],"packaging:":[18],"tin\u2013lead":[19,42],"solder":[20,85,109,224],"had":[22],"to":[23,140,200],"be":[24,47,175],"replaced":[25],"with":[26],"lead-free":[27,50,70],"solder.":[28,51,71],"While":[29],"years":[30],"experience":[32],"and":[33,113,173,183,204,217,219,236],"data":[34,55,98],"acquired":[35,97],"in":[36,87,115],"field":[38],"are":[39,171,231],"available":[40],"solder,":[43],"same":[45],"cannot":[46],"said":[48],"lack":[53],"on":[56,143],"these":[57],"new":[58,76,229],"alloys":[59],"hinders":[60],"modeling":[64],"predicting":[66],"reliability":[68],"This":[72,117],"paper":[73],"describes":[74],"a":[75,88,104,107,126,131,135,156],"testing":[77],"machine":[78],"that":[79,137,141],"can":[80,174,198],"assess":[81],"properties":[83],"joints":[86],"copper\u2013solder\u2013copper":[89],"structure.":[90],"Finite-element":[91],"analysis":[92],"models":[93],"using":[94,155],"newly":[96],"will":[99],"improve":[100],"lifetime":[101],"predictions.":[102],"During":[103],"typical":[105],"test,":[106],"model":[108],"joint":[110],"is":[111,119,138,153,162,210],"expanded":[112],"contracted":[114],"shear.":[116],"actuation":[118],"achieved":[120],"from":[121,164,227],"thermal":[123,237],"expansion":[124],"steel":[127],"tube,":[128],"which":[129,193],"provides":[130],"smooth":[132],"movement":[133],"at":[134],"rate":[136],"equivalent":[139],"encountered":[142],"printed":[144],"circuit":[145],"boards":[146],"when":[147],"thermally":[148],"stressed.":[149],"applied":[151],"force":[152],"measured":[154],"load":[157],"cell;":[158],"sample":[160],"displacement":[161,166],"determined":[163],"laser":[165],"sensors.":[167],"Hysteresis":[168],"load\u2013displacement":[169],"loops":[170],"obtained":[172],"used":[176],"evaluating":[178],"material":[180],"plastic":[181],"response":[182],"loading":[184],"history.":[185],"A":[186],"camera/microscope":[187],"system":[188],"captures":[189],"time-lapse":[190],"photography":[191],"images,":[192],"digital":[194],"image":[195],"correlation":[196],"software":[197],"analyze":[199],"obtain":[201],"strain":[202],"profiles":[203],"study":[205],"crack":[206],"propagation.":[207],"instrument":[209,230],"capable":[211],"investigating":[213],"creep,":[214],"stress":[215],"relaxation,":[216],"isothermal":[218,235],"thermal\u2013mechanical":[220],"fatigue":[221,239],"behavior":[222],"interconnects.":[225],"Results":[226],"this":[228],"presented":[232],"here":[233],"cycling":[238],"tests.":[240]},"counts_by_year":[{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":2},{"year":2019,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}