{"id":"https://openalex.org/W2075047657","doi":"https://doi.org/10.1109/tii.2014.2309482","title":"Multisensor Fusion System for Monitoring High-Power Disk Laser Welding Using Support Vector Machine","display_name":"Multisensor Fusion System for Monitoring High-Power Disk Laser Welding Using Support Vector Machine","publication_year":2014,"publication_date":"2014-03-03","ids":{"openalex":"https://openalex.org/W2075047657","doi":"https://doi.org/10.1109/tii.2014.2309482","mag":"2075047657"},"language":"en","primary_location":{"id":"doi:10.1109/tii.2014.2309482","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tii.2014.2309482","pdf_url":null,"source":{"id":"https://openalex.org/S184777250","display_name":"IEEE Transactions on Industrial Informatics","issn_l":"1551-3203","issn":["1551-3203","1941-0050"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Industrial Informatics","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5048900159","display_name":"Deyong You","orcid":null},"institutions":[{"id":"https://openalex.org/I139024713","display_name":"Guangdong University of Technology","ror":"https://ror.org/04azbjn80","country_code":"CN","type":"education","lineage":["https://openalex.org/I139024713"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Deyong You","raw_affiliation_strings":["School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou, China","Sch. of Electromech. Eng., Guangdong Univ. of Technol., Guangzhou, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou, China","institution_ids":["https://openalex.org/I139024713"]},{"raw_affiliation_string":"Sch. of Electromech. Eng., Guangdong Univ. of Technol., Guangzhou, China","institution_ids":["https://openalex.org/I139024713"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033024404","display_name":"Xiangdong Gao","orcid":"https://orcid.org/0000-0001-8696-5337"},"institutions":[{"id":"https://openalex.org/I139024713","display_name":"Guangdong University of Technology","ror":"https://ror.org/04azbjn80","country_code":"CN","type":"education","lineage":["https://openalex.org/I139024713"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiangdong Gao","raw_affiliation_strings":["School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou, China","Sch. of Electromech. Eng., Guangdong Univ. of Technol., Guangzhou, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou, China","institution_ids":["https://openalex.org/I139024713"]},{"raw_affiliation_string":"Sch. of Electromech. Eng., Guangdong Univ. of Technol., Guangzhou, China","institution_ids":["https://openalex.org/I139024713"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110728738","display_name":"Seiji Katayama","orcid":null},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"Osaka University","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Seiji Katayama","raw_affiliation_strings":["Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka, Japan","Joining and Welding Research Institute, Osaka University, Ibaraki, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka, Japan","institution_ids":["https://openalex.org/I98285908"]},{"raw_affiliation_string":"Joining and Welding Research Institute, Osaka University, Ibaraki, Japan","institution_ids":["https://openalex.org/I98285908"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5048900159"],"corresponding_institution_ids":["https://openalex.org/I139024713"],"apc_list":null,"apc_paid":null,"fwci":8.1882,"has_fulltext":false,"cited_by_count":111,"citation_normalized_percentile":{"value":0.97799893,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":100},"biblio":{"volume":"10","issue":"2","first_page":"1285","last_page":"1295"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11856","display_name":"Thermography and Photoacoustic Techniques","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9955999851226807,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/support-vector-machine","display_name":"Support vector machine","score":0.6994627714157104},{"id":"https://openalex.org/keywords/photodiode","display_name":"Photodiode","score":0.6808732151985168},{"id":"https://openalex.org/keywords/welding","display_name":"Welding","score":0.6709456443786621},{"id":"https://openalex.org/keywords/disk-laser","display_name":"Disk laser","score":0.582403838634491},{"id":"https://openalex.org/keywords/laser-beam-welding","display_name":"Laser beam welding","score":0.5744940638542175},{"id":"https://openalex.org/keywords/laser","display_name":"Laser","score":0.552011251449585},{"id":"https://openalex.org/keywords/sensor-fusion","display_name":"Sensor fusion","score":0.5234379768371582},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.4696202576160431},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.45864182710647583},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.42810195684432983},{"id":"https://openalex.org/keywords/computer-vision","display_name":"Computer vision","score":0.4264480173587799},{"id":"https://openalex.org/keywords/fusion-welding","display_name":"Fusion welding","score":0.41814157366752625},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3873424232006073},{"id":"https://openalex.org/keywords/laser-power-scaling","display_name":"Laser power scaling","score":0.34920650720596313},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.28249767422676086},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.2793236970901489},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.2699534595012665},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.13712164759635925},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.0805300772190094}],"concepts":[{"id":"https://openalex.org/C12267149","wikidata":"https://www.wikidata.org/wiki/Q282453","display_name":"Support vector machine","level":2,"score":0.6994627714157104},{"id":"https://openalex.org/C751236","wikidata":"https://www.wikidata.org/wiki/Q175943","display_name":"Photodiode","level":2,"score":0.6808732151985168},{"id":"https://openalex.org/C19474535","wikidata":"https://www.wikidata.org/wiki/Q131172","display_name":"Welding","level":2,"score":0.6709456443786621},{"id":"https://openalex.org/C2779199891","wikidata":"https://www.wikidata.org/wiki/Q370593","display_name":"Disk laser","level":4,"score":0.582403838634491},{"id":"https://openalex.org/C89344249","wikidata":"https://www.wikidata.org/wiki/Q937468","display_name":"Laser beam welding","level":3,"score":0.5744940638542175},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.552011251449585},{"id":"https://openalex.org/C33954974","wikidata":"https://www.wikidata.org/wiki/Q486494","display_name":"Sensor fusion","level":2,"score":0.5234379768371582},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.4696202576160431},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.45864182710647583},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.42810195684432983},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.4264480173587799},{"id":"https://openalex.org/C169312260","wikidata":"https://www.wikidata.org/wiki/Q1585171","display_name":"Fusion welding","level":3,"score":0.41814157366752625},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3873424232006073},{"id":"https://openalex.org/C200649887","wikidata":"https://www.wikidata.org/wiki/Q17154544","display_name":"Laser power scaling","level":3,"score":0.34920650720596313},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.28249767422676086},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.2793236970901489},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.2699534595012665},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.13712164759635925},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0805300772190094},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tii.2014.2309482","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tii.2014.2309482","pdf_url":null,"source":{"id":"https://openalex.org/S184777250","display_name":"IEEE Transactions on Industrial Informatics","issn_l":"1551-3203","issn":["1551-3203","1941-0050"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Industrial Informatics","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":32,"referenced_works":["https://openalex.org/W1964837411","https://openalex.org/W1972468967","https://openalex.org/W1973260008","https://openalex.org/W1975428394","https://openalex.org/W1977455514","https://openalex.org/W1980542474","https://openalex.org/W1988411121","https://openalex.org/W2006322444","https://openalex.org/W2012856575","https://openalex.org/W2015309028","https://openalex.org/W2027313320","https://openalex.org/W2027382715","https://openalex.org/W2032743230","https://openalex.org/W2059208592","https://openalex.org/W2062002220","https://openalex.org/W2063110709","https://openalex.org/W2073204630","https://openalex.org/W2085962005","https://openalex.org/W2089545891","https://openalex.org/W2113543997","https://openalex.org/W2113706146","https://openalex.org/W2118354411","https://openalex.org/W2119821739","https://openalex.org/W2133282191","https://openalex.org/W2138248406","https://openalex.org/W2141339768","https://openalex.org/W2153578100","https://openalex.org/W2169071075","https://openalex.org/W2337679238","https://openalex.org/W2897984729","https://openalex.org/W3110976043","https://openalex.org/W4239510810"],"related_works":["https://openalex.org/W1979776737","https://openalex.org/W4317932481","https://openalex.org/W2103418990","https://openalex.org/W2341124311","https://openalex.org/W2050857589","https://openalex.org/W114105385","https://openalex.org/W4390927650","https://openalex.org/W3021549195","https://openalex.org/W1485675574","https://openalex.org/W4390232637"],"abstract_inverted_index":{"In":[0],"order":[1],"to":[2,21,136],"optimize":[3],"the":[4,42,75,78,91,97,100,110,125,143],"productivity":[5],"of":[6,44,77,81,90,112],"industrial":[7],"manufacturing,":[8],"a":[9,118],"multisensor":[10],"fusion":[11],"system":[12],"based":[13,70],"on":[14,71,124],"support":[15],"vector":[16],"machine":[17],"(SVM)":[18],"was":[19,49],"researched":[20],"monitor":[22],"and":[23,57,63,66,84,87,114,121],"identify":[24],"weld":[25],"defects":[26,141],"during":[27],"high-power":[28],"disk":[29],"laser":[30,52,126,144],"welding.":[31],"Three":[32],"different":[33],"sensing":[34,40,60,69,116],"technologies":[35],"were":[36,94],"integrated:":[37],"1)":[38],"photodiode":[39,113],"for":[41,61,74,103,139],"monitoring":[43,76],"visible":[45,58],"light":[46],"radiation,":[47],"which":[48],"generated":[50],"from":[51,96],"focus":[53],"position;":[54],"2)":[55],"ultraviolet":[56],"(UVV)":[59],"plume":[62],"molten":[64,82],"pool;":[65],"3)":[67],"visual":[68,115],"auxiliary":[72],"illumination":[73],"dynamic":[79],"behavior":[80],"pool":[83],"keyhole.":[85],"Time":[86],"frequency":[88],"domains":[89],"features":[92],"that":[93,109],"extracted":[95],"sensors":[98],"constituted":[99],"eigenvector":[101],"used":[102],"SVM":[104],"classification.":[105],"Experimental":[106],"results":[107],"showed":[108],"integration":[111],"provided":[117],"more":[119],"accurate":[120],"comprehensive":[122],"estimation":[123],"welding":[127,145],"process.":[128,146],"The":[129],"proposed":[130],"SVM-based":[131],"approach":[132],"has":[133],"been":[134],"proven":[135],"be":[137],"efficient":[138],"inspecting":[140],"in":[142]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":10},{"year":2024,"cited_by_count":10},{"year":2023,"cited_by_count":8},{"year":2022,"cited_by_count":8},{"year":2021,"cited_by_count":9},{"year":2020,"cited_by_count":16},{"year":2019,"cited_by_count":17},{"year":2018,"cited_by_count":10},{"year":2017,"cited_by_count":6},{"year":2016,"cited_by_count":6},{"year":2015,"cited_by_count":9},{"year":2014,"cited_by_count":1}],"updated_date":"2026-05-15T08:27:34.491423","created_date":"2025-10-10T00:00:00"}