{"id":"https://openalex.org/W2960240560","doi":"https://doi.org/10.1109/tifs.2019.2928493","title":"End-to-End Traceability of ICs in Component Supply Chain for Fighting Against Recycling","display_name":"End-to-End Traceability of ICs in Component Supply Chain for Fighting Against Recycling","publication_year":2019,"publication_date":"2019-07-12","ids":{"openalex":"https://openalex.org/W2960240560","doi":"https://doi.org/10.1109/tifs.2019.2928493","mag":"2960240560"},"language":"en","primary_location":{"id":"doi:10.1109/tifs.2019.2928493","is_oa":true,"landing_page_url":"https://doi.org/10.1109/tifs.2019.2928493","pdf_url":null,"source":{"id":"https://openalex.org/S61310614","display_name":"IEEE Transactions on Information Forensics and Security","issn_l":"1556-6013","issn":["1556-6013","1556-6021"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Information Forensics and Security","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"hybrid","oa_url":"https://doi.org/10.1109/tifs.2019.2928493","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5025490572","display_name":"Yuqiao Zhang","orcid":"https://orcid.org/0000-0001-7579-4923"},"institutions":[{"id":"https://openalex.org/I82497590","display_name":"Auburn University","ror":"https://ror.org/02v80fc35","country_code":"US","type":"education","lineage":["https://openalex.org/I82497590"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yuqiao Zhang","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Auburn University, Auburn, AL, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Auburn University, Auburn, AL, USA","institution_ids":["https://openalex.org/I82497590"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5079601863","display_name":"Ujjwal Guin","orcid":"https://orcid.org/0000-0002-4819-8728"},"institutions":[{"id":"https://openalex.org/I82497590","display_name":"Auburn University","ror":"https://ror.org/02v80fc35","country_code":"US","type":"education","lineage":["https://openalex.org/I82497590"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ujjwal Guin","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Auburn University, Auburn, AL, USA"],"raw_orcid":"https://orcid.org/0000-0002-4819-8728","affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Auburn University, Auburn, AL, USA","institution_ids":["https://openalex.org/I82497590"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I82497590"],"apc_list":null,"apc_paid":null,"fwci":4.5488,"has_fulltext":false,"cited_by_count":42,"citation_normalized_percentile":{"value":0.95436455,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":99},"biblio":{"volume":"15","issue":null,"first_page":"767","last_page":"775"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12122","display_name":"Physical Unclonable Functions (PUFs) and Hardware Security","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12122","display_name":"Physical Unclonable Functions (PUFs) and Hardware Security","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9736999869346619,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12017","display_name":"Recycling and Waste Management Techniques","score":0.972100019454956,"subfield":{"id":"https://openalex.org/subfields/2311","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/23","display_name":"Environmental Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/traceability","display_name":"Traceability","score":0.9400033354759216},{"id":"https://openalex.org/keywords/supply-chain","display_name":"Supply chain","score":0.8271263241767883},{"id":"https://openalex.org/keywords/integrator","display_name":"Integrator","score":0.6053090691566467},{"id":"https://openalex.org/keywords/component","display_name":"Component (thermodynamics)","score":0.5949426889419556},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5799113512039185},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5501039624214172},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5059008002281189},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4906965494155884},{"id":"https://openalex.org/keywords/electronic-component","display_name":"Electronic component","score":0.4827825129032135},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4804810583591461},{"id":"https://openalex.org/keywords/radio-frequency-identification","display_name":"Radio-frequency identification","score":0.4757675528526306},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.3976832330226898},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.302994966506958},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.2107488512992859},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.19137120246887207},{"id":"https://openalex.org/keywords/computer-security","display_name":"Computer security","score":0.17465165257453918},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1435619294643402},{"id":"https://openalex.org/keywords/business","display_name":"Business","score":0.14034000039100647},{"id":"https://openalex.org/keywords/software-engineering","display_name":"Software engineering","score":0.10940462350845337},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.106681227684021}],"concepts":[{"id":"https://openalex.org/C153876917","wikidata":"https://www.wikidata.org/wiki/Q899704","display_name":"Traceability","level":2,"score":0.9400033354759216},{"id":"https://openalex.org/C108713360","wikidata":"https://www.wikidata.org/wiki/Q1824206","display_name":"Supply chain","level":2,"score":0.8271263241767883},{"id":"https://openalex.org/C79518650","wikidata":"https://www.wikidata.org/wiki/Q2081431","display_name":"Integrator","level":3,"score":0.6053090691566467},{"id":"https://openalex.org/C168167062","wikidata":"https://www.wikidata.org/wiki/Q1117970","display_name":"Component (thermodynamics)","level":2,"score":0.5949426889419556},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5799113512039185},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5501039624214172},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5059008002281189},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4906965494155884},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.4827825129032135},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4804810583591461},{"id":"https://openalex.org/C204222849","wikidata":"https://www.wikidata.org/wiki/Q104954","display_name":"Radio-frequency identification","level":2,"score":0.4757675528526306},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3976832330226898},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.302994966506958},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.2107488512992859},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.19137120246887207},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.17465165257453918},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1435619294643402},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.14034000039100647},{"id":"https://openalex.org/C115903868","wikidata":"https://www.wikidata.org/wiki/Q80993","display_name":"Software engineering","level":1,"score":0.10940462350845337},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.106681227684021},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C162853370","wikidata":"https://www.wikidata.org/wiki/Q39809","display_name":"Marketing","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tifs.2019.2928493","is_oa":true,"landing_page_url":"https://doi.org/10.1109/tifs.2019.2928493","pdf_url":null,"source":{"id":"https://openalex.org/S61310614","display_name":"IEEE Transactions on Information Forensics and Security","issn_l":"1556-6013","issn":["1556-6013","1556-6021"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Information Forensics and Security","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1109/tifs.2019.2928493","is_oa":true,"landing_page_url":"https://doi.org/10.1109/tifs.2019.2928493","pdf_url":null,"source":{"id":"https://openalex.org/S61310614","display_name":"IEEE Transactions on Information Forensics and Security","issn_l":"1556-6013","issn":["1556-6013","1556-6021"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Information Forensics and Security","raw_type":"journal-article"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.6600000262260437}],"awards":[{"id":"https://openalex.org/G275433974","display_name":null,"funder_award_id":"AF-FA8650-19-1-1707","funder_id":"https://openalex.org/F4320337525","funder_display_name":"Air Force Materiel Command"}],"funders":[{"id":"https://openalex.org/F4320332467","display_name":"U.S. Air Force","ror":"https://ror.org/006gmme17"},{"id":"https://openalex.org/F4320337525","display_name":"Air Force Materiel Command","ror":"https://ror.org/006gmme17"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":30,"referenced_works":["https://openalex.org/W212396256","https://openalex.org/W1568241367","https://openalex.org/W1583498340","https://openalex.org/W1992413325","https://openalex.org/W1993023092","https://openalex.org/W1995505545","https://openalex.org/W2007280892","https://openalex.org/W2035407142","https://openalex.org/W2076611807","https://openalex.org/W2085047243","https://openalex.org/W2091664166","https://openalex.org/W2093439000","https://openalex.org/W2099101940","https://openalex.org/W2112414127","https://openalex.org/W2112787602","https://openalex.org/W2124458446","https://openalex.org/W2158902938","https://openalex.org/W2300806133","https://openalex.org/W2307493678","https://openalex.org/W2407378035","https://openalex.org/W2422685390","https://openalex.org/W2523751514","https://openalex.org/W2586449326","https://openalex.org/W2808442774","https://openalex.org/W4206595402","https://openalex.org/W4211068006","https://openalex.org/W4241472700","https://openalex.org/W4243195860","https://openalex.org/W4248175462","https://openalex.org/W6727391205"],"related_works":["https://openalex.org/W2378709054","https://openalex.org/W4380301954","https://openalex.org/W2803090313","https://openalex.org/W2142853517","https://openalex.org/W2376767034","https://openalex.org/W2350918606","https://openalex.org/W2052375654","https://openalex.org/W2185974889","https://openalex.org/W1904404243","https://openalex.org/W102777191"],"abstract_inverted_index":{"The":[0,32,127,157],"rise":[1],"of":[2,34,78,92,124,133,186],"recycled":[3],"integrated":[4],"circuits":[5],"(ICs)":[6],"in":[7,43,178],"the":[8,16,44,79,90,104,122,136,174,179,184],"critical":[9],"infrastructures":[10],"causes":[11],"a":[12,53,56,115,131,161,187,190],"major":[13],"concern":[14],"to":[15,50,59,148,170],"government":[17],"and":[18,26,117,139,151],"industry":[19],"because":[20],"these":[21,35],"chips":[22,94],"exhibit":[23],"lower":[24],"performance":[25],"have":[27,100],"shorter":[28],"remaining":[29],"useful":[30],"life.":[31],"detection":[33],"ICs":[36],"becomes":[37],"extremely":[38],"challenging":[39],"when":[40],"they":[41,99],"are":[42],"supply":[45,180],"chain.":[46],"It":[47],"is":[48,68],"necessary":[49],"power":[51],"up":[52],"chip":[54,188],"at":[55],"distributor's":[57],"site":[58],"measure":[60],"different":[61],"electrical":[62],"parameters":[63],"for":[64,107,120],"verifying":[65],"whether":[66],"it":[67],"used":[69],"before.":[70],"However,":[71],"this":[72,111],"can":[73,182],"be":[74,83,96,171],"challenging,":[75],"as":[76],"many":[77],"distributors":[80],"may":[81,95],"not":[82],"equipped":[84],"with":[85],"proper":[86],"test":[87],"infrastructures.":[88],"Moreover,":[89],"reliability":[91],"authentic":[93],"reduced":[97],"if":[98],"been":[101],"removed":[102],"from":[103,146],"packaging":[105],"boxes":[106],"testing":[108],"purposes.":[109],"In":[110],"paper,":[112],"we":[113],"propose":[114],"robust":[116],"low-cost":[118],"solution":[119,129,159],"enabling":[121,143],"traceability":[123,145],"an":[125],"IC.":[126],"proposed":[128,158],"builds":[130],"chain":[132,181],"trust":[134],"among":[135],"manufacturer,":[137],"distributors,":[138],"system":[140,149],"integrator":[141],"by":[142],"end-to-end":[144],"manufacturing":[147],"integration":[150],"provides":[152],"protection":[153],"against":[154],"IC":[155],"recycling.":[156],"utilizes":[160],"small":[162],"passive":[163],"radio-frequency":[164],"identification":[165],"(RFID)":[166],"tag,":[167],"which":[168],"needs":[169],"placed":[172],"on":[173],"package.":[175],"Any":[176],"entity":[177],"verify":[183],"authenticity":[185],"using":[189],"commercial":[191],"RFID":[192],"reader.":[193]},"counts_by_year":[{"year":2025,"cited_by_count":5},{"year":2024,"cited_by_count":10},{"year":2023,"cited_by_count":8},{"year":2022,"cited_by_count":8},{"year":2021,"cited_by_count":5},{"year":2020,"cited_by_count":5},{"year":2019,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}