{"id":"https://openalex.org/W3009656914","doi":"https://doi.org/10.1109/tie.2020.2977563","title":"Fatigue Mechanism of Die-Attach Joints in IGBTs Under Low-Amplitude Temperature Swings Based on 3D Electro-Thermal-Mechanical FE Simulations","display_name":"Fatigue Mechanism of Die-Attach Joints in IGBTs Under Low-Amplitude Temperature Swings Based on 3D Electro-Thermal-Mechanical FE Simulations","publication_year":2020,"publication_date":"2020-03-06","ids":{"openalex":"https://openalex.org/W3009656914","doi":"https://doi.org/10.1109/tie.2020.2977563","mag":"3009656914"},"language":"en","primary_location":{"id":"doi:10.1109/tie.2020.2977563","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tie.2020.2977563","pdf_url":null,"source":{"id":"https://openalex.org/S58031724","display_name":"IEEE Transactions on Industrial Electronics","issn_l":"0278-0046","issn":["0278-0046","1557-9948"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Industrial Electronics","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101421771","display_name":"Yongle Huang","orcid":"https://orcid.org/0000-0002-9711-1246"},"institutions":[{"id":"https://openalex.org/I2800710378","display_name":"Naval University of Engineering","ror":"https://ror.org/056vyez31","country_code":"CN","type":"education","lineage":["https://openalex.org/I2800710378"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yongle Huang","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Vessel Integrated Power System, Naval University of Engineering, Wuhan, China"],"raw_orcid":"https://orcid.org/0000-0002-9711-1246","affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Vessel Integrated Power System, Naval University of Engineering, Wuhan, China","institution_ids":["https://openalex.org/I2800710378"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113080167","display_name":"Hongfei Deng","orcid":null},"institutions":[{"id":"https://openalex.org/I2800710378","display_name":"Naval University of Engineering","ror":"https://ror.org/056vyez31","country_code":"CN","type":"education","lineage":["https://openalex.org/I2800710378"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hongfei Deng","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Vessel Integrated Power System, Naval University of Engineering, Wuhan, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Vessel Integrated Power System, Naval University of Engineering, Wuhan, China","institution_ids":["https://openalex.org/I2800710378"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100785140","display_name":"Yifei Luo","orcid":"https://orcid.org/0000-0003-0848-8605"},"institutions":[{"id":"https://openalex.org/I2800710378","display_name":"Naval University of Engineering","ror":"https://ror.org/056vyez31","country_code":"CN","type":"education","lineage":["https://openalex.org/I2800710378"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yifei Luo","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Vessel Integrated Power System, Naval University of Engineering, Wuhan, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Vessel Integrated Power System, Naval University of Engineering, Wuhan, China","institution_ids":["https://openalex.org/I2800710378"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011370466","display_name":"Fei Xiao","orcid":"https://orcid.org/0000-0001-5584-6626"},"institutions":[{"id":"https://openalex.org/I2800710378","display_name":"Naval University of Engineering","ror":"https://ror.org/056vyez31","country_code":"CN","type":"education","lineage":["https://openalex.org/I2800710378"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fei Xiao","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Vessel Integrated Power System, Naval University of Engineering, Wuhan, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Vessel Integrated Power System, Naval University of Engineering, Wuhan, China","institution_ids":["https://openalex.org/I2800710378"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5062233667","display_name":"Binli Liu","orcid":null},"institutions":[{"id":"https://openalex.org/I2800710378","display_name":"Naval University of Engineering","ror":"https://ror.org/056vyez31","country_code":"CN","type":"education","lineage":["https://openalex.org/I2800710378"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Binli Liu","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Vessel Integrated Power System, Naval University of Engineering, Wuhan, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Vessel Integrated Power System, Naval University of Engineering, Wuhan, China","institution_ids":["https://openalex.org/I2800710378"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5114269518","display_name":"Xin Tang","orcid":"https://orcid.org/0009-0005-7213-8169"},"institutions":[{"id":"https://openalex.org/I2800710378","display_name":"Naval University of Engineering","ror":"https://ror.org/056vyez31","country_code":"CN","type":"education","lineage":["https://openalex.org/I2800710378"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xin Tang","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Vessel Integrated Power System, Naval University of Engineering, Wuhan, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Vessel Integrated Power System, Naval University of Engineering, Wuhan, China","institution_ids":["https://openalex.org/I2800710378"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I2800710378"],"apc_list":null,"apc_paid":null,"fwci":1.7119,"has_fulltext":false,"cited_by_count":52,"citation_normalized_percentile":{"value":0.83756989,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":95,"max":99},"biblio":{"volume":"68","issue":"4","first_page":"3033","last_page":"3043"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/viscoplasticity","display_name":"Viscoplasticity","score":0.7065804600715637},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7048650979995728},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.5550569891929626},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.5377976894378662},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.4386351406574249},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.40952908992767334},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.36432796716690063},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.19084826111793518},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.14627602696418762}],"concepts":[{"id":"https://openalex.org/C55359492","wikidata":"https://www.wikidata.org/wiki/Q7935671","display_name":"Viscoplasticity","level":4,"score":0.7065804600715637},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7048650979995728},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.5550569891929626},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.5377976894378662},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.4386351406574249},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.40952908992767334},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.36432796716690063},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.19084826111793518},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.14627602696418762},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C202973686","wikidata":"https://www.wikidata.org/wiki/Q1937401","display_name":"Constitutive equation","level":3,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tie.2020.2977563","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tie.2020.2977563","pdf_url":null,"source":{"id":"https://openalex.org/S58031724","display_name":"IEEE Transactions on Industrial Electronics","issn_l":"0278-0046","issn":["0278-0046","1557-9948"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Industrial Electronics","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G6592666203","display_name":null,"funder_award_id":"51490681","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":52,"referenced_works":["https://openalex.org/W626773769","https://openalex.org/W1259300698","https://openalex.org/W1934148992","https://openalex.org/W1970530341","https://openalex.org/W1974200471","https://openalex.org/W1976262398","https://openalex.org/W1978696206","https://openalex.org/W1981821213","https://openalex.org/W1985569381","https://openalex.org/W2003285013","https://openalex.org/W2014070360","https://openalex.org/W2015055371","https://openalex.org/W2019166754","https://openalex.org/W2023180967","https://openalex.org/W2047417556","https://openalex.org/W2047686690","https://openalex.org/W2085767983","https://openalex.org/W2102575490","https://openalex.org/W2105557297","https://openalex.org/W2105572667","https://openalex.org/W2121673679","https://openalex.org/W2134913122","https://openalex.org/W2148646113","https://openalex.org/W2153884005","https://openalex.org/W2162827174","https://openalex.org/W2164094042","https://openalex.org/W2167033325","https://openalex.org/W2251987984","https://openalex.org/W2267906647","https://openalex.org/W2316549777","https://openalex.org/W2418299147","https://openalex.org/W2461827261","https://openalex.org/W2469679668","https://openalex.org/W2515286265","https://openalex.org/W2531934451","https://openalex.org/W2734277229","https://openalex.org/W2745669836","https://openalex.org/W2757841039","https://openalex.org/W2770507589","https://openalex.org/W2791319635","https://openalex.org/W2791908960","https://openalex.org/W2891535831","https://openalex.org/W2906131229","https://openalex.org/W3140709904","https://openalex.org/W3144964424","https://openalex.org/W6640460078","https://openalex.org/W6654273713","https://openalex.org/W6675977509","https://openalex.org/W6684345487","https://openalex.org/W6693576617","https://openalex.org/W6694170180","https://openalex.org/W6717347466"],"related_works":["https://openalex.org/W3082440218","https://openalex.org/W2380293314","https://openalex.org/W2943188944","https://openalex.org/W2137307547","https://openalex.org/W4285802202","https://openalex.org/W2082293200","https://openalex.org/W3008690834","https://openalex.org/W4242480814","https://openalex.org/W2051270029","https://openalex.org/W2014315543"],"abstract_inverted_index":{"Fatigue":[0,85,99,137],"failure":[1,33,157],"of":[2,15,22,35,61,76,78,100,108,130,138],"insulated":[3],"gate":[4],"bipolar":[5],"transistor":[6],"modules":[7],"(IGBTs)":[8],"packages":[9],"under":[10,40,81,124,141,183],"low-amplitude":[11,82,184],"temperature":[12,83,185],"swings":[13,186],"is":[14,72,103,120,144,160],"great":[16],"significance":[17],"for":[18,178],"the":[19,73,106,116,128,148,154],"reliability":[20],"evaluation":[21],"IGBTs":[23,39,182],"operating":[24,42,170],"in":[25,38,121,156,181],"actual":[26],"power":[27],"electronic":[28],"devices.":[29],"In":[30],"this":[31],"article,":[32],"mechanism":[34],"die-attach":[36,79,101,118,139,179],"joints":[37,80,102,140,180],"normal":[41,169],"and":[43,90,111,127],"accelerated":[44,125,142],"aging":[45,126,143],"was":[46,187],"comparably":[47],"investigated":[48],"by":[49,69,105,147],"a":[50],"three-dimensional":[51],"electro-thermal-mechanical":[52],"coupled":[53],"model.":[54],"Results":[55],"indicated":[56],"that":[57],"local":[58],"viscoplastic":[59,122],"deformation":[60,123],"solder":[62,119],"alloys":[63],"around":[64],"stress":[65],"concentrated":[66],"areas":[67,96],"caused":[68],"material":[70],"microdefects":[71],"root":[74],"cause":[75],"fatigue":[77],"swings.":[84],"cracks":[86],"can":[87],"only":[88,145],"initiate":[89],"propagate":[91],"at":[92],"those":[93],"plastically":[94],"deformed":[95],"(activation":[97],"points).":[98],"co-determined":[104],"number":[107,129],"activation":[109,131],"points":[110,132],"crack":[112,149],"growth":[113,150],"rate.":[114,151],"Comparably,":[115],"whole":[117],"has":[133],"reached":[134],"its":[135],"saturation.":[136],"determined":[146],"Due":[152],"to":[153,162,168],"difference":[155],"mechanism,":[158],"it":[159],"questionable":[161],"directly":[163],"extend":[164],"conventional":[165],"life":[166,176],"models":[167],"conditions.":[171],"Accordingly,":[172],"an":[173],"energy-based":[174],"physical":[175],"model":[177],"proposed.":[188]},"counts_by_year":[{"year":2026,"cited_by_count":6},{"year":2025,"cited_by_count":13},{"year":2024,"cited_by_count":12},{"year":2023,"cited_by_count":10},{"year":2022,"cited_by_count":8},{"year":2021,"cited_by_count":3}],"updated_date":"2026-08-12T21:12:35.861297","created_date":"2025-10-10T00:00:00"}