{"id":"https://openalex.org/W3001290849","doi":"https://doi.org/10.1109/tetc.2020.2969237","title":"A Novel TDMA-Based Fault Tolerance Technique for the TSVs in 3D-ICs Using Honeycomb Topology","display_name":"A Novel TDMA-Based Fault Tolerance Technique for the TSVs in 3D-ICs Using Honeycomb Topology","publication_year":2020,"publication_date":"2020-01-24","ids":{"openalex":"https://openalex.org/W3001290849","doi":"https://doi.org/10.1109/tetc.2020.2969237","mag":"3001290849"},"language":"en","primary_location":{"id":"doi:10.1109/tetc.2020.2969237","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tetc.2020.2969237","pdf_url":null,"source":{"id":"https://openalex.org/S2496326734","display_name":"IEEE Transactions on Emerging Topics in Computing","issn_l":"2168-6750","issn":["2168-6750","2376-4562"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Emerging Topics in Computing","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5085987622","display_name":"Tianming Ni","orcid":"https://orcid.org/0000-0001-6272-8660"},"institutions":[{"id":"https://openalex.org/I70908550","display_name":"Anhui Polytechnic University","ror":"https://ror.org/041sj0284","country_code":"CN","type":"education","lineage":["https://openalex.org/I70908550"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Tianming Ni","raw_affiliation_strings":["Key Laboratory of Advanced Perception and Intelligent Control of High-end Equipment, Ministry of Education, College of Electrical Engineering, Anhui Polytechnic University, Wuhu, Anhui, China"],"raw_orcid":"https://orcid.org/0000-0001-6272-8660","affiliations":[{"raw_affiliation_string":"Key Laboratory of Advanced Perception and Intelligent Control of High-end Equipment, Ministry of Education, College of Electrical Engineering, Anhui Polytechnic University, Wuhu, Anhui, China","institution_ids":["https://openalex.org/I70908550"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5029480162","display_name":"Zhao Yang","orcid":"https://orcid.org/0009-0001-6068-4374"},"institutions":[{"id":"https://openalex.org/I16365422","display_name":"Hefei University of Technology","ror":"https://ror.org/02czkny70","country_code":"CN","type":"education","lineage":["https://openalex.org/I16365422"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhao Yang","raw_affiliation_strings":["School of Electronic Science and Applied Physics, Hefei University of Technology, Hefei, Anhui, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electronic Science and Applied Physics, Hefei University of Technology, Hefei, Anhui, China","institution_ids":["https://openalex.org/I16365422"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101887840","display_name":"Hao Chang","orcid":"https://orcid.org/0000-0002-6106-9613"},"institutions":[{"id":"https://openalex.org/I188935350","display_name":"Anhui University of Finance and Economics","ror":"https://ror.org/0152zzg30","country_code":"CN","type":"education","lineage":["https://openalex.org/I188935350"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hao Chang","raw_affiliation_strings":["Department of Computer Science and Technology, Anhui University of Finance and Economics, Bengbu, Anhui, China"],"raw_orcid":"https://orcid.org/0000-0002-6106-9613","affiliations":[{"raw_affiliation_string":"Department of Computer Science and Technology, Anhui University of Finance and Economics, Bengbu, Anhui, China","institution_ids":["https://openalex.org/I188935350"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037335978","display_name":"Xiaoqiang Zhang","orcid":"https://orcid.org/0000-0001-5340-7697"},"institutions":[{"id":"https://openalex.org/I70908550","display_name":"Anhui Polytechnic University","ror":"https://ror.org/041sj0284","country_code":"CN","type":"education","lineage":["https://openalex.org/I70908550"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiaoqiang Zhang","raw_affiliation_strings":["Key Laboratory of Advanced Perception and Intelligent Control of High-end Equipment, Ministry of Education, College of Electrical Engineering, Anhui Polytechnic University, Wuhu, Anhui, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Key Laboratory of Advanced Perception and Intelligent Control of High-end Equipment, Ministry of Education, College of Electrical Engineering, Anhui Polytechnic University, Wuhu, Anhui, China","institution_ids":["https://openalex.org/I70908550"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101483507","display_name":"Lin Lu","orcid":"https://orcid.org/0000-0003-2289-4984"},"institutions":[{"id":"https://openalex.org/I70908550","display_name":"Anhui Polytechnic University","ror":"https://ror.org/041sj0284","country_code":"CN","type":"education","lineage":["https://openalex.org/I70908550"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Lin Lu","raw_affiliation_strings":["Key Laboratory of Advanced Perception and Intelligent Control of High-end Equipment, Ministry of Education, College of Electrical Engineering, Anhui Polytechnic University, Wuhu, Anhui, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Key Laboratory of Advanced Perception and Intelligent Control of High-end Equipment, Ministry of Education, College of Electrical Engineering, Anhui Polytechnic University, Wuhu, Anhui, China","institution_ids":["https://openalex.org/I70908550"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072439444","display_name":"Aibin Yan","orcid":"https://orcid.org/0000-0003-0024-987X"},"institutions":[{"id":"https://openalex.org/I143868143","display_name":"Anhui University","ror":"https://ror.org/05th6yx34","country_code":"CN","type":"education","lineage":["https://openalex.org/I143868143"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Aibin Yan","raw_affiliation_strings":["School of Computer Science and Technology, Anhui University, Hefei, Anhui, China"],"raw_orcid":"https://orcid.org/0000-0003-0024-987X","affiliations":[{"raw_affiliation_string":"School of Computer Science and Technology, Anhui University, Hefei, Anhui, China","institution_ids":["https://openalex.org/I143868143"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073810494","display_name":"Zhengfeng Huang","orcid":"https://orcid.org/0000-0001-8695-4478"},"institutions":[{"id":"https://openalex.org/I16365422","display_name":"Hefei University of Technology","ror":"https://ror.org/02czkny70","country_code":"CN","type":"education","lineage":["https://openalex.org/I16365422"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhengfeng Huang","raw_affiliation_strings":["School of Electronic Science and Applied Physics, Hefei University of Technology, Hefei, Anhui, China"],"raw_orcid":"https://orcid.org/0000-0001-8695-4478","affiliations":[{"raw_affiliation_string":"School of Electronic Science and Applied Physics, Hefei University of Technology, Hefei, Anhui, China","institution_ids":["https://openalex.org/I16365422"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5084697545","display_name":"Xiaoqing Wen","orcid":"https://orcid.org/0000-0001-8305-604X"},"institutions":[{"id":"https://openalex.org/I207014233","display_name":"Kyushu Institute of Technology","ror":"https://ror.org/02278tr80","country_code":"JP","type":"education","lineage":["https://openalex.org/I207014233"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Xiaoqing Wen","raw_affiliation_strings":["Department of Creative Informatics, Graduate School of Computer Science and Systems Engineering, Kyushu Institute of Technology, Fukuoka, Japan"],"raw_orcid":"https://orcid.org/0000-0001-8305-604X","affiliations":[{"raw_affiliation_string":"Department of Creative Informatics, Graduate School of Computer Science and Systems Engineering, Kyushu Institute of Technology, Fukuoka, Japan","institution_ids":["https://openalex.org/I207014233"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":4.6433,"has_fulltext":false,"cited_by_count":52,"citation_normalized_percentile":{"value":0.95561614,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":96,"max":100},"biblio":{"volume":"9","issue":"2","first_page":"724","last_page":"734"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9916999936103821,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/time-division-multiple-access","display_name":"Time division multiple access","score":0.6941437721252441},{"id":"https://openalex.org/keywords/benchmark","display_name":"Benchmark (surveying)","score":0.5116491913795471},{"id":"https://openalex.org/keywords/topology","display_name":"Topology (electrical circuits)","score":0.5018906593322754},{"id":"https://openalex.org/keywords/overhead","display_name":"Overhead (engineering)","score":0.4994204044342041},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.48921775817871094},{"id":"https://openalex.org/keywords/fault-tolerance","display_name":"Fault tolerance","score":0.4806981682777405},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.47521716356277466},{"id":"https://openalex.org/keywords/fault","display_name":"Fault (geology)","score":0.42255163192749023},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3639184236526489},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.31846094131469727},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.28874024748802185},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.15553733706474304},{"id":"https://openalex.org/keywords/distributed-computing","display_name":"Distributed computing","score":0.13410243391990662}],"concepts":[{"id":"https://openalex.org/C117313154","wikidata":"https://www.wikidata.org/wiki/Q878344","display_name":"Time division multiple access","level":2,"score":0.6941437721252441},{"id":"https://openalex.org/C185798385","wikidata":"https://www.wikidata.org/wiki/Q1161707","display_name":"Benchmark (surveying)","level":2,"score":0.5116491913795471},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.5018906593322754},{"id":"https://openalex.org/C2779960059","wikidata":"https://www.wikidata.org/wiki/Q7113681","display_name":"Overhead (engineering)","level":2,"score":0.4994204044342041},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.48921775817871094},{"id":"https://openalex.org/C63540848","wikidata":"https://www.wikidata.org/wiki/Q3140932","display_name":"Fault tolerance","level":2,"score":0.4806981682777405},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.47521716356277466},{"id":"https://openalex.org/C175551986","wikidata":"https://www.wikidata.org/wiki/Q47089","display_name":"Fault (geology)","level":2,"score":0.42255163192749023},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3639184236526489},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.31846094131469727},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.28874024748802185},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.15553733706474304},{"id":"https://openalex.org/C120314980","wikidata":"https://www.wikidata.org/wiki/Q180634","display_name":"Distributed computing","level":1,"score":0.13410243391990662},{"id":"https://openalex.org/C165205528","wikidata":"https://www.wikidata.org/wiki/Q83371","display_name":"Seismology","level":1,"score":0.0},{"id":"https://openalex.org/C205649164","wikidata":"https://www.wikidata.org/wiki/Q1071","display_name":"Geography","level":0,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C13280743","wikidata":"https://www.wikidata.org/wiki/Q131089","display_name":"Geodesy","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tetc.2020.2969237","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tetc.2020.2969237","pdf_url":null,"source":{"id":"https://openalex.org/S2496326734","display_name":"IEEE Transactions on Emerging Topics in Computing","issn_l":"2168-6750","issn":["2168-6750","2376-4562"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Emerging Topics in Computing","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G3909525237","display_name":null,"funder_award_id":"61974001","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G4507329490","display_name":null,"funder_award_id":"61704001","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G4575015898","display_name":null,"funder_award_id":"1908085MF179","funder_id":"https://openalex.org/F4320334897","funder_display_name":"Natural Science Foundation of Anhui Province"},{"id":"https://openalex.org/G6260214469","display_name":null,"funder_award_id":"61874156","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G8259609370","display_name":null,"funder_award_id":"1808085QF196","funder_id":"https://openalex.org/F4320334897","funder_display_name":"Natural Science Foundation of Anhui Province"},{"id":"https://openalex.org/G8556797422","display_name":"Shift-Power-Safe Scan Test Methodology for High-Quality Low-Power LSI Circuits","funder_award_id":"17H01716","funder_id":"https://openalex.org/F4320334764","funder_display_name":"Japan Society for the Promotion of Science"},{"id":"https://openalex.org/G875980750","display_name":null,"funder_award_id":"61904001","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G98675533","display_name":null,"funder_award_id":"1908085QF272","funder_id":"https://openalex.org/F4320334897","funder_display_name":"Natural Science Foundation of Anhui Province"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320334764","display_name":"Japan Society for the Promotion of Science","ror":"https://ror.org/00hhkn466"},{"id":"https://openalex.org/F4320334897","display_name":"Natural Science Foundation of Anhui Province","ror":null}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":27,"referenced_works":["https://openalex.org/W1535622131","https://openalex.org/W1965459844","https://openalex.org/W1998234398","https://openalex.org/W2010009884","https://openalex.org/W2019989040","https://openalex.org/W2029390138","https://openalex.org/W2050816113","https://openalex.org/W2062899780","https://openalex.org/W2064712157","https://openalex.org/W2107304970","https://openalex.org/W2138951112","https://openalex.org/W2146843106","https://openalex.org/W2151755625","https://openalex.org/W2158323053","https://openalex.org/W2168584827","https://openalex.org/W2318606705","https://openalex.org/W2344110221","https://openalex.org/W2397543037","https://openalex.org/W2591970795","https://openalex.org/W2603592157","https://openalex.org/W2603758940","https://openalex.org/W2753859517","https://openalex.org/W2794806694","https://openalex.org/W2896825731","https://openalex.org/W3143398174","https://openalex.org/W3144072891","https://openalex.org/W4253117434"],"related_works":["https://openalex.org/W2160222453","https://openalex.org/W2121800375","https://openalex.org/W2362971132","https://openalex.org/W2020063395","https://openalex.org/W2371687215","https://openalex.org/W2378211422","https://openalex.org/W1862835629","https://openalex.org/W2136799148","https://openalex.org/W2897533804","https://openalex.org/W2890506991"],"abstract_inverted_index":{"Through-silicon-vias":[0],"(TSVs)":[1],"are":[2,130],"prone":[3],"to":[4,27,33,80,132,177,186],"defects":[5],"during":[6],"the":[7,77,82,86,96,106,111,125,128,136,144,153,179,187],"manufacturing":[8],"process,":[9],"which":[10,190],"pose":[11],"yield":[12,194],"challenges":[13],"for":[14,76,85],"three":[15],"dimensional":[16],"integrated":[17],"circuits":[18,166],"(3D-ICs).":[19],"The":[20,172],"area":[21,180],"per":[22,57,89,99,118,139],"TSV":[23,63,88,100,108,146],"is":[24,49,55,74,156,175],"too":[25],"great":[26],"be":[28],"ignored,":[29],"and":[30,124,159],"in":[31,60,92,95,105,120,192],"order":[32],"not":[34],"use":[35],"any":[36],"redundant":[37],"TSVs,":[38],"a":[39,52,61,67,93,121,193],"chain-type":[40],"time":[41],"division":[42],"multiplexing":[43],"access":[44],"(TDMA)-based":[45],"fault":[46],"tolerance":[47],"technique":[48,155,174],"proposed.":[50],"However,":[51],"double-TSV":[53],"structure":[54],"used":[56],"group,":[58,90],"resulting":[59,91],"significant":[62],"hardware":[64],"overhead":[65,181],"under":[66],"given":[68],"large-scaled":[69],"circuit":[70],"design.":[71],"Furthermore,":[72],"it":[73],"impossible":[75],"chain-TDMA":[78,188],"scheme":[79],"plan":[81],"rerouting":[83],"path":[84],"right-hand-most":[87],"decrease":[94],"repair":[97,137],"rate":[98,138],"group":[101,119,140],"as":[102,104,141,143],"well":[103,142],"whole":[107,145],"yield.":[109,147],"In":[110],"proposed":[112,154,173],"technique,":[113],"we":[114],"bundle":[115],"six":[116],"TSVs":[117,126],"honeycomb":[122],"pattern":[123],"on":[127,152,161],"edges":[129],"connected":[131],"each":[133],"other,":[134],"enhancing":[135],"Subsequently,":[148],"an":[149],"architecture":[150],"based":[151],"designed,":[157],"evaluated,":[158],"validated":[160],"logic-on-logic":[162],"3D":[163],"IWLS'05":[164],"benchmark":[165],"using":[167],"45":[168],"nm":[169],"TSMC":[170],"technology.":[171],"found":[176],"reduce":[178],"by":[182],"87.95-90.42":[183],"percent,":[184],"compared":[185],"scheme,":[189],"results":[191],"of":[195],"96.90-99.09":[196],"percent.":[197]},"counts_by_year":[{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":4},{"year":2022,"cited_by_count":16},{"year":2021,"cited_by_count":19},{"year":2020,"cited_by_count":7}],"updated_date":"2026-03-27T05:58:40.876381","created_date":"2025-10-10T00:00:00"}