{"id":"https://openalex.org/W2781997936","doi":"https://doi.org/10.1109/test.2017.8242073","title":"POSTT: Path-oriented static test compaction for transition faults in scan circuits","display_name":"POSTT: Path-oriented static test compaction for transition faults in scan circuits","publication_year":2017,"publication_date":"2017-10-01","ids":{"openalex":"https://openalex.org/W2781997936","doi":"https://doi.org/10.1109/test.2017.8242073","mag":"2781997936"},"language":"en","primary_location":{"id":"doi:10.1109/test.2017.8242073","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2017.8242073","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE International Test Conference (ITC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5032651920","display_name":"Irith Pomeranz","orcid":"https://orcid.org/0000-0002-5491-7282"},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Irith Pomeranz","raw_affiliation_strings":["School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, U.S.A"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, U.S.A","institution_ids":["https://openalex.org/I219193219"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5032651920"],"corresponding_institution_ids":["https://openalex.org/I219193219"],"apc_list":null,"apc_paid":null,"fwci":0.2253,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.54137397,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"8"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9944999814033508,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/benchmark","display_name":"Benchmark (surveying)","score":0.7264538407325745},{"id":"https://openalex.org/keywords/automatic-test-pattern-generation","display_name":"Automatic test pattern generation","score":0.6615394353866577},{"id":"https://openalex.org/keywords/compaction","display_name":"Compaction","score":0.6104593276977539},{"id":"https://openalex.org/keywords/path","display_name":"Path (computing)","score":0.6081302762031555},{"id":"https://openalex.org/keywords/fault-coverage","display_name":"Fault coverage","score":0.598391056060791},{"id":"https://openalex.org/keywords/test-compression","display_name":"Test compression","score":0.5795249938964844},{"id":"https://openalex.org/keywords/test-set","display_name":"Test set","score":0.5635433197021484},{"id":"https://openalex.org/keywords/set","display_name":"Set (abstract data type)","score":0.5604873299598694},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.5238050222396851},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5173006057739258},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.5007836818695068},{"id":"https://openalex.org/keywords/fault","display_name":"Fault (geology)","score":0.4869566857814789},{"id":"https://openalex.org/keywords/dynamic-compaction","display_name":"Dynamic compaction","score":0.4681895971298218},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.36073336005210876},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2874579429626465},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.08012410998344421},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.07581979036331177}],"concepts":[{"id":"https://openalex.org/C185798385","wikidata":"https://www.wikidata.org/wiki/Q1161707","display_name":"Benchmark (surveying)","level":2,"score":0.7264538407325745},{"id":"https://openalex.org/C17626397","wikidata":"https://www.wikidata.org/wiki/Q837455","display_name":"Automatic test pattern generation","level":3,"score":0.6615394353866577},{"id":"https://openalex.org/C196715460","wikidata":"https://www.wikidata.org/wiki/Q1414356","display_name":"Compaction","level":2,"score":0.6104593276977539},{"id":"https://openalex.org/C2777735758","wikidata":"https://www.wikidata.org/wiki/Q817765","display_name":"Path (computing)","level":2,"score":0.6081302762031555},{"id":"https://openalex.org/C126953365","wikidata":"https://www.wikidata.org/wiki/Q5438152","display_name":"Fault coverage","level":3,"score":0.598391056060791},{"id":"https://openalex.org/C29652920","wikidata":"https://www.wikidata.org/wiki/Q7705757","display_name":"Test compression","level":4,"score":0.5795249938964844},{"id":"https://openalex.org/C169903167","wikidata":"https://www.wikidata.org/wiki/Q3985153","display_name":"Test set","level":2,"score":0.5635433197021484},{"id":"https://openalex.org/C177264268","wikidata":"https://www.wikidata.org/wiki/Q1514741","display_name":"Set (abstract data type)","level":2,"score":0.5604873299598694},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.5238050222396851},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5173006057739258},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.5007836818695068},{"id":"https://openalex.org/C175551986","wikidata":"https://www.wikidata.org/wiki/Q47089","display_name":"Fault (geology)","level":2,"score":0.4869566857814789},{"id":"https://openalex.org/C2777882295","wikidata":"https://www.wikidata.org/wiki/Q5318957","display_name":"Dynamic compaction","level":3,"score":0.4681895971298218},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.36073336005210876},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2874579429626465},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.08012410998344421},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.07581979036331177},{"id":"https://openalex.org/C165205528","wikidata":"https://www.wikidata.org/wiki/Q83371","display_name":"Seismology","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C205649164","wikidata":"https://www.wikidata.org/wiki/Q1071","display_name":"Geography","level":0,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C187320778","wikidata":"https://www.wikidata.org/wiki/Q1349130","display_name":"Geotechnical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C13280743","wikidata":"https://www.wikidata.org/wiki/Q131089","display_name":"Geodesy","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2017.8242073","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2017.8242073","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE International Test Conference (ITC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":34,"referenced_works":["https://openalex.org/W1554885925","https://openalex.org/W1568932717","https://openalex.org/W1761424569","https://openalex.org/W1838626497","https://openalex.org/W1966479192","https://openalex.org/W1967098233","https://openalex.org/W1992628119","https://openalex.org/W1998238661","https://openalex.org/W2002476964","https://openalex.org/W2041350247","https://openalex.org/W2089875208","https://openalex.org/W2096735225","https://openalex.org/W2098393491","https://openalex.org/W2101278273","https://openalex.org/W2105439963","https://openalex.org/W2107995582","https://openalex.org/W2110634061","https://openalex.org/W2119130057","https://openalex.org/W2124163129","https://openalex.org/W2131041854","https://openalex.org/W2132849610","https://openalex.org/W2134509461","https://openalex.org/W2144898259","https://openalex.org/W2145300792","https://openalex.org/W2154884969","https://openalex.org/W2159606689","https://openalex.org/W2230837107","https://openalex.org/W2288330210","https://openalex.org/W3141269131","https://openalex.org/W4242245787","https://openalex.org/W6676498741","https://openalex.org/W6678242351","https://openalex.org/W6681650642","https://openalex.org/W6689553567"],"related_works":["https://openalex.org/W2786111245","https://openalex.org/W3009953521","https://openalex.org/W4285708951","https://openalex.org/W2021253405","https://openalex.org/W1991935474","https://openalex.org/W2091533492","https://openalex.org/W2408214455","https://openalex.org/W2118133071","https://openalex.org/W2128148266","https://openalex.org/W2031574699"],"abstract_inverted_index":{"Static":[0],"test":[1,37,49,91,144],"compaction":[2,50],"procedures":[3],"that":[4,18,30,58],"modify":[5],"tests":[6,22,27,112,140],"perform":[7],"the":[8,14,21,36,41,60,65,71,74,87,90,104,107,118,128,137,150],"modification":[9],"so":[10],"as":[11,109],"to":[12,93,102,130,135],"increase":[13,103],"number":[15,119,138],"of":[16,20,52,73,89,106,120,139],"faults":[17,57,79],"some":[19],"detect,":[23],"thus":[24],"making":[25],"other":[26],"unnecessary.":[28],"Tests":[29],"become":[31],"unnecessary":[32],"are":[33,80],"removed":[34],"from":[35],"set":[38,92,145],"without":[39],"reducing":[40],"fault":[42],"coverage.":[43],"This":[44,82],"paper":[45],"describes":[46],"a":[47],"static":[48],"procedure":[51,66,99],"this":[53],"type":[54],"for":[55,85,124],"transition":[56,78],"has":[59],"following":[61],"additional":[62],"feature.":[63],"When":[64],"modifies":[67,111],"tests,":[68],"it":[69,110,115,132],"preserves":[70],"lengths":[72,105],"paths":[75,108],"through":[76],"which":[77,131],"detected.":[81],"is":[83,100,133],"important":[84],"preserving":[86,147],"ability":[88],"detect":[94],"small":[95],"delay":[96],"defects.":[97],"The":[98],"structured":[101],"even":[113],"when":[114],"cannot":[116],"reduce":[117,136],"tests.":[121],"Experimental":[122],"results":[123],"benchmark":[125],"circuits":[126],"demonstrate":[127],"extent":[129],"possible":[134],"in":[141],"an":[142],"already-compact":[143],"while":[146],"or":[148],"increasing":[149],"path":[151],"lengths.":[152]},"counts_by_year":[{"year":2022,"cited_by_count":2},{"year":2019,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}