{"id":"https://openalex.org/W2781490043","doi":"https://doi.org/10.1109/test.2017.8242040","title":"Automated die inking: A pattern recognition-based approach","display_name":"Automated die inking: A pattern recognition-based approach","publication_year":2017,"publication_date":"2017-10-01","ids":{"openalex":"https://openalex.org/W2781490043","doi":"https://doi.org/10.1109/test.2017.8242040","mag":"2781490043"},"language":"en","primary_location":{"id":"doi:10.1109/test.2017.8242040","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2017.8242040","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE International Test Conference (ITC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5073120036","display_name":"Constantinos Xanthopoulos","orcid":null},"institutions":[{"id":"https://openalex.org/I162577319","display_name":"The University of Texas at Dallas","ror":"https://ror.org/049emcs32","country_code":"US","type":"education","lineage":["https://openalex.org/I162577319"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Constantinos Xanthopoulos","raw_affiliation_strings":["Department of Electrical Engineering, The University of Texas at Dallas, Richardson, TX, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, The University of Texas at Dallas, Richardson, TX, USA","institution_ids":["https://openalex.org/I162577319"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006256979","display_name":"Peter Sarson","orcid":"https://orcid.org/0000-0002-7150-2281"},"institutions":[{"id":"https://openalex.org/I154481106","display_name":"AMS (Austria)","ror":"https://ror.org/03vz6gs79","country_code":"AT","type":"company","lineage":["https://openalex.org/I154481106"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"Peter Sarson","raw_affiliation_strings":["AMS AG, Premstaetten, Austria"],"affiliations":[{"raw_affiliation_string":"AMS AG, Premstaetten, Austria","institution_ids":["https://openalex.org/I154481106"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007247016","display_name":"Heinz Reiter","orcid":null},"institutions":[{"id":"https://openalex.org/I154481106","display_name":"AMS (Austria)","ror":"https://ror.org/03vz6gs79","country_code":"AT","type":"company","lineage":["https://openalex.org/I154481106"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"Heinz Reiter","raw_affiliation_strings":["AMS AG, Premstaetten, Austria"],"affiliations":[{"raw_affiliation_string":"AMS AG, Premstaetten, Austria","institution_ids":["https://openalex.org/I154481106"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5078818440","display_name":"Yiorgos Makris","orcid":"https://orcid.org/0000-0002-4322-0068"},"institutions":[{"id":"https://openalex.org/I162577319","display_name":"The University of Texas at Dallas","ror":"https://ror.org/049emcs32","country_code":"US","type":"education","lineage":["https://openalex.org/I162577319"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yiorgos Makris","raw_affiliation_strings":["Department of Electrical Engineering, The University of Texas at Dallas, Richardson, TX, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, The University of Texas at Dallas, Richardson, TX, USA","institution_ids":["https://openalex.org/I162577319"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5073120036"],"corresponding_institution_ids":["https://openalex.org/I162577319"],"apc_list":null,"apc_paid":null,"fwci":1.5054,"has_fulltext":false,"cited_by_count":11,"citation_normalized_percentile":{"value":0.85899932,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":"24","issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12549","display_name":"Image and Object Detection Techniques","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10638","display_name":"Optical measurement and interference techniques","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.7272902727127075},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6434844136238098},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6182183027267456},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5214223861694336},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.46219402551651},{"id":"https://openalex.org/keywords/set","display_name":"Set (abstract data type)","score":0.4596433639526367},{"id":"https://openalex.org/keywords/wafer-fabrication","display_name":"Wafer fabrication","score":0.4262325167655945},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.4188385307788849},{"id":"https://openalex.org/keywords/pattern-recognition","display_name":"Pattern recognition (psychology)","score":0.34280675649642944},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.33881038427352905},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3295767307281494},{"id":"https://openalex.org/keywords/programming-language","display_name":"Programming language","score":0.0810084342956543},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.07671821117401123}],"concepts":[{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.7272902727127075},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6434844136238098},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6182183027267456},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5214223861694336},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.46219402551651},{"id":"https://openalex.org/C177264268","wikidata":"https://www.wikidata.org/wiki/Q1514741","display_name":"Set (abstract data type)","level":2,"score":0.4596433639526367},{"id":"https://openalex.org/C35750839","wikidata":"https://www.wikidata.org/wiki/Q7959421","display_name":"Wafer fabrication","level":3,"score":0.4262325167655945},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.4188385307788849},{"id":"https://openalex.org/C153180895","wikidata":"https://www.wikidata.org/wiki/Q7148389","display_name":"Pattern recognition (psychology)","level":2,"score":0.34280675649642944},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.33881038427352905},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3295767307281494},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0810084342956543},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.07671821117401123},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2017.8242040","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2017.8242040","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE International Test Conference (ITC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Decent work and economic growth","score":0.7300000190734863,"id":"https://metadata.un.org/sdg/8"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W2009296640","https://openalex.org/W2023670504","https://openalex.org/W2047285735","https://openalex.org/W2104550562","https://openalex.org/W2119821739","https://openalex.org/W2120196566","https://openalex.org/W2147361048","https://openalex.org/W2165558283","https://openalex.org/W2509074878","https://openalex.org/W4239510810","https://openalex.org/W4308665337"],"related_works":["https://openalex.org/W2042913821","https://openalex.org/W2372289614","https://openalex.org/W2629813803","https://openalex.org/W2041067810","https://openalex.org/W2250518232","https://openalex.org/W2946551485","https://openalex.org/W1953501065","https://openalex.org/W1810385482","https://openalex.org/W2950583200","https://openalex.org/W2922579413"],"abstract_inverted_index":{"Manual":[0],"wafer-level":[1],"die":[2,10,61],"inking":[3,85],"is":[4,20,99],"a":[5,21,34,74],"common":[6],"procedure":[7],"for":[8,95],"excluding":[9],"locations":[11],"that":[12],"are":[13],"likely":[14],"to":[15,27,47,55,63,79],"be":[16,64],"defective.":[17],"Although":[18],"this":[19,70],"more":[22],"cost-effective":[23],"process,":[24],"as":[25],"compared":[26],"the":[28,84,88,93],"expensive":[29],"burn-in":[30],"tests,":[31],"it":[32],"remains":[33],"labor-intensive":[35],"step":[36],"during":[37],"IC":[38],"testing.":[39],"For":[40],"each":[41],"manufactured":[42],"wafer,":[43],"test":[44],"engineers":[45],"have":[46],"visually":[48],"inspect":[49],"every":[50],"failure":[51,89],"map":[52],"in":[53],"order":[54],"identify":[56],"any":[57],"regions":[58],"where":[59],"additional":[60],"need":[62,94],"marked":[65],"and":[66,81],"discarded.":[67],"Towards":[68],"reducing":[69],"cost,":[71],"we":[72],"introduce":[73],"novel":[75],"pattern":[76],"recognition":[77],"methodology":[78],"learn":[80],"automatically":[82],"generate":[83],"patterns":[86],"from":[87],"maps,":[90],"thus":[91],"eliminating":[92],"human":[96],"intervention.":[97],"Effectiveness":[98],"demonstrated":[100],"on":[101],"an":[102],"industrial":[103],"set":[104],"of":[105],"manually":[106],"inked":[107],"wafers.":[108]},"counts_by_year":[{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}