{"id":"https://openalex.org/W2186044115","doi":"https://doi.org/10.1109/test.2015.7342400","title":"Electrical package defect testing for volume production","display_name":"Electrical package defect testing for volume production","publication_year":2015,"publication_date":"2015-10-01","ids":{"openalex":"https://openalex.org/W2186044115","doi":"https://doi.org/10.1109/test.2015.7342400","mag":"2186044115"},"language":"en","primary_location":{"id":"doi:10.1109/test.2015.7342400","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2015.7342400","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Test Conference (ITC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5001931607","display_name":"Ming Xue","orcid":"https://orcid.org/0000-0003-1976-3238"},"institutions":[{"id":"https://openalex.org/I4210144507","display_name":"Infineon Technologies (Singapore)","ror":"https://ror.org/0470e9841","country_code":"SG","type":"company","lineage":["https://openalex.org/I137594350","https://openalex.org/I4210144507"]}],"countries":["SG"],"is_corresponding":true,"raw_author_name":"Xue Ming","raw_affiliation_strings":["Infineon Technologies, Singapore"],"affiliations":[{"raw_affiliation_string":"Infineon Technologies, Singapore","institution_ids":["https://openalex.org/I4210144507"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5029465567","display_name":"Koelz Johann","orcid":null},"institutions":[{"id":"https://openalex.org/I4210144507","display_name":"Infineon Technologies (Singapore)","ror":"https://ror.org/0470e9841","country_code":"SG","type":"company","lineage":["https://openalex.org/I137594350","https://openalex.org/I4210144507"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Koelz Johann","raw_affiliation_strings":["Infineon Technologies, Singapore"],"affiliations":[{"raw_affiliation_string":"Infineon Technologies, Singapore","institution_ids":["https://openalex.org/I4210144507"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011405063","display_name":"Lee Chow York","orcid":null},"institutions":[{"id":"https://openalex.org/I4210144507","display_name":"Infineon Technologies (Singapore)","ror":"https://ror.org/0470e9841","country_code":"SG","type":"company","lineage":["https://openalex.org/I137594350","https://openalex.org/I4210144507"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Lee Chow York","raw_affiliation_strings":["Infineon Technologies, Singapore"],"affiliations":[{"raw_affiliation_string":"Infineon Technologies, Singapore","institution_ids":["https://openalex.org/I4210144507"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054480798","display_name":"Lee Kwan Wee","orcid":null},"institutions":[{"id":"https://openalex.org/I4210098220","display_name":"Keysight Technologies (Singapore)","ror":"https://ror.org/01155gk87","country_code":"SG","type":"company","lineage":["https://openalex.org/I4210098220","https://openalex.org/I4210115805"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Lee Kwan Wee","raw_affiliation_strings":["Keysight Technologies, Singapore"],"affiliations":[{"raw_affiliation_string":"Keysight Technologies, Singapore","institution_ids":["https://openalex.org/I4210098220"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5109212068","display_name":"Shi Min","orcid":null},"institutions":[{"id":"https://openalex.org/I4210098220","display_name":"Keysight Technologies (Singapore)","ror":"https://ror.org/01155gk87","country_code":"SG","type":"company","lineage":["https://openalex.org/I4210098220","https://openalex.org/I4210115805"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Shi Zhi Min","raw_affiliation_strings":["Keysight Technologies, Singapore"],"affiliations":[{"raw_affiliation_string":"Keysight Technologies, Singapore","institution_ids":["https://openalex.org/I4210098220"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5001931607"],"corresponding_institution_ids":["https://openalex.org/I4210144507"],"apc_list":null,"apc_paid":null,"fwci":0.1973,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.59138194,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"9"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9952999949455261,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.6016205549240112},{"id":"https://openalex.org/keywords/integrated-circuit-packaging","display_name":"Integrated circuit packaging","score":0.5701247453689575},{"id":"https://openalex.org/keywords/volume","display_name":"Volume (thermodynamics)","score":0.5584431886672974},{"id":"https://openalex.org/keywords/production","display_name":"Production (economics)","score":0.500647783279419},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4720856845378876},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.41976433992385864},{"id":"https://openalex.org/keywords/capacitive-sensing","display_name":"Capacitive sensing","score":0.4150926470756531},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.32897916436195374},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.23016119003295898},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.2280651330947876}],"concepts":[{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.6016205549240112},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.5701247453689575},{"id":"https://openalex.org/C20556612","wikidata":"https://www.wikidata.org/wiki/Q4469374","display_name":"Volume (thermodynamics)","level":2,"score":0.5584431886672974},{"id":"https://openalex.org/C2778348673","wikidata":"https://www.wikidata.org/wiki/Q739302","display_name":"Production (economics)","level":2,"score":0.500647783279419},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4720856845378876},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.41976433992385864},{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.4150926470756531},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.32897916436195374},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.23016119003295898},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.2280651330947876},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0},{"id":"https://openalex.org/C139719470","wikidata":"https://www.wikidata.org/wiki/Q39680","display_name":"Macroeconomics","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2015.7342400","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2015.7342400","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Test Conference (ITC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.5899999737739563,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W3172386668","https://openalex.org/W2045392317","https://openalex.org/W3011006018","https://openalex.org/W4386571252","https://openalex.org/W4205540626","https://openalex.org/W2125140380","https://openalex.org/W2035297892","https://openalex.org/W2981692717","https://openalex.org/W3180688894","https://openalex.org/W2314148207"],"abstract_inverted_index":{"This":[0],"paper":[1],"introduces":[2],"a":[3,25,39],"newly":[4],"conceptualized":[5],"and":[6,42,57,68,111,126,151],"invented":[7],"an":[8],"electrical":[9,45,71],"test":[10,46],"capability":[11],"for":[12,20,47,141],"package":[13,30,48,78],"defect":[14,31,79],"detection":[15],"based":[16],"on":[17,106],"\u201cCapacitive":[18],"Testing\u201d":[19],"volume":[21,96],"production.":[22],"It":[23],"is":[24,94],"\u201cfirst":[26],"of":[27,87,128],"its":[28,152],"kind\u201d":[29],"testing":[32,80,131],"in":[33,64,85,95,155,160],"the":[34,123],"Semiconductor":[35],"industry,":[36],"which":[37,60],"offers":[38],"simple,":[40],"fast":[41],"\u201cfool":[43],"proof\u201d":[44],"structural":[49],"defect,":[50],"such":[51],"as":[52],"\u201cnear-short\u201d":[53],"between":[54],"adjacent":[55],"wires":[56],"inner":[58],"leads,":[59],"are":[61],"not":[62],"detectable":[63],"conventional":[65],"x-ray":[66,117],"screening":[67],"ATE":[69],"(automatic":[70],"equipment)":[72],"testing.":[73],"To":[74],"date,":[75],"this":[76,129,161],"greenfield":[77],"had":[81],"achieved":[82],"significant":[83,137],"impact":[84],"terms":[86],"Quality":[88],"(zero":[89],"customer":[90],"complaints":[91],"since":[92],"it":[93],"production,":[97],"2":[98],"years":[99],"ago),":[100],"productivity":[101],"improvement":[102],"(significantly":[103],"reduced":[104],"lot":[105],"hold":[107],"at":[108],"final":[109],"test),":[110],"high":[112],"cost":[113],"avoidance":[114],"(compare":[115],"to":[116,133],"screening).":[118],"Hence,":[119],"we":[120],"believe":[121],"that":[122],"further":[124],"developing":[125],"cascading":[127],"new":[130],"technology":[132],"industry":[134],"will":[135],"contribute":[136],"long":[138],"term":[139],"value":[140],"our":[142],"entire":[143],"customer.":[144],"The":[145],"concept":[146],"with":[147],"simulation,":[148],"result":[149],"validation,":[150],"various":[153],"application":[154],"BE":[156],"process":[157],"were":[158],"discussed":[159],"paper.":[162]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}