{"id":"https://openalex.org/W2183114177","doi":"https://doi.org/10.1109/test.2015.7342390","title":"A DLL-based test solution for through silicon via (TSV) in 3D-stacked ICs","display_name":"A DLL-based test solution for through silicon via (TSV) in 3D-stacked ICs","publication_year":2015,"publication_date":"2015-10-01","ids":{"openalex":"https://openalex.org/W2183114177","doi":"https://doi.org/10.1109/test.2015.7342390","mag":"2183114177"},"language":"en","primary_location":{"id":"doi:10.1109/test.2015.7342390","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2015.7342390","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Test Conference (ITC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5004313063","display_name":"Rashid Rashidzadeh","orcid":"https://orcid.org/0000-0002-3063-2848"},"institutions":[{"id":"https://openalex.org/I74413500","display_name":"University of Windsor","ror":"https://ror.org/01gw3d370","country_code":"CA","type":"education","lineage":["https://openalex.org/I74413500"]}],"countries":["CA"],"is_corresponding":true,"raw_author_name":"Rashid Rashidzadeh","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Windsor, Windsor, ON, Canada"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Windsor, Windsor, ON, Canada","institution_ids":["https://openalex.org/I74413500"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041728256","display_name":"E. Jedari","orcid":"https://orcid.org/0000-0001-5410-1817"},"institutions":[{"id":"https://openalex.org/I74413500","display_name":"University of Windsor","ror":"https://ror.org/01gw3d370","country_code":"CA","type":"education","lineage":["https://openalex.org/I74413500"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Esrafil Jedari","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Windsor, Windsor, ON, Canada"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Windsor, Windsor, ON, Canada","institution_ids":["https://openalex.org/I74413500"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090078843","display_name":"Tareq Muhammad Supon","orcid":"https://orcid.org/0000-0002-2768-3687"},"institutions":[{"id":"https://openalex.org/I74413500","display_name":"University of Windsor","ror":"https://ror.org/01gw3d370","country_code":"CA","type":"education","lineage":["https://openalex.org/I74413500"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Tareq Muhammad Supon","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Windsor, Windsor, ON, Canada"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Windsor, Windsor, ON, Canada","institution_ids":["https://openalex.org/I74413500"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5019562489","display_name":"Vladimir Spartakovich Mashkovtsev","orcid":null},"institutions":[{"id":"https://openalex.org/I74413500","display_name":"University of Windsor","ror":"https://ror.org/01gw3d370","country_code":"CA","type":"education","lineage":["https://openalex.org/I74413500"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Vladimir Mashkovtsev","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Windsor, Windsor, ON, Canada"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Windsor, Windsor, ON, Canada","institution_ids":["https://openalex.org/I74413500"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5004313063"],"corresponding_institution_ids":["https://openalex.org/I74413500"],"apc_list":null,"apc_paid":null,"fwci":0.7891,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.76624753,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"9"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.996399998664856,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.9954000115394592,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/spice","display_name":"Spice","score":0.8089741468429565},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.6851240396499634},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.5612932443618774},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5563235282897949},{"id":"https://openalex.org/keywords/propagation-delay","display_name":"Propagation delay","score":0.5260376930236816},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.5004312992095947},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.46022137999534607},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4540884494781494},{"id":"https://openalex.org/keywords/fault","display_name":"Fault (geology)","score":0.4475477635860443},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4468289613723755},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.3610844314098358},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.2530473470687866},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24048984050750732},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1677379012107849},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.14077508449554443}],"concepts":[{"id":"https://openalex.org/C2780077345","wikidata":"https://www.wikidata.org/wiki/Q16891888","display_name":"Spice","level":2,"score":0.8089741468429565},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.6851240396499634},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.5612932443618774},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5563235282897949},{"id":"https://openalex.org/C90806461","wikidata":"https://www.wikidata.org/wiki/Q1144416","display_name":"Propagation delay","level":2,"score":0.5260376930236816},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.5004312992095947},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.46022137999534607},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4540884494781494},{"id":"https://openalex.org/C175551986","wikidata":"https://www.wikidata.org/wiki/Q47089","display_name":"Fault (geology)","level":2,"score":0.4475477635860443},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4468289613723755},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.3610844314098358},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.2530473470687866},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24048984050750732},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1677379012107849},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.14077508449554443},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C165205528","wikidata":"https://www.wikidata.org/wiki/Q83371","display_name":"Seismology","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2015.7342390","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2015.7342390","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Test Conference (ITC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":26,"referenced_works":["https://openalex.org/W1566916904","https://openalex.org/W1870585997","https://openalex.org/W1964410717","https://openalex.org/W1965451131","https://openalex.org/W1967196629","https://openalex.org/W1972749955","https://openalex.org/W1985664729","https://openalex.org/W1987638749","https://openalex.org/W2023976101","https://openalex.org/W2029390138","https://openalex.org/W2038399208","https://openalex.org/W2047879375","https://openalex.org/W2053637952","https://openalex.org/W2055841712","https://openalex.org/W2095790208","https://openalex.org/W2118565267","https://openalex.org/W2132155220","https://openalex.org/W2138951112","https://openalex.org/W2143502515","https://openalex.org/W2150113875","https://openalex.org/W2155707315","https://openalex.org/W2158277795","https://openalex.org/W2158323053","https://openalex.org/W2163903773","https://openalex.org/W6643686623","https://openalex.org/W6663845994"],"related_works":["https://openalex.org/W1990828594","https://openalex.org/W2016970881","https://openalex.org/W2027159884","https://openalex.org/W2333804548","https://openalex.org/W2534942874","https://openalex.org/W3093450488","https://openalex.org/W2016589506","https://openalex.org/W2376702355","https://openalex.org/W4385062230","https://openalex.org/W4237709086"],"abstract_inverted_index":{"This":[0],"study":[1],"presents":[2,42],"a":[3,18,43,67],"new":[4],"test":[5,32,76,115],"method":[6,41],"for":[7,102],"Through":[8],"Silicon":[9],"Via":[10],"(TSV)":[11],"in":[12,16],"3D":[13,92],"stacked":[14],"ICs,":[15],"which":[17],"Delay-Locked":[19],"Loop":[20],"(DLL)":[21],"is":[22,70,81],"utilized":[23],"to":[24,30,56,72,83,97],"detect":[25,84,118],"TSV":[26,31,74,85,119],"defects.":[27],"As":[28],"compared":[29],"methods":[33],"using":[34],"free":[35,107],"running":[36],"ring":[37],"oscillators,":[38],"the":[39,57,64,73,78,113,131],"proposed":[40,65,114],"much":[44],"better":[45],"performance":[46],"against":[47],"Process,":[48],"supply":[49],"Voltage":[50],"and":[51,77,105],"Temperature":[52],"(PVT)":[53],"variations":[54],"due":[55],"inherent":[58],"feedback":[59],"of":[60],"DLL":[61],"systems.":[62],"In":[63],"scheme,":[66],"periodic":[68],"signal":[69],"applied":[71],"under":[75],"propagation":[79,124],"delay":[80,125],"measured":[82],"faults.":[86],"To":[87],"perform":[88],"circuit":[89],"level":[90],"simulations,":[91],"full-wave":[93],"simulations":[94],"are":[95],"performed":[96],"extract":[98],"accurate":[99],"spice":[100],"models":[101],"both":[103],"faulty":[104],"fault":[106],"TSVs.":[108],"Simulation":[109],"results":[110],"indicate":[111],"that":[112],"solution":[116],"can":[117],"manufacturing":[120],"defects,":[121],"changing":[122],"its":[123],"by":[126],"more":[127],"than":[128],"10%":[129],"from":[130],"nominal":[132],"value.":[133]},"counts_by_year":[{"year":2024,"cited_by_count":2},{"year":2022,"cited_by_count":1},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":3},{"year":2017,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}