{"id":"https://openalex.org/W2022872485","doi":"https://doi.org/10.1109/test.2014.7035334","title":"Interposer test: Testing PCBs that have shrunk 100x","display_name":"Interposer test: Testing PCBs that have shrunk 100x","publication_year":2014,"publication_date":"2014-10-01","ids":{"openalex":"https://openalex.org/W2022872485","doi":"https://doi.org/10.1109/test.2014.7035334","mag":"2022872485"},"language":"en","primary_location":{"id":"doi:10.1109/test.2014.7035334","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2014.7035334","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 International Test Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102498679","display_name":"TM Mak","orcid":null},"institutions":[{"id":"https://openalex.org/I35662394","display_name":"GlobalFoundries (United States)","ror":"https://ror.org/02h0ps145","country_code":"US","type":"company","lineage":["https://openalex.org/I35662394"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"TM Mak","raw_affiliation_strings":["GLOBALFOUNDRIES, USA"],"affiliations":[{"raw_affiliation_string":"GLOBALFOUNDRIES, USA","institution_ids":["https://openalex.org/I35662394"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5102498679"],"corresponding_institution_ids":["https://openalex.org/I35662394"],"apc_list":null,"apc_paid":null,"fwci":0.3065,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.5777009,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"1"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.8503999710083008,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.8503999710083008,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.7720000147819519,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.6835403442382812},{"id":"https://openalex.org/keywords/test","display_name":"Test (biology)","score":0.582955539226532},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.5348910689353943},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.47762244939804077},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20083001255989075},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.188466876745224},{"id":"https://openalex.org/keywords/geology","display_name":"Geology","score":0.1138961911201477},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.07439017295837402}],"concepts":[{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.6835403442382812},{"id":"https://openalex.org/C2777267654","wikidata":"https://www.wikidata.org/wiki/Q3519023","display_name":"Test (biology)","level":2,"score":0.582955539226532},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.5348910689353943},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.47762244939804077},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20083001255989075},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.188466876745224},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.1138961911201477},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.07439017295837402},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2014.7035334","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2014.7035334","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 International Test Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.5199999809265137,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2037416628","https://openalex.org/W2073725000","https://openalex.org/W2789752821","https://openalex.org/W2205502757","https://openalex.org/W2235483886","https://openalex.org/W1480508001","https://openalex.org/W2097812662"],"abstract_inverted_index":{"Silicon":[0,27,54],"Interposer":[1],"is":[2,168,184,193],"the":[3,24,39,49,74,113,123,126,164,186,189,207,257],"new":[4,153,176,264],"PCB":[5,90],"where":[6],"silicon":[7],"of":[8,125,134,136,148],"different":[9],"process":[10],"technologies":[11,155],"(like":[12],"logic,":[13],"DRAM,":[14],"analog,":[15],"etc.)":[16],"can":[17,108,246],"be":[18,203],"bonded":[19],"onto":[20],"and":[21,34,41,101,145,159,218,242,259],"integrated":[22],"into":[23],"same":[25,190],"package.":[26],"interposer":[28],"has":[29],"microbumps":[30,137,149],"on":[31,38,43,73,174,235,239],"one":[32,44,64],"side":[33,45],"flipchip":[35,129],"(C4)":[36],"bumps":[37],"other,":[40],"signal":[42],"are":[46,60,79,92,98,120],"connected":[47],"to":[48,57,66,70,112,195,226,255,262],"other":[50],"with":[51,132],"TSV":[52],"(Through":[53],"Vias).":[55],"Die":[56],"die":[58],"interconnects":[59,94],"just":[61,93,99],"wires":[62],"from":[63],"microbump":[65],"another":[67],"without":[68],"connecting":[69],"any":[71],"C4":[72],"bottom":[75],"side.":[76,166],"Essentially,":[77],"these":[78,240,269],"tiny":[80],"PCBs":[81],"that":[82],"have":[83,196,209],"their":[84],"dimensions":[85],"shrink":[86],"by":[87],"100x.":[88],"Conceptually":[89],"essentially":[91],"so":[95,178],"testing":[96,215,268],"really":[97],"open/short":[100],"maybe":[102],"leakage,":[103],"i.e.,":[104],"ONLY":[105],"if":[106],"you":[107,180,237],"connect":[109],"(or":[110],"probe)":[111],"microbumps.":[114],"However,":[115],"at":[116,163],"40\u201350um":[117],"pitch,":[118],"they":[119],"almost":[121],"half":[122],"pitch":[124,144],"most":[127],"advanced":[128],"bump":[130],"technology":[131],"tens":[133],"thousands":[135],"in":[138,206,228],"a":[139,248],"typical":[140],"application.":[141],"The":[142],"tight":[143],"mass":[146],"quantity":[147],"would":[150],"drive":[151],"for":[152,216,229,267],"probe":[154],"(read,":[156],"more":[157],"expensive)":[158],"complex":[160],"test":[161,198,265],"optimization":[162],"ATE":[165],"There":[167],"also":[169],"no":[170],"transistors":[171],"(nor":[172],"diodes)":[173],"this":[175],"PCB,":[177],"all":[179,233],"learnt":[181],"about":[182],"DFT":[183],"out":[185],"window.":[187],"At":[188],"time,":[191],"it":[192],"expected":[194],"zero":[197],"cost":[199],"(as":[200],"yield":[201,244],"should":[202],"high).":[204],"Some":[205],"industry":[208],"suggested":[210],"\u201cPretty":[211],"Good":[212],"Interposer\u201d,":[213],"only":[214],"systematics":[217],"not":[219],"defects.":[220],"Is,":[221],"\u201cpretty":[222],"good\u201d,":[223],"good":[224],"enough":[225],"stand":[227],"\u201cknown":[230],"good\u201d?":[231],"It":[232],"depends":[234],"what":[236],"put":[238],"interposers":[241],"potentially":[243],"loss":[245],"kill":[247],"product's":[249],"viability.":[250],"This":[251],"talk":[252],"will":[253,260],"try":[254,261],"elaborate":[256],"challenges":[258],"propose":[263],"methods":[266],"new,":[270],"miniature":[271],"PCB.":[272]},"counts_by_year":[{"year":2019,"cited_by_count":1},{"year":2016,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}