{"id":"https://openalex.org/W1991723389","doi":"https://doi.org/10.1109/test.2014.7035300","title":"Challenges of testing 100M chips","display_name":"Challenges of testing 100M chips","publication_year":2014,"publication_date":"2014-10-01","ids":{"openalex":"https://openalex.org/W1991723389","doi":"https://doi.org/10.1109/test.2014.7035300","mag":"1991723389"},"language":"en","primary_location":{"id":"doi:10.1109/test.2014.7035300","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2014.7035300","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 International Test Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5053662536","display_name":"Sajjad Pagarkar","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Sajjad Pagarkar","raw_affiliation_strings":["Qualcomm, USA"],"affiliations":[{"raw_affiliation_string":"Qualcomm, USA","institution_ids":["https://openalex.org/I4210087596"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5053662536"],"corresponding_institution_ids":["https://openalex.org/I4210087596"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.06652475,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"1"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9513000249862671,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9513000249862671,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.90420001745224,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.572615385055542},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.37613606452941895},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19264614582061768}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.572615385055542},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.37613606452941895},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19264614582061768}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2014.7035300","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2014.7035300","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 International Test Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.6200000047683716}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W4391913857","https://openalex.org/W2358668433","https://openalex.org/W4396701345","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W4396696052"],"abstract_inverted_index":{"Volume":[0],"manufacturing":[1,63,161],"often":[2,34],"highlights":[3],"aspects":[4],"of":[5,79,114,219],"post":[6],"silicon":[7],"data":[8],"analysis":[9],"that":[10,83],"are":[11,107],"otherwise":[12],"overlooked.":[13],"Yield-overkill,":[14],"in":[15,89,157,166,200],"simple":[16],"terms,":[17],"can":[18],"be":[19,134,184],"defined":[20],"as":[21],"failing":[22],"perfectly":[23],"good/functional":[24],"devices":[25],"due":[26],"to":[27,36,59,183,188,211],"device":[28],"testability.":[29],"Such":[30],"yield":[31,153],"overkill":[32],"is":[33,52,74,181],"linked":[35],"tight":[37],"test":[38],"conditions":[39],"using":[40],"advanced":[41],"fault":[42,57,203],"models":[43,204],"and":[44,148,160,214,227],"functional":[45],"tests.":[46],"Transition":[47],"Delay":[48],"Fault":[49],"Model":[50],"(TDF)":[51],"one":[53],"such":[54,98,175],"widely":[55],"used":[56],"model":[58],"detect":[60],"speed":[61],"related":[62],"defects.":[64],"\u201cHow":[65],"do":[66],"I":[67],"know":[68],"whether":[69],"a":[70,101,111,115,131,135,197],"given":[71],"TDF":[72,116],"fallout":[73],"real":[75,176],"or":[76],"an":[77],"artifact":[78],"some":[80],"test/process/design":[81],"combination":[82],"may":[84,118],"never":[85],"ever":[86,162],"get":[87],"exercised":[88],"the":[90,105,152,207,216],"system":[91,144],"(functional":[92],"testing)?\u201d.":[93],"We":[94],"deal":[95],"with":[96,151,170],"analyzing":[97],"situations":[99],"on":[100],"daily":[102],"basis.":[103],"Often":[104],"decisions":[106],"more":[108],"scientific,":[109],"where":[110],"successful":[112],"PFA":[113],"failure":[117],"reveal":[119],"process":[120,168],"issues":[121],"(thinned":[122],"oxide,":[123],"weak":[124],"metal,":[125],"broken":[126],"via":[127],"etc)":[128,147],"but":[129],"many":[130],"times":[132],"could":[133],"ghost":[136],"hunt":[137],"-":[138,205],"burning":[139],"debug":[140],"cycles":[141],"(vector,":[142],"design,":[143],"correlation,":[145],"FA":[146],"eventually":[149],"living":[150],"overkill.":[154],"With":[155],"complexities":[156],"semiconductor":[158],"design":[159],"increasing":[163,171],"(faster":[164],"designs":[165],"small":[167],"nodes":[169],"quality":[172],"requirements)":[173],"solving":[174],"time":[177],"low":[178],"level":[179],"problems":[180],"going":[182],"critical":[185],"for":[186],"companies":[187],"maintain":[189],"their":[190],"profitability.":[191],"The":[192],"EDA":[193,208],"industry":[194,209],"has":[195],"come":[196],"long":[198],"way":[199],"abstracting":[201],"advance":[202],"however,":[206],"needs":[210],"go":[212],"further":[213],"address":[215],"fine":[217],"subtleties":[218],"design/test/process":[220],"interactions":[221],"ensuring":[222],"rightful":[223],"balance":[224],"between":[225],"cost":[226],"quality.":[228]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}