{"id":"https://openalex.org/W2083758827","doi":"https://doi.org/10.1109/test.2013.6651894","title":"Fault diagnosis of TSV-based interconnects in 3-D stacked designs","display_name":"Fault diagnosis of TSV-based interconnects in 3-D stacked designs","publication_year":2013,"publication_date":"2013-09-01","ids":{"openalex":"https://openalex.org/W2083758827","doi":"https://doi.org/10.1109/test.2013.6651894","mag":"2083758827"},"language":"en","primary_location":{"id":"doi:10.1109/test.2013.6651894","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2013.6651894","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International Test Conference (ITC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5080960636","display_name":"Janusz Rajski","orcid":"https://orcid.org/0000-0003-2124-447X"},"institutions":[{"id":"https://openalex.org/I105695857","display_name":"Siemens (Hungary)","ror":"https://ror.org/01rk7mv85","country_code":"HU","type":"company","lineage":["https://openalex.org/I105695857","https://openalex.org/I1325886976"]},{"id":"https://openalex.org/I4210156212","display_name":"Mentor Technologies","ror":"https://ror.org/05vewsj04","country_code":"US","type":"other","lineage":["https://openalex.org/I4210156212"]}],"countries":["HU","US"],"is_corresponding":false,"raw_author_name":"J. Rajski","raw_affiliation_strings":["Mentor Graphics Corporation, Wilsonville, USA","Mentor Graphics Corp. Wilsonville, OR, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mentor Graphics Corporation, Wilsonville, USA","institution_ids":["https://openalex.org/I4210156212"]},{"raw_affiliation_string":"Mentor Graphics Corp. Wilsonville, OR, USA","institution_ids":["https://openalex.org/I105695857"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5072675590","display_name":"Jerzy Tyszer","orcid":"https://orcid.org/0000-0001-9722-2344"},"institutions":[{"id":"https://openalex.org/I46597724","display_name":"Pozna\u0144 University of Technology","ror":"https://ror.org/00p7p3302","country_code":"PL","type":"education","lineage":["https://openalex.org/I46597724"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"J. Tyszer","raw_affiliation_strings":["Pozna\u0144 University of Technology, Pozna\u0144, Poland","Poznan University of Technology, Poznan, Poland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Pozna\u0144 University of Technology, Pozna\u0144, Poland","institution_ids":["https://openalex.org/I46597724"]},{"raw_affiliation_string":"Poznan University of Technology, Poznan, Poland","institution_ids":["https://openalex.org/I46597724"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":17,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"9"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5822548866271973},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.5028485655784607},{"id":"https://openalex.org/keywords/fault","display_name":"Fault (geology)","score":0.47327208518981934},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.371732234954834},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3579062819480896},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.33780425786972046},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.32450607419013977},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18627163767814636},{"id":"https://openalex.org/keywords/geology","display_name":"Geology","score":0.16446861624717712}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5822548866271973},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.5028485655784607},{"id":"https://openalex.org/C175551986","wikidata":"https://www.wikidata.org/wiki/Q47089","display_name":"Fault (geology)","level":2,"score":0.47327208518981934},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.371732234954834},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3579062819480896},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.33780425786972046},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.32450607419013977},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18627163767814636},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.16446861624717712},{"id":"https://openalex.org/C165205528","wikidata":"https://www.wikidata.org/wiki/Q83371","display_name":"Seismology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2013.6651894","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2013.6651894","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International Test Conference (ITC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.49000000953674316}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":43,"referenced_works":["https://openalex.org/W1969131477","https://openalex.org/W1972749955","https://openalex.org/W1981022355","https://openalex.org/W1994257370","https://openalex.org/W1996816854","https://openalex.org/W2018761392","https://openalex.org/W2018843712","https://openalex.org/W2023223749","https://openalex.org/W2023976101","https://openalex.org/W2040650567","https://openalex.org/W2043004448","https://openalex.org/W2052347136","https://openalex.org/W2062899780","https://openalex.org/W2064712157","https://openalex.org/W2068686881","https://openalex.org/W2070914725","https://openalex.org/W2075111830","https://openalex.org/W2075403904","https://openalex.org/W2082046960","https://openalex.org/W2084894644","https://openalex.org/W2085252411","https://openalex.org/W2088417458","https://openalex.org/W2090396476","https://openalex.org/W2095790208","https://openalex.org/W2107304970","https://openalex.org/W2112647513","https://openalex.org/W2115279958","https://openalex.org/W2123665171","https://openalex.org/W2127545620","https://openalex.org/W2132155220","https://openalex.org/W2132321891","https://openalex.org/W2139407027","https://openalex.org/W2143502515","https://openalex.org/W2148422687","https://openalex.org/W2158277795","https://openalex.org/W2158323053","https://openalex.org/W2166052445","https://openalex.org/W2168584827","https://openalex.org/W2169331336","https://openalex.org/W3144072891","https://openalex.org/W6663275469","https://openalex.org/W6674386616","https://openalex.org/W6677096623"],"related_works":["https://openalex.org/W4376453582","https://openalex.org/W2115140794","https://openalex.org/W2041120224","https://openalex.org/W3147033875","https://openalex.org/W1504320321","https://openalex.org/W1568390478","https://openalex.org/W2067902980","https://openalex.org/W2764722704","https://openalex.org/W4312275919","https://openalex.org/W2338293335"],"abstract_inverted_index":{"Through-silicon":[0],"vias":[1],"(TSVs)":[2],"are":[3,73],"crucial":[4],"elements":[5],"of":[6,16,59,66],"3-D":[7,17],"bonded":[8],"integrated":[9],"circuits.":[10],"Since":[11],"they":[12],"connect":[13],"different":[14],"layers":[15],"stacks,":[18],"their":[19,67],"proper":[20],"operation":[21],"is":[22],"an":[23],"essential":[24],"prerequisite":[25],"for":[26,35,52],"the":[27,60],"system":[28],"function.":[29],"This":[30],"paper":[31],"describes":[32],"a":[33],"procedure":[34],"deriving":[36],"fault":[37],"diagnosis":[38],"test":[39,62],"sequences":[40],"to":[41],"identify":[42],"single":[43],"and":[44,57,69,72],"multiple":[45],"defective":[46],"TSVs.":[47],"Additional":[48],"experimental":[49],"results":[50],"obtained":[51],"pseudorandom":[53],"patterns":[54],"illustrate":[55],"feasibility":[56],"robustness":[58],"proposed":[61],"schemes":[63],"in":[64],"terms":[65],"detection":[68],"diagnostic":[70],"capabilities":[71],"reported":[74],"herein.":[75]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":3},{"year":2021,"cited_by_count":2},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}