{"id":"https://openalex.org/W1977546455","doi":"https://doi.org/10.1109/test.2013.6651893","title":"Test and debug strategy for TSMC CoWoS™ stacking process based heterogeneous 3D IC: A silicon case study","display_name":"Test and debug strategy for TSMC CoWoS™ stacking process based heterogeneous 3D IC: A silicon case study","publication_year":2013,"publication_date":"2013-09-01","ids":{"openalex":"https://openalex.org/W1977546455","doi":"https://doi.org/10.1109/test.2013.6651893","mag":"1977546455"},"language":"en","primary_location":{"id":"doi:10.1109/test.2013.6651893","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2013.6651893","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International Test Conference (ITC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5026985039","display_name":"Sandeep Goel","orcid":"https://orcid.org/0000-0002-0911-8975"},"institutions":[{"id":"https://openalex.org/I1334877674","display_name":"Taiwan Semiconductor Manufacturing Company (United States)","ror":"https://ror.org/02rvfjx92","country_code":"US","type":"company","lineage":["https://openalex.org/I1334877674","https://openalex.org/I4210120917"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sandeep Kumar Goel","raw_affiliation_strings":["TSMC, San Jose, CA, USA","TSMC, San Jose, CA, USA#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC, San Jose, CA, USA","institution_ids":["https://openalex.org/I1334877674"]},{"raw_affiliation_string":"TSMC, San Jose, CA, USA#TAB#","institution_ids":["https://openalex.org/I1334877674"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5029012323","display_name":"Saman Adham","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153079","display_name":"National Defence Medical Centre","ror":"https://ror.org/04asyj427","country_code":"CA","type":"healthcare","lineage":["https://openalex.org/I4210153079"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Saman Adham","raw_affiliation_strings":["TSMC, Ottawa, ON, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC, Ottawa, ON, Canada","institution_ids":["https://openalex.org/I4210153079"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5086368713","display_name":"Min-Jer Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I1334877674","display_name":"Taiwan Semiconductor Manufacturing Company (United States)","ror":"https://ror.org/02rvfjx92","country_code":"US","type":"company","lineage":["https://openalex.org/I1334877674","https://openalex.org/I4210120917"]},{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW","US"],"is_corresponding":false,"raw_author_name":"Min-Jer Wang","raw_affiliation_strings":["TSMC, Hsinchu, Taiwan, R.O.C","[TSMC, HsinChu, Taiwan]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC, Hsinchu, Taiwan, R.O.C","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"[TSMC, HsinChu, Taiwan]","institution_ids":["https://openalex.org/I1334877674"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063980328","display_name":"Ji-Jan Chen","orcid":null},"institutions":[{"id":"https://openalex.org/I1334877674","display_name":"Taiwan Semiconductor Manufacturing Company (United States)","ror":"https://ror.org/02rvfjx92","country_code":"US","type":"company","lineage":["https://openalex.org/I1334877674","https://openalex.org/I4210120917"]},{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW","US"],"is_corresponding":false,"raw_author_name":"Ji-Jan Chen","raw_affiliation_strings":["TSMC, Hsinchu, Taiwan, R.O.C","[TSMC, HsinChu, Taiwan]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC, Hsinchu, Taiwan, R.O.C","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"[TSMC, HsinChu, Taiwan]","institution_ids":["https://openalex.org/I1334877674"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087987159","display_name":"Tze-Chiang Huang","orcid":null},"institutions":[{"id":"https://openalex.org/I1334877674","display_name":"Taiwan Semiconductor Manufacturing Company (United States)","ror":"https://ror.org/02rvfjx92","country_code":"US","type":"company","lineage":["https://openalex.org/I1334877674","https://openalex.org/I4210120917"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tze-Chiang Huang","raw_affiliation_strings":["TSMC, San Jose, CA, USA","TSMC, San Jose, CA, USA#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC, San Jose, CA, USA","institution_ids":["https://openalex.org/I1334877674"]},{"raw_affiliation_string":"TSMC, San Jose, CA, USA#TAB#","institution_ids":["https://openalex.org/I1334877674"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045180151","display_name":"Ashok Mehta","orcid":"https://orcid.org/0000-0003-1587-343X"},"institutions":[{"id":"https://openalex.org/I1334877674","display_name":"Taiwan Semiconductor Manufacturing Company (United States)","ror":"https://ror.org/02rvfjx92","country_code":"US","type":"company","lineage":["https://openalex.org/I1334877674","https://openalex.org/I4210120917"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ashok Mehta","raw_affiliation_strings":["TSMC, San Jose, CA, USA","TSMC, San Jose, CA, USA#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC, San Jose, CA, USA","institution_ids":["https://openalex.org/I1334877674"]},{"raw_affiliation_string":"TSMC, San Jose, CA, USA#TAB#","institution_ids":["https://openalex.org/I1334877674"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044435315","display_name":"Frank Lee","orcid":"https://orcid.org/0000-0001-8169-3440"},"institutions":[{"id":"https://openalex.org/I1334877674","display_name":"Taiwan Semiconductor Manufacturing Company (United States)","ror":"https://ror.org/02rvfjx92","country_code":"US","type":"company","lineage":["https://openalex.org/I1334877674","https://openalex.org/I4210120917"]},{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW","US"],"is_corresponding":false,"raw_author_name":"Frank Lee","raw_affiliation_strings":["TSMC, Hsinchu, Taiwan, R.O.C","[TSMC, HsinChu, Taiwan]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"TSMC, Hsinchu, Taiwan, R.O.C","institution_ids":["https://openalex.org/I4210120917"]},{"raw_affiliation_string":"[TSMC, HsinChu, Taiwan]","institution_ids":["https://openalex.org/I1334877674"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061006452","display_name":"Vivek Chickermane","orcid":"https://orcid.org/0000-0003-1232-470X"},"institutions":[{"id":"https://openalex.org/I66217453","display_name":"Cadence Design Systems (United States)","ror":"https://ror.org/04w8xa018","country_code":"US","type":"company","lineage":["https://openalex.org/I66217453"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Vivek Chickermane","raw_affiliation_strings":["Cadence Design Systems, Endicott, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Cadence Design Systems, Endicott, NY, USA","institution_ids":["https://openalex.org/I66217453"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006214290","display_name":"Brion Keller","orcid":null},"institutions":[{"id":"https://openalex.org/I66217453","display_name":"Cadence Design Systems (United States)","ror":"https://ror.org/04w8xa018","country_code":"US","type":"company","lineage":["https://openalex.org/I66217453"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Brion Keller","raw_affiliation_strings":["Cadence Design Systems, Endicott, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Cadence Design Systems, Endicott, NY, USA","institution_ids":["https://openalex.org/I66217453"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004578449","display_name":"Thomas Valind","orcid":null},"institutions":[{"id":"https://openalex.org/I66217453","display_name":"Cadence Design Systems (United States)","ror":"https://ror.org/04w8xa018","country_code":"US","type":"company","lineage":["https://openalex.org/I66217453"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Thomas Valind","raw_affiliation_strings":["Cadence Design Systems, Endicott, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Cadence Design Systems, Endicott, NY, USA","institution_ids":["https://openalex.org/I66217453"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109158893","display_name":"Subhasish Mukherjee","orcid":null},"institutions":[{"id":"https://openalex.org/I4210111610","display_name":"Cadence Design Systems (India)","ror":"https://ror.org/027qdw603","country_code":"IN","type":"company","lineage":["https://openalex.org/I4210111610","https://openalex.org/I66217453"]},{"id":"https://openalex.org/I66217453","display_name":"Cadence Design Systems (United States)","ror":"https://ror.org/04w8xa018","country_code":"US","type":"company","lineage":["https://openalex.org/I66217453"]}],"countries":["IN","US"],"is_corresponding":false,"raw_author_name":"Subhasish Mukherjee","raw_affiliation_strings":["Cadence Design Systems, Noida, UP, India","Cadence Design Systems, Noida, India#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Cadence Design Systems, Noida, UP, India","institution_ids":["https://openalex.org/I4210111610"]},{"raw_affiliation_string":"Cadence Design Systems, Noida, India#TAB#","institution_ids":["https://openalex.org/I66217453"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5010783552","display_name":"Navdeep Sood","orcid":null},"institutions":[{"id":"https://openalex.org/I4210111610","display_name":"Cadence Design Systems (India)","ror":"https://ror.org/027qdw603","country_code":"IN","type":"company","lineage":["https://openalex.org/I4210111610","https://openalex.org/I66217453"]},{"id":"https://openalex.org/I66217453","display_name":"Cadence Design Systems (United States)","ror":"https://ror.org/04w8xa018","country_code":"US","type":"company","lineage":["https://openalex.org/I66217453"]}],"countries":["IN","US"],"is_corresponding":false,"raw_author_name":"Navdeep Sood","raw_affiliation_strings":["Cadence Design Systems, Noida, UP, India","Cadence Design Systems, Noida, India#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Cadence Design Systems, Noida, UP, India","institution_ids":["https://openalex.org/I4210111610"]},{"raw_affiliation_string":"Cadence Design Systems, Noida, India#TAB#","institution_ids":["https://openalex.org/I66217453"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077409923","display_name":"Jeongho Cho","orcid":"https://orcid.org/0000-0001-5162-1745"},"institutions":[{"id":"https://openalex.org/I134353371","display_name":"SK Group (South Korea)","ror":"https://ror.org/03696td91","country_code":"KR","type":"company","lineage":["https://openalex.org/I134353371"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jeongho Cho","raw_affiliation_strings":["SK hynix, Icheon-si, Gyeonggi-do, Korea","SK hynix, Icheon, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SK hynix, Icheon-si, Gyeonggi-do, Korea","institution_ids":["https://openalex.org/I134353371"]},{"raw_affiliation_string":"SK hynix, Icheon, South Korea","institution_ids":["https://openalex.org/I134353371"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5082738551","display_name":"Hayden Hyungdong Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I134353371","display_name":"SK Group (South Korea)","ror":"https://ror.org/03696td91","country_code":"KR","type":"company","lineage":["https://openalex.org/I134353371"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hayden Hyungdong Lee","raw_affiliation_strings":["SK hynix, Icheon-si, Gyeonggi-do, Korea","SK hynix, Icheon, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SK hynix, Icheon-si, Gyeonggi-do, Korea","institution_ids":["https://openalex.org/I134353371"]},{"raw_affiliation_string":"SK hynix, Icheon, South Korea","institution_ids":["https://openalex.org/I134353371"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021187329","display_name":"Jun\u2013Gi Choi","orcid":null},"institutions":[{"id":"https://openalex.org/I134353371","display_name":"SK Group (South Korea)","ror":"https://ror.org/03696td91","country_code":"KR","type":"company","lineage":["https://openalex.org/I134353371"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jungi Choi","raw_affiliation_strings":["SK hynix, Icheon-si, Gyeonggi-do, Korea","SK hynix, Icheon, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SK hynix, Icheon-si, Gyeonggi-do, Korea","institution_ids":["https://openalex.org/I134353371"]},{"raw_affiliation_string":"SK hynix, Icheon, South Korea","institution_ids":["https://openalex.org/I134353371"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5015153865","display_name":"Sangdoo Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I134353371","display_name":"SK Group (South Korea)","ror":"https://ror.org/03696td91","country_code":"KR","type":"company","lineage":["https://openalex.org/I134353371"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sangdoo Kim","raw_affiliation_strings":["SK hynix, Icheon-si, Gyeonggi-do, Korea","SK hynix, Icheon, South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SK hynix, Icheon-si, Gyeonggi-do, Korea","institution_ids":["https://openalex.org/I134353371"]},{"raw_affiliation_string":"SK hynix, Icheon, South Korea","institution_ids":["https://openalex.org/I134353371"]}]}],"institutions":[],"countries_distinct_count":5,"institutions_distinct_count":6,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":4.8636,"has_fulltext":false,"cited_by_count":37,"citation_normalized_percentile":{"value":0.96092752,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"10"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9973999857902527,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9962000250816345,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.8201411962509155},{"id":"https://openalex.org/keywords/dram","display_name":"Dram","score":0.7865328788757324},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.7462988495826721},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.5180742740631104},{"id":"https://openalex.org/keywords/debugging","display_name":"Debugging","score":0.49601635336875916},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.48298919200897217},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.4693912863731384},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.45151758193969727},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.44198745489120483},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.43981385231018066},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.43885284662246704},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.43463706970214844},{"id":"https://openalex.org/keywords/design-for-testing","display_name":"Design for testing","score":0.42059239745140076},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.3833865225315094},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.375154584646225},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.3542993366718292},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.2849541902542114},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.23282980918884277},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2112836241722107},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.19036102294921875},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.18762657046318054},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.1851818561553955},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.10041514039039612},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.09059640765190125}],"concepts":[{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.8201411962509155},{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.7865328788757324},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.7462988495826721},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.5180742740631104},{"id":"https://openalex.org/C168065819","wikidata":"https://www.wikidata.org/wiki/Q845566","display_name":"Debugging","level":2,"score":0.49601635336875916},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.48298919200897217},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.4693912863731384},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.45151758193969727},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.44198745489120483},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.43981385231018066},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.43885284662246704},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.43463706970214844},{"id":"https://openalex.org/C190874656","wikidata":"https://www.wikidata.org/wiki/Q5264347","display_name":"Design for testing","level":3,"score":0.42059239745140076},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.3833865225315094},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.375154584646225},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.3542993366718292},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.2849541902542114},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.23282980918884277},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2112836241722107},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.19036102294921875},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.18762657046318054},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.1851818561553955},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.10041514039039612},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.09059640765190125},{"id":"https://openalex.org/C51234621","wikidata":"https://www.wikidata.org/wiki/Q2149495","display_name":"Testability","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2013.6651893","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2013.6651893","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International Test Conference (ITC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.5,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W390323645","https://openalex.org/W2046694142","https://openalex.org/W2052347136","https://openalex.org/W2056969337","https://openalex.org/W2057259846","https://openalex.org/W2058504720","https://openalex.org/W2070914725","https://openalex.org/W2137893918","https://openalex.org/W2149593163","https://openalex.org/W2483251860","https://openalex.org/W4239250096"],"related_works":["https://openalex.org/W1990828594","https://openalex.org/W2011182927","https://openalex.org/W2310189477","https://openalex.org/W2333804548","https://openalex.org/W2044721343","https://openalex.org/W2543304869","https://openalex.org/W2019002696","https://openalex.org/W2072269247","https://openalex.org/W2047315796","https://openalex.org/W2002219888"],"abstract_inverted_index":{"Recent":[0],"advances":[1],"in":[2,22,29,81,92],"semiconductor":[3],"process":[4,25,43],"technology":[5],"especially":[6],"interconnects":[7],"using":[8],"Through":[9],"Silicon":[10,144],"Vias":[11],"(TSVs)":[12],"enable":[13],"the":[14,36,75,93,111,150],"heterogeneous":[15,97],"system":[16],"integration":[17],"where":[18],"dies":[19,98],"are":[20,163],"implemented":[21],"dedicated,":[23],"optimized":[24],"technologies":[26],"and":[27,77,103,160,165],"stacked":[28,86,109],"a":[30,45,83,101,104,114,121,135,167],"3D":[31,52,66,89,139,161],"form.":[32],"TSMC":[33],"has":[34],"developed":[35],"CoWoS\u2122":[37,84],"(Chip":[38],"on":[39,41,110],"Wafer":[40],"Substrate)":[42],"as":[44],"design":[46,90],"paradigm":[47],"to":[48,65,69],"assemble":[49],"silicon":[50],"interposer-based":[51],"ICs.":[53],"To":[54],"reach":[55],"quality":[56],"requirements":[57],"for":[58,132],"volume":[59],"production,":[60],"several":[61],"test":[62,76,123,128,151],"challenges":[63,152],"related":[64],"ICs":[67,162],"need":[68],"be":[70,154],"addressed.":[71],"This":[72],"paper":[73,94],"describes":[74],"debug":[78],"strategy":[79],"used":[80],"designing":[82],"based":[85],"IC.":[87],"The":[88],"presented":[91],"contains":[95],"three":[96],"(a":[99],"logic,":[100],"DRAM,":[102],"JEDEC":[105],"Wide-I/O":[106],"compliant":[107],"DRAM)":[108],"top":[112],"of":[113,149],"passive":[115,118],"interposer.":[116],"For":[117],"interposer":[119],"testing,":[120],"novel":[122,136],"methodology":[124],"called":[125],"Pretty-Good-Die":[126],"(PGD)":[127],"is":[129,142],"presented,":[130],"while":[131],"inter-die":[133],"test,":[134],"scalable":[137],"multi-tower":[138],"DFT":[140],"architecture":[141],"presented.":[143],"results":[145],"show":[146],"that":[147],"most":[148],"can":[153],"solved":[155],"efficiently":[156],"if":[157],"planned":[158],"properly;":[159],"reality":[164],"not":[166],"fiction":[168],"anymore.":[169]},"counts_by_year":[{"year":2026,"cited_by_count":3},{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":6},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":5},{"year":2016,"cited_by_count":5},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":5}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}