{"id":"https://openalex.org/W2011955149","doi":"https://doi.org/10.1109/test.2012.6401545","title":"Spatial estimation of wafer measurement parameters using Gaussian process models","display_name":"Spatial estimation of wafer measurement parameters using Gaussian process models","publication_year":2012,"publication_date":"2012-11-01","ids":{"openalex":"https://openalex.org/W2011955149","doi":"https://doi.org/10.1109/test.2012.6401545","mag":"2011955149"},"language":"en","primary_location":{"id":"doi:10.1109/test.2012.6401545","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2012.6401545","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 IEEE International Test Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5023142218","display_name":"Nathan Kupp","orcid":null},"institutions":[{"id":"https://openalex.org/I32971472","display_name":"Yale University","ror":"https://ror.org/03v76x132","country_code":"US","type":"education","lineage":["https://openalex.org/I32971472"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Nathan Kupp","raw_affiliation_strings":["Department of Electrical Engineering, Yale University, New Haven, CT 06511","Dept. of Electrical Eng. Yale University New Haven, CT 06511"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, Yale University, New Haven, CT 06511","institution_ids":["https://openalex.org/I32971472"]},{"raw_affiliation_string":"Dept. of Electrical Eng. Yale University New Haven, CT 06511","institution_ids":["https://openalex.org/I32971472"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101967980","display_name":"Ke Huang","orcid":"https://orcid.org/0000-0002-1587-9877"},"institutions":[{"id":"https://openalex.org/I162577319","display_name":"The University of Texas at Dallas","ror":"https://ror.org/049emcs32","country_code":"US","type":"education","lineage":["https://openalex.org/I162577319"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ke Huang","raw_affiliation_strings":["Department of Electrical Engineering, The University of Texas at Dallas, Richardson, TX 75080"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, The University of Texas at Dallas, Richardson, TX 75080","institution_ids":["https://openalex.org/I162577319"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039431688","display_name":"John M. Carulli","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"John Carulli","raw_affiliation_strings":["Texas Instruments Inc., 12500 TI Boulevard, MS 8741, Dallas, TX 75243"],"affiliations":[{"raw_affiliation_string":"Texas Instruments Inc., 12500 TI Boulevard, MS 8741, Dallas, TX 75243","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5078818440","display_name":"Yiorgos Makris","orcid":"https://orcid.org/0000-0002-4322-0068"},"institutions":[{"id":"https://openalex.org/I162577319","display_name":"The University of Texas at Dallas","ror":"https://ror.org/049emcs32","country_code":"US","type":"education","lineage":["https://openalex.org/I162577319"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yiorgos Makris","raw_affiliation_strings":["Department of Electrical Engineering, The University of Texas at Dallas, Richardson, TX 75080"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, The University of Texas at Dallas, Richardson, TX 75080","institution_ids":["https://openalex.org/I162577319"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5023142218"],"corresponding_institution_ids":["https://openalex.org/I32971472"],"apc_list":null,"apc_paid":null,"fwci":8.2176,"has_fulltext":false,"cited_by_count":25,"citation_normalized_percentile":{"value":0.97048464,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"8"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10848","display_name":"Advanced Multi-Objective Optimization Algorithms","score":0.9940999746322632,"subfield":{"id":"https://openalex.org/subfields/1703","display_name":"Computational Theory and Mathematics"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9886000156402588,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.8818769454956055},{"id":"https://openalex.org/keywords/wafer-testing","display_name":"Wafer testing","score":0.5655729174613953},{"id":"https://openalex.org/keywords/gaussian-process","display_name":"Gaussian process","score":0.45750027894973755},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.45622357726097107},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.45142143964767456},{"id":"https://openalex.org/keywords/wafer-backgrinding","display_name":"Wafer backgrinding","score":0.4495767056941986},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.4452393054962158},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4235132038593292},{"id":"https://openalex.org/keywords/gaussian","display_name":"Gaussian","score":0.4137870967388153},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.38317620754241943},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3770741820335388},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.32537734508514404},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.26874083280563354},{"id":"https://openalex.org/keywords/wafer-dicing","display_name":"Wafer dicing","score":0.1996576488018036},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.1539679765701294},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.13522017002105713}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.8818769454956055},{"id":"https://openalex.org/C44445679","wikidata":"https://www.wikidata.org/wiki/Q2538844","display_name":"Wafer testing","level":3,"score":0.5655729174613953},{"id":"https://openalex.org/C61326573","wikidata":"https://www.wikidata.org/wiki/Q1496376","display_name":"Gaussian process","level":3,"score":0.45750027894973755},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.45622357726097107},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.45142143964767456},{"id":"https://openalex.org/C8002213","wikidata":"https://www.wikidata.org/wiki/Q7959420","display_name":"Wafer backgrinding","level":4,"score":0.4495767056941986},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.4452393054962158},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4235132038593292},{"id":"https://openalex.org/C163716315","wikidata":"https://www.wikidata.org/wiki/Q901177","display_name":"Gaussian","level":2,"score":0.4137870967388153},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.38317620754241943},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3770741820335388},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.32537734508514404},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.26874083280563354},{"id":"https://openalex.org/C165013422","wikidata":"https://www.wikidata.org/wiki/Q4388382","display_name":"Wafer dicing","level":3,"score":0.1996576488018036},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1539679765701294},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.13522017002105713},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2012.6401545","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2012.6401545","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 IEEE International Test Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.6299999952316284}],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"},{"id":"https://openalex.org/F4320306087","display_name":"Semiconductor Research Corporation","ror":"https://ror.org/047z4n946"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":20,"referenced_works":["https://openalex.org/W1480376833","https://openalex.org/W1526146785","https://openalex.org/W1554944419","https://openalex.org/W1560724230","https://openalex.org/W1746819321","https://openalex.org/W2031211406","https://openalex.org/W2108648342","https://openalex.org/W2116080338","https://openalex.org/W2129690060","https://openalex.org/W2139497890","https://openalex.org/W2148603752","https://openalex.org/W2154605514","https://openalex.org/W2156909104","https://openalex.org/W2167175161","https://openalex.org/W2170908768","https://openalex.org/W2491057826","https://openalex.org/W3195149063","https://openalex.org/W4211049957","https://openalex.org/W6631556622","https://openalex.org/W6685230354"],"related_works":["https://openalex.org/W2540312267","https://openalex.org/W2591846699","https://openalex.org/W2484884144","https://openalex.org/W2031579205","https://openalex.org/W2593225652","https://openalex.org/W2183056701","https://openalex.org/W2065601166","https://openalex.org/W2070188681","https://openalex.org/W2367528910","https://openalex.org/W2742900239"],"abstract_inverted_index":{"In":[0,91],"the":[1,20,38,41,56,60,79,86,89,126,144],"course":[2],"of":[3,40,52,88,156,176],"semiconductor":[4],"manufacturing,":[5],"various":[6],"e-test":[7,103,140,177],"measurements":[8,32,53,65,104,178],"(also":[9],"known":[10],"as":[11,78],"inline":[12],"or":[13,154],"kerf":[14],"measurements)":[15],"are":[16,33,66],"collected":[17],"to":[18,23,105,122,138],"monitor":[19],"health-of-line":[21],"and":[22,48,75,135,147],"make":[24],"wafer":[25,42,111,127],"scrap":[26],"decisions":[27],"preceding":[28],"final":[29],"test.":[30],"These":[31],"typically":[34],"sampled":[35,102],"spatially":[36],"across":[37,85],"surface":[39,87],"from":[43,167],"between-die":[44],"scribe":[45],"line":[46],"sites,":[47],"include":[49],"a":[50,96,110],"variety":[51],"that":[54],"characterize":[55],"wafer's":[57],"position":[58],"in":[59],"process":[61,74,114,134,157],"distribution.":[62],"However,":[63],"these":[64],"often":[67],"only":[68],"used":[69],"for":[70,99],"wafer-level":[71],"characterization":[72],"by":[73],"test":[76,136],"teams,":[77],"sampling":[80],"can":[81],"be":[82],"quite":[83],"sparse":[84],"wafer.":[90],"this":[92],"work,":[93],"we":[94,117,169],"introduce":[95,118],"novel":[97],"methodology":[98,132],"extrapolating":[100],"sparsely":[101],"every":[106],"die":[107,145],"location":[108],"on":[109,179],"using":[112],"Gaussian":[113],"models.":[115],"Moreover,":[116],"radial":[119],"variation":[120,124],"modeling":[121],"address":[123],"along":[125],"center-to-edge":[128],"radius.":[129],"The":[130],"proposed":[131],"permits":[133],"engineers":[137],"examine":[139],"measurement":[141],"outcomes":[142],"at":[143],"level,":[146],"makes":[148],"no":[149],"assumptions":[150],"about":[151],"wafer-to-wafer":[152],"similarity":[153],"stationarity":[155],"statistics":[158],"over":[159],"time.":[160],"Using":[161],"high":[162],"volume":[163],"manufacturing":[164],"(HVM)":[165],"data":[166],"industry,":[168],"demonstrate":[170],"highly":[171],"accurate":[172],"cross-wafer":[173],"spatial":[174],"predictions":[175],"more":[180],"than":[181],"8,000":[182],"wafers.":[183]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":2},{"year":2016,"cited_by_count":3},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":6},{"year":2013,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}