{"id":"https://openalex.org/W2112559786","doi":"https://doi.org/10.1109/test.2012.6401533","title":"Cell-aware Production test results from a 32-nm notebook processor","display_name":"Cell-aware Production test results from a 32-nm notebook processor","publication_year":2012,"publication_date":"2012-11-01","ids":{"openalex":"https://openalex.org/W2112559786","doi":"https://doi.org/10.1109/test.2012.6401533","mag":"2112559786"},"language":"en","primary_location":{"id":"doi:10.1109/test.2012.6401533","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2012.6401533","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 IEEE International Test Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5065187948","display_name":"Friedrich Hapke","orcid":"https://orcid.org/0000-0001-8744-3039"},"institutions":[{"id":"https://openalex.org/I105695857","display_name":"Siemens (Hungary)","ror":"https://ror.org/01rk7mv85","country_code":"HU","type":"company","lineage":["https://openalex.org/I105695857","https://openalex.org/I1325886976"]}],"countries":["HU"],"is_corresponding":true,"raw_author_name":"F. Hapke","raw_affiliation_strings":["Mentor Graphics Hamburg Germany","Mentor Graphics, Hamburg, Germany"],"affiliations":[{"raw_affiliation_string":"Mentor Graphics Hamburg Germany","institution_ids":["https://openalex.org/I105695857"]},{"raw_affiliation_string":"Mentor Graphics, Hamburg, Germany","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048205919","display_name":"Michael Reese","orcid":null},"institutions":[{"id":"https://openalex.org/I4210137977","display_name":"Advanced Micro Devices (United States)","ror":"https://ror.org/04kd6c783","country_code":"US","type":"company","lineage":["https://openalex.org/I4210137977"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Reese","raw_affiliation_strings":["AMD, Inc., Austin, Texas, USA"],"affiliations":[{"raw_affiliation_string":"AMD, Inc., Austin, Texas, USA","institution_ids":["https://openalex.org/I4210137977"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5086523644","display_name":"J. Rivers","orcid":null},"institutions":[{"id":"https://openalex.org/I4210137977","display_name":"Advanced Micro Devices (United States)","ror":"https://ror.org/04kd6c783","country_code":"US","type":"company","lineage":["https://openalex.org/I4210137977"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Rivers","raw_affiliation_strings":["AMD, Inc., Austin, Texas, USA"],"affiliations":[{"raw_affiliation_string":"AMD, Inc., Austin, Texas, USA","institution_ids":["https://openalex.org/I4210137977"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034290446","display_name":"Ann Over","orcid":null},"institutions":[{"id":"https://openalex.org/I4210137977","display_name":"Advanced Micro Devices (United States)","ror":"https://ror.org/04kd6c783","country_code":"US","type":"company","lineage":["https://openalex.org/I4210137977"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Over","raw_affiliation_strings":["AMD, Inc., Austin, Texas, USA"],"affiliations":[{"raw_affiliation_string":"AMD, Inc., Austin, Texas, USA","institution_ids":["https://openalex.org/I4210137977"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030030116","display_name":"Venkat Krishnan Ravikumar","orcid":null},"institutions":[{"id":"https://openalex.org/I4210089308","display_name":"AMS (Singapore)","ror":"https://ror.org/008hf2578","country_code":"SG","type":"company","lineage":["https://openalex.org/I154481106","https://openalex.org/I4210089308"]},{"id":"https://openalex.org/I1311921367","display_name":"Advanced Micro Devices (Canada)","ror":"https://ror.org/02yh0k313","country_code":"CA","type":"company","lineage":["https://openalex.org/I1311921367","https://openalex.org/I4210137977"]}],"countries":["CA","SG"],"is_corresponding":false,"raw_author_name":"V. Ravikumar","raw_affiliation_strings":["AMD, Pte Ltd. Singapore Singapore","AMD Pte Ltd (Singapore), Singapore"],"affiliations":[{"raw_affiliation_string":"AMD, Pte Ltd. Singapore Singapore","institution_ids":["https://openalex.org/I4210089308"]},{"raw_affiliation_string":"AMD Pte Ltd (Singapore), Singapore","institution_ids":["https://openalex.org/I1311921367"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055255968","display_name":"W. Redemund","orcid":null},"institutions":[{"id":"https://openalex.org/I105695857","display_name":"Siemens (Hungary)","ror":"https://ror.org/01rk7mv85","country_code":"HU","type":"company","lineage":["https://openalex.org/I105695857","https://openalex.org/I1325886976"]}],"countries":["HU"],"is_corresponding":false,"raw_author_name":"W. Redemund","raw_affiliation_strings":["Mentor Graphics Hamburg Germany","Mentor Graphics, Hamburg, Germany"],"affiliations":[{"raw_affiliation_string":"Mentor Graphics Hamburg Germany","institution_ids":["https://openalex.org/I105695857"]},{"raw_affiliation_string":"Mentor Graphics, Hamburg, Germany","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5066282637","display_name":"Andreas Glowatz","orcid":"https://orcid.org/0000-0002-8086-6220"},"institutions":[{"id":"https://openalex.org/I105695857","display_name":"Siemens (Hungary)","ror":"https://ror.org/01rk7mv85","country_code":"HU","type":"company","lineage":["https://openalex.org/I105695857","https://openalex.org/I1325886976"]}],"countries":["HU"],"is_corresponding":false,"raw_author_name":"A. Glowatz","raw_affiliation_strings":["Mentor Graphics Hamburg Germany","Mentor Graphics, Hamburg, Germany"],"affiliations":[{"raw_affiliation_string":"Mentor Graphics Hamburg Germany","institution_ids":["https://openalex.org/I105695857"]},{"raw_affiliation_string":"Mentor Graphics, Hamburg, Germany","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052014650","display_name":"Juergen Schloeffel","orcid":null},"institutions":[{"id":"https://openalex.org/I105695857","display_name":"Siemens (Hungary)","ror":"https://ror.org/01rk7mv85","country_code":"HU","type":"company","lineage":["https://openalex.org/I105695857","https://openalex.org/I1325886976"]}],"countries":["HU"],"is_corresponding":false,"raw_author_name":"J. Schloeffel","raw_affiliation_strings":["Mentor Graphics Hamburg Germany","Mentor Graphics, Hamburg, Germany"],"affiliations":[{"raw_affiliation_string":"Mentor Graphics Hamburg Germany","institution_ids":["https://openalex.org/I105695857"]},{"raw_affiliation_string":"Mentor Graphics, Hamburg, Germany","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110218833","display_name":"J. Rajski","orcid":null},"institutions":[{"id":"https://openalex.org/I4210156212","display_name":"Mentor Technologies","ror":"https://ror.org/05vewsj04","country_code":"US","type":"other","lineage":["https://openalex.org/I4210156212"]},{"id":"https://openalex.org/I105695857","display_name":"Siemens (Hungary)","ror":"https://ror.org/01rk7mv85","country_code":"HU","type":"company","lineage":["https://openalex.org/I105695857","https://openalex.org/I1325886976"]}],"countries":["HU","US"],"is_corresponding":false,"raw_author_name":"J. Rajski","raw_affiliation_strings":["Mentor Graphics, Wilsonville, Oregon, USA","Mentor Graphics Wilsonville , Oregon, USA#TAB#"],"affiliations":[{"raw_affiliation_string":"Mentor Graphics, Wilsonville, Oregon, USA","institution_ids":["https://openalex.org/I4210156212"]},{"raw_affiliation_string":"Mentor Graphics Wilsonville , Oregon, USA#TAB#","institution_ids":["https://openalex.org/I105695857"]}]}],"institutions":[],"countries_distinct_count":4,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5065187948"],"corresponding_institution_ids":["https://openalex.org/I105695857"],"apc_list":null,"apc_paid":null,"fwci":4.4942,"has_fulltext":false,"cited_by_count":63,"citation_normalized_percentile":{"value":0.94988385,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":94,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"9"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.6765111684799194},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5839352607727051},{"id":"https://openalex.org/keywords/reduction","display_name":"Reduction (mathematics)","score":0.5805847644805908},{"id":"https://openalex.org/keywords/design-flow","display_name":"Design flow","score":0.518652617931366},{"id":"https://openalex.org/keywords/characterization","display_name":"Characterization (materials science)","score":0.5007750988006592},{"id":"https://openalex.org/keywords/production","display_name":"Production (economics)","score":0.4818457365036011},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.43491053581237793},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.3710097670555115},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.34736716747283936},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.2541486918926239},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.22897493839263916},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19539609551429749},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.1848907470703125}],"concepts":[{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.6765111684799194},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5839352607727051},{"id":"https://openalex.org/C111335779","wikidata":"https://www.wikidata.org/wiki/Q3454686","display_name":"Reduction (mathematics)","level":2,"score":0.5805847644805908},{"id":"https://openalex.org/C37135326","wikidata":"https://www.wikidata.org/wiki/Q931942","display_name":"Design flow","level":2,"score":0.518652617931366},{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.5007750988006592},{"id":"https://openalex.org/C2778348673","wikidata":"https://www.wikidata.org/wiki/Q739302","display_name":"Production (economics)","level":2,"score":0.4818457365036011},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.43491053581237793},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3710097670555115},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.34736716747283936},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.2541486918926239},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.22897493839263916},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19539609551429749},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.1848907470703125},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C139719470","wikidata":"https://www.wikidata.org/wiki/Q39680","display_name":"Macroeconomics","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2012.6401533","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2012.6401533","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 IEEE International Test Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.4099999964237213,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W1695545649","https://openalex.org/W1775604791","https://openalex.org/W1908637464","https://openalex.org/W1961775031","https://openalex.org/W2034030717","https://openalex.org/W2086926157","https://openalex.org/W2096007426","https://openalex.org/W2102372015","https://openalex.org/W2102556246","https://openalex.org/W2114063437","https://openalex.org/W2115825784","https://openalex.org/W2117340982","https://openalex.org/W2118856265","https://openalex.org/W2119041895","https://openalex.org/W2119277411","https://openalex.org/W2120956034","https://openalex.org/W2124692465","https://openalex.org/W2137041591","https://openalex.org/W2169375167","https://openalex.org/W2170907629","https://openalex.org/W2171896075","https://openalex.org/W3139956757"],"related_works":["https://openalex.org/W3107994849","https://openalex.org/W3014521742","https://openalex.org/W4247143848","https://openalex.org/W2009883749","https://openalex.org/W2735573198","https://openalex.org/W29442446","https://openalex.org/W2617868873","https://openalex.org/W3204141294","https://openalex.org/W4386230336","https://openalex.org/W330727063"],"abstract_inverted_index":{"This":[0],"paper":[1],"describes":[2],"a":[3,19,35,63],"new":[4],"approach":[5],"for":[6,12],"significantly":[7],"improving":[8],"overall":[9],"defect":[10,76],"coverage":[11],"CMOS-based":[13],"designs.":[14],"We":[15,56,88],"present":[16,57,90],"results":[17,61,97],"from":[18,62,98],"defect-oriented":[20],"cell-aware":[21],"(CA)":[22],"library":[23],"characterization":[24],"and":[25,28,47,53,93],"pattern-generation":[26],"flow":[27,40],"its":[29],"application":[30],"to":[31,43,67],"1,900":[32],"cells":[33],"of":[34],"32-nm":[36,64],"technology.":[37],"The":[38],"CA":[39,69],"enabled":[41],"us":[42],"detect":[44],"cell-internal":[45,91],"bridges":[46],"opens":[48],"that":[49,81],"caused":[50],"static,":[51],"gross-delay,":[52],"small-delay":[54],"defects.":[55],"highvolume":[58],"production":[59],"test":[60,70],"notebook":[65],"processor":[66],"which":[68],"patterns":[71],"were":[72],"applied,":[73],"including":[74],"the":[75],"rate":[77],"reduction":[78],"in":[79],"PPM":[80],"was":[82],"achieved":[83],"after":[84],"testing":[85],"800,000":[86],"parts.":[87],"also":[89],"diagnosis":[92],"physical":[94],"failure":[95],"analysis":[96],"one":[99],"failing":[100],"part.":[101]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":4},{"year":2023,"cited_by_count":4},{"year":2022,"cited_by_count":4},{"year":2021,"cited_by_count":5},{"year":2020,"cited_by_count":5},{"year":2019,"cited_by_count":6},{"year":2018,"cited_by_count":4},{"year":2017,"cited_by_count":8},{"year":2016,"cited_by_count":4},{"year":2015,"cited_by_count":5},{"year":2014,"cited_by_count":11},{"year":2013,"cited_by_count":2}],"updated_date":"2026-04-19T08:26:33.389920","created_date":"2025-10-10T00:00:00"}