{"id":"https://openalex.org/W2051668240","doi":"https://doi.org/10.1109/test.2011.6139181","title":"Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base","display_name":"Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base","publication_year":2011,"publication_date":"2011-09-01","ids":{"openalex":"https://openalex.org/W2051668240","doi":"https://doi.org/10.1109/test.2011.6139181","mag":"2051668240"},"language":"en","primary_location":{"id":"doi:10.1109/test.2011.6139181","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2011.6139181","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 IEEE International Test Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5069779985","display_name":"Chun\u2010Chuan Chi","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]},{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["BE","TW"],"is_corresponding":true,"raw_author_name":"Chun-Chuan Chi","raw_affiliation_strings":["Department Electrical Engineering, National Tsing-Hua University, Hsinchu, Taiwan","IMEC vzw, Leuven, Belgium"],"affiliations":[{"raw_affiliation_string":"Department Electrical Engineering, National Tsing-Hua University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]},{"raw_affiliation_string":"IMEC vzw, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044629739","display_name":"Erik Jan Marinissen","orcid":"https://orcid.org/0000-0002-5058-8303"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Erik Jan Marinissen","raw_affiliation_strings":["IMEC vzw, Leuven, Belgium"],"affiliations":[{"raw_affiliation_string":"IMEC vzw, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026985039","display_name":"Sandeep Goel","orcid":"https://orcid.org/0000-0002-0911-8975"},"institutions":[{"id":"https://openalex.org/I1334877674","display_name":"Taiwan Semiconductor Manufacturing Company (United States)","ror":"https://ror.org/02rvfjx92","country_code":"US","type":"company","lineage":["https://openalex.org/I1334877674","https://openalex.org/I4210120917"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sandeep Kumar Goel","raw_affiliation_strings":["TSMC, San Jose, CA, USA"],"affiliations":[{"raw_affiliation_string":"TSMC, San Jose, CA, USA","institution_ids":["https://openalex.org/I1334877674"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5075548524","display_name":"Cheng\u2010Wen Wu","orcid":"https://orcid.org/0000-0001-8614-7908"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Cheng-Wen Wu","raw_affiliation_strings":["Department Electrical Engineering, National Tsing-Hua University, Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department Electrical Engineering, National Tsing-Hua University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5069779985"],"corresponding_institution_ids":["https://openalex.org/I25846049","https://openalex.org/I4210114974"],"apc_list":null,"apc_paid":null,"fwci":5.8292,"has_fulltext":false,"cited_by_count":50,"citation_normalized_percentile":{"value":0.9637577,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"10"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/base","display_name":"Base (topology)","score":0.5455729961395264},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.5397774577140808},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.408131867647171},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.2114751935005188},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.19748449325561523},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.16890406608581543}],"concepts":[{"id":"https://openalex.org/C42058472","wikidata":"https://www.wikidata.org/wiki/Q810214","display_name":"Base (topology)","level":2,"score":0.5455729961395264},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.5397774577140808},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.408131867647171},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2114751935005188},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.19748449325561523},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.16890406608581543},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2011.6139181","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2011.6139181","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 IEEE International Test Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":41,"referenced_works":["https://openalex.org/W128123307","https://openalex.org/W390323645","https://openalex.org/W614595877","https://openalex.org/W1502837022","https://openalex.org/W1971322722","https://openalex.org/W1998547487","https://openalex.org/W2002645608","https://openalex.org/W2057259846","https://openalex.org/W2074730724","https://openalex.org/W2084894644","https://openalex.org/W2090396476","https://openalex.org/W2100516830","https://openalex.org/W2104500469","https://openalex.org/W2110075134","https://openalex.org/W2115697688","https://openalex.org/W2116426145","https://openalex.org/W2118445886","https://openalex.org/W2125982897","https://openalex.org/W2130877430","https://openalex.org/W2132155220","https://openalex.org/W2137893918","https://openalex.org/W2143502515","https://openalex.org/W2144149750","https://openalex.org/W2147115611","https://openalex.org/W2148156420","https://openalex.org/W2149593163","https://openalex.org/W2151243068","https://openalex.org/W2154133941","https://openalex.org/W2161277442","https://openalex.org/W2163755032","https://openalex.org/W2170070894","https://openalex.org/W2185926888","https://openalex.org/W2399801569","https://openalex.org/W4230995773","https://openalex.org/W4239250096","https://openalex.org/W4248451031","https://openalex.org/W4250657101","https://openalex.org/W4285719527","https://openalex.org/W6605234255","https://openalex.org/W6675893498","https://openalex.org/W6677637676"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W2358668433","https://openalex.org/W4396701345","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W4396696052","https://openalex.org/W4402327032","https://openalex.org/W2382290278"],"abstract_inverted_index":{"Through-Silicon":[0],"Vias":[1],"(TSVs)":[2],"enable":[3],"high-density,":[4],"low-latency,":[5],"and":[6,70,76],"low-power":[7],"interconnects":[8,85],"for":[9,74],"system":[10],"chips":[11],"that":[12],"consist":[13],"of":[14,31,53],"multiple":[15,22,42,52],"dies.":[16],"In":[17,39],"\u201c2.5D\u201d":[18],"Stacked":[19],"ICs":[20],"(2.5D-SICs),":[21],"dies":[23,43],"without":[24],"TSVs":[25,45],"are":[26,47,56,89],"stacked":[27],"side-by-side":[28],"on":[29,59],"top":[30],"a":[32,60,67,79],"passive":[33,61,80],"silicon":[34,62,81],"interposer":[35,82,88,100],"base":[36],"containing":[37,44,78],"TSVs.":[38],"true":[40],"3D-SICs,":[41],"themselves":[46],"vertically":[48],"stacked;":[49],"one":[50],"or":[51],"such":[54],"stacks":[55],"possibly":[57],"placed":[58],"interposer.":[63],"This":[64],"paper":[65],"proposes":[66],"post-bond":[68],"test":[69],"design-for-test":[71],"(DfT)":[72],"strategy":[73],"2.5D-":[75],"3D-SICs":[77],"base.":[83],"Functional":[84],"in":[86,95],"the":[87,99],"reused":[90],"as":[91,93],"much":[92],"possible":[94],"order":[96],"to":[97],"keep":[98],"cost":[101],"low.":[102]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":7},{"year":2016,"cited_by_count":8},{"year":2015,"cited_by_count":5},{"year":2014,"cited_by_count":8},{"year":2013,"cited_by_count":9},{"year":2012,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}