{"id":"https://openalex.org/W2052347136","doi":"https://doi.org/10.1109/test.2011.6139180","title":"Evaluation of TSV and micro-bump probing for wide I/O testing","display_name":"Evaluation of TSV and micro-bump probing for wide I/O testing","publication_year":2011,"publication_date":"2011-09-01","ids":{"openalex":"https://openalex.org/W2052347136","doi":"https://doi.org/10.1109/test.2011.6139180","mag":"2052347136"},"language":"en","primary_location":{"id":"doi:10.1109/test.2011.6139180","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2011.6139180","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 IEEE International Test Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5049615387","display_name":"Ken R. Smith","orcid":"https://orcid.org/0000-0003-0682-3705"},"institutions":[{"id":"https://openalex.org/I76705860","display_name":"Cascade Microtech (United States)","ror":"https://ror.org/0401b3q74","country_code":"US","type":"company","lineage":["https://openalex.org/I76705860"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Ken Smith","raw_affiliation_strings":["Cascade Microtech, Inc., Beaverton, OR, USA","Cascade Microtech, Inc. - Beaverton, Oregon, USA"],"affiliations":[{"raw_affiliation_string":"Cascade Microtech, Inc., Beaverton, OR, USA","institution_ids":["https://openalex.org/I76705860"]},{"raw_affiliation_string":"Cascade Microtech, Inc. - Beaverton, Oregon, USA","institution_ids":["https://openalex.org/I76705860"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039448797","display_name":"Peter Hanaway","orcid":null},"institutions":[{"id":"https://openalex.org/I76705860","display_name":"Cascade Microtech (United States)","ror":"https://ror.org/0401b3q74","country_code":"US","type":"company","lineage":["https://openalex.org/I76705860"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Peter Hanaway","raw_affiliation_strings":["Cascade Microtech, Inc., Beaverton, OR, USA","Cascade Microtech, Inc. - Beaverton, Oregon, USA"],"affiliations":[{"raw_affiliation_string":"Cascade Microtech, Inc., Beaverton, OR, USA","institution_ids":["https://openalex.org/I76705860"]},{"raw_affiliation_string":"Cascade Microtech, Inc. - Beaverton, Oregon, USA","institution_ids":["https://openalex.org/I76705860"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055055160","display_name":"Mike Jolley","orcid":null},"institutions":[{"id":"https://openalex.org/I76705860","display_name":"Cascade Microtech (United States)","ror":"https://ror.org/0401b3q74","country_code":"US","type":"company","lineage":["https://openalex.org/I76705860"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mike Jolley","raw_affiliation_strings":["Cascade Microtech, Inc., Beaverton, OR, USA","Cascade Microtech, Inc. - Beaverton, Oregon, USA"],"affiliations":[{"raw_affiliation_string":"Cascade Microtech, Inc., Beaverton, OR, USA","institution_ids":["https://openalex.org/I76705860"]},{"raw_affiliation_string":"Cascade Microtech, Inc. - Beaverton, Oregon, USA","institution_ids":["https://openalex.org/I76705860"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050288530","display_name":"Reed Gleason","orcid":null},"institutions":[{"id":"https://openalex.org/I76705860","display_name":"Cascade Microtech (United States)","ror":"https://ror.org/0401b3q74","country_code":"US","type":"company","lineage":["https://openalex.org/I76705860"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Reed Gleason","raw_affiliation_strings":["Cascade Microtech, Inc., Beaverton, OR, USA","Cascade Microtech, Inc. - Beaverton, Oregon, USA"],"affiliations":[{"raw_affiliation_string":"Cascade Microtech, Inc., Beaverton, OR, USA","institution_ids":["https://openalex.org/I76705860"]},{"raw_affiliation_string":"Cascade Microtech, Inc. - Beaverton, Oregon, USA","institution_ids":["https://openalex.org/I76705860"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024130271","display_name":"E.W. Strid","orcid":null},"institutions":[{"id":"https://openalex.org/I76705860","display_name":"Cascade Microtech (United States)","ror":"https://ror.org/0401b3q74","country_code":"US","type":"company","lineage":["https://openalex.org/I76705860"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Eric Strid","raw_affiliation_strings":["Cascade Microtech, Inc., Beaverton, OR, USA","Cascade Microtech, Inc. - Beaverton, Oregon, USA"],"affiliations":[{"raw_affiliation_string":"Cascade Microtech, Inc., Beaverton, OR, USA","institution_ids":["https://openalex.org/I76705860"]},{"raw_affiliation_string":"Cascade Microtech, Inc. - Beaverton, Oregon, USA","institution_ids":["https://openalex.org/I76705860"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110100219","display_name":"Tom Daenen","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Tom Daenen","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Leuven, Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Leuven, Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5091776836","display_name":"L. Dupas","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Luc Dupas","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Leuven, Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Leuven, Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023283122","display_name":"Bruno Knuts","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Bruno Knuts","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Leuven, Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Leuven, Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044629739","display_name":"Erik Jan Marinissen","orcid":"https://orcid.org/0000-0002-5058-8303"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Erik Jan Marinissen","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Leuven, Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Leuven, Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5076771364","display_name":"M. Van Dievel","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Marc Van Dievel","raw_affiliation_strings":["IMEC, Leuven, Belgium","IMEC, Leuven, Belgium,"],"affiliations":[{"raw_affiliation_string":"IMEC, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]},{"raw_affiliation_string":"IMEC, Leuven, Belgium,","institution_ids":["https://openalex.org/I4210114974"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":10,"corresponding_author_ids":["https://openalex.org/A5049615387"],"corresponding_institution_ids":["https://openalex.org/I76705860"],"apc_list":null,"apc_paid":null,"fwci":10.3336,"has_fulltext":false,"cited_by_count":57,"citation_normalized_percentile":{"value":0.9853186,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":94,"max":100},"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6950555443763733},{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.6874144077301025},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.6745070815086365},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.65338134765625},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.6307324171066284},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.5083903670310974},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.5020222663879395},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.472445547580719},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.41018468141555786},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.36253559589385986},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.32661911845207214},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1434013843536377}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6950555443763733},{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.6874144077301025},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.6745070815086365},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.65338134765625},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.6307324171066284},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.5083903670310974},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.5020222663879395},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.472445547580719},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.41018468141555786},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.36253559589385986},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.32661911845207214},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1434013843536377},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2011.6139180","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2011.6139180","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 IEEE International Test Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W390323645","https://openalex.org/W1971322722","https://openalex.org/W2051668240","https://openalex.org/W2057259846","https://openalex.org/W2100516830","https://openalex.org/W2132155220","https://openalex.org/W2137893918","https://openalex.org/W2143502515","https://openalex.org/W2144149750","https://openalex.org/W2154133941","https://openalex.org/W2163755032","https://openalex.org/W2185926888","https://openalex.org/W4285719527","https://openalex.org/W6613481246","https://openalex.org/W6686479381"],"related_works":["https://openalex.org/W2035329725","https://openalex.org/W4376641153","https://openalex.org/W2272290532","https://openalex.org/W2070875936","https://openalex.org/W4250391473","https://openalex.org/W3045075405","https://openalex.org/W4302292679","https://openalex.org/W2956222435","https://openalex.org/W2785913568","https://openalex.org/W2096702712"],"abstract_inverted_index":{"Practical":[0],"silicon":[1],"stacking":[2],"requires":[3,12],"pre-tested":[4],"dies,":[5],"but":[6],"contact":[7],"probing":[8,17,44,64],"of":[9,63],"TSV":[10],"interconnects":[11],"much":[13],"higher":[14],"density,":[15],"lower":[16,20],"forces,":[18],"and":[19,48,55],"cost":[21],"per":[22,70],"pin":[23],"than":[24],"conventional":[25],"probe":[26,37],"cards":[27],"have":[28],"achieved.":[29],"This":[30],"paper":[31],"examines":[32],"a":[33],"cost-effective,":[34],"lithographic-based":[35],"MEMS":[36],"card":[38],"technology":[39],"that":[40],"is":[41],"suitable":[42],"for":[43],"40\u03bcm":[45],"pitch":[46],"arrays,":[47],"scalable":[49],"to":[50,80],"finer":[51],"pitches.":[52],"Initial":[53],"mechanical":[54],"electrical":[56],"results":[57],"are":[58],"presented,":[59],"demonstrating":[60],"the":[61],"feasibility":[62],"large":[65],"arrays":[66],"at":[67],"1":[68],"gram-force":[69],"tip":[71],"with":[72],"very":[73],"low":[74],"pad":[75],"damage,":[76],"so":[77],"as":[78],"not":[79],"impair":[81],"downstream":[82],"bonding":[83],"or":[84],"other":[85],"processing":[86],"steps.":[87]},"counts_by_year":[{"year":2022,"cited_by_count":2},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":6},{"year":2014,"cited_by_count":15},{"year":2013,"cited_by_count":16},{"year":2012,"cited_by_count":7}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}