{"id":"https://openalex.org/W2075649482","doi":"https://doi.org/10.1109/test.2010.5699252","title":"Characterizing mechanical performance of Board Level Interconnects for In-Circuit Test","display_name":"Characterizing mechanical performance of Board Level Interconnects for In-Circuit Test","publication_year":2010,"publication_date":"2010-11-01","ids":{"openalex":"https://openalex.org/W2075649482","doi":"https://doi.org/10.1109/test.2010.5699252","mag":"2075649482"},"language":"en","primary_location":{"id":"doi:10.1109/test.2010.5699252","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2010.5699252","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE International Test Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5076822293","display_name":"Rosa Reinosa","orcid":null},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Rosa Reinosa","raw_affiliation_strings":["Hewlett Packard Company, Palo Alto, CA, USA","Hewlett-Packard , Palo Alto, CA, USA#TAB#"],"affiliations":[{"raw_affiliation_string":"Hewlett Packard Company, Palo Alto, CA, USA","institution_ids":["https://openalex.org/I1324840837"]},{"raw_affiliation_string":"Hewlett-Packard , Palo Alto, CA, USA#TAB#","institution_ids":["https://openalex.org/I1324840837"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050453638","display_name":"Aileen Allen","orcid":null},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Aileen Allen","raw_affiliation_strings":["Hewlett Packard Company, Palo Alto, CA, USA","Hewlett-Packard , Palo Alto, CA, USA#TAB#"],"affiliations":[{"raw_affiliation_string":"Hewlett Packard Company, Palo Alto, CA, USA","institution_ids":["https://openalex.org/I1324840837"]},{"raw_affiliation_string":"Hewlett-Packard , Palo Alto, CA, USA#TAB#","institution_ids":["https://openalex.org/I1324840837"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064234047","display_name":"Elizabeth Benedetto","orcid":null},"institutions":[{"id":"https://openalex.org/I1324840837","display_name":"Hewlett-Packard (United States)","ror":"https://ror.org/059rn9488","country_code":"US","type":"company","lineage":["https://openalex.org/I1324840837"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Elizabeth Benedetto","raw_affiliation_strings":["Hewlett Packard Company, Houston, TX, USA","Hewlett-Packard, Houston, TX, USA"],"affiliations":[{"raw_affiliation_string":"Hewlett Packard Company, Houston, TX, USA","institution_ids":["https://openalex.org/I1324840837"]},{"raw_affiliation_string":"Hewlett-Packard, Houston, TX, USA","institution_ids":["https://openalex.org/I1324840837"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5071992089","display_name":"Alan McAllister","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Alan Mcallister","raw_affiliation_strings":["Intel Corporation, Portland, OR, USA","Intel Corp, Portland OR, USA"],"affiliations":[{"raw_affiliation_string":"Intel Corporation, Portland, OR, USA","institution_ids":["https://openalex.org/I1343180700"]},{"raw_affiliation_string":"Intel Corp, Portland OR, USA","institution_ids":["https://openalex.org/I1343180700"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5076822293"],"corresponding_institution_ids":["https://openalex.org/I1324840837"],"apc_list":null,"apc_paid":null,"fwci":1.03183777,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.80840303,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"11"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9966999888420105,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9966999888420105,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9908000230789185,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12971","display_name":"Material Properties and Processing","score":0.983299970626831,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.7795031666755676},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.5217528939247131},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.4714069366455078},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.38512033224105835},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.3306809663772583},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.19069519639015198}],"concepts":[{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.7795031666755676},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.5217528939247131},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.4714069366455078},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.38512033224105835},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.3306809663772583},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.19069519639015198}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2010.5699252","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2010.5699252","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE International Test Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.6299999952316284}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W2122107088"],"related_works":["https://openalex.org/W2599361292","https://openalex.org/W4252608911","https://openalex.org/W2184913151","https://openalex.org/W2389426768","https://openalex.org/W2098273855","https://openalex.org/W3147987719","https://openalex.org/W2698654916","https://openalex.org/W3163908127","https://openalex.org/W2351837897","https://openalex.org/W2384416889"],"abstract_inverted_index":{"Lead":[0],"Free":[1],"boards":[2],"are":[3],"more":[4,11],"susceptible":[5],"to":[6,13,35,68],"mechanical":[7,38,71],"stress":[8],"and":[9,18,53,78],"therefore":[10],"prone":[12],"damage":[14],"during":[15],"manufacturing,":[16],"assembly":[17],"field":[19],"use.":[20],"The":[21,81],"IPC/JEDEC":[22,65,101],"9707(Spherical":[23],"Bend":[24],"Test":[25],"Method":[26],"for":[27,76],"Characterization":[28],"of":[29,40,62,73,83,98],"Board":[30,90],"Level":[31],"Interconnects)":[32],"was":[33],"developed":[34],"characterize":[36],"the":[37,60,63,70,84,96],"performance":[39,72],"new":[41,64,100],"lead":[42],"free":[43],"materials":[44],"(i.e.":[45,50,55],"laminates),":[46],"board":[47,74],"design":[48],"features":[49],"pad":[51],"design),":[52],"components":[54],"BGAs).":[56],"This":[57],"paper":[58],"describes":[59],"application":[61],"9707":[66],"standard":[67],"qualify":[69],"interconnects":[75],"manufacturing":[77],"In-Circuit":[79],"Test.":[80],"efforts":[82],"International":[85],"Electronics":[86],"Manufacturing":[87],"Initiative":[88,92],"(iNEMI)":[89],"Flexure":[91],"Project":[93],"team":[94],"drove":[95],"development":[97],"this":[99],"9707standard.":[102]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}