{"id":"https://openalex.org/W2142492041","doi":"https://doi.org/10.1109/test.2008.4700632","title":"A New Wafer Level Latent Defect Screening Methodology for Highly Reliable DRAM Using a Response Surface Method","display_name":"A New Wafer Level Latent Defect Screening Methodology for Highly Reliable DRAM Using a Response Surface Method","publication_year":2008,"publication_date":"2008-10-01","ids":{"openalex":"https://openalex.org/W2142492041","doi":"https://doi.org/10.1109/test.2008.4700632","mag":"2142492041"},"language":"en","primary_location":{"id":"doi:10.1109/test.2008.4700632","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2008.4700632","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 IEEE International Test Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5088453163","display_name":"Junghyun Nam","orcid":"https://orcid.org/0000-0001-5939-6482"},"institutions":[{"id":"https://openalex.org/I193775966","display_name":"Yonsei University","ror":"https://ror.org/01wjejq96","country_code":"KR","type":"education","lineage":["https://openalex.org/I193775966"]},{"id":"https://openalex.org/I4210160791","display_name":"Yonsei University Health System","ror":"https://ror.org/04sze3c15","country_code":"KR","type":"healthcare","lineage":["https://openalex.org/I193775966","https://openalex.org/I4210160791"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Junghyun Nam","raw_affiliation_strings":["Computer System & Reliable Soc Lab, Yonsei University, Seoul, South Korea","Comput. Syst. & Reliable Soc Lab., Yonsei Univ., Seoul"],"affiliations":[{"raw_affiliation_string":"Computer System & Reliable Soc Lab, Yonsei University, Seoul, South Korea","institution_ids":["https://openalex.org/I4210160791"]},{"raw_affiliation_string":"Comput. Syst. & Reliable Soc Lab., Yonsei Univ., Seoul","institution_ids":["https://openalex.org/I193775966"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102227100","display_name":"Sunghoon Chun","orcid":null},"institutions":[{"id":"https://openalex.org/I193775966","display_name":"Yonsei University","ror":"https://ror.org/01wjejq96","country_code":"KR","type":"education","lineage":["https://openalex.org/I193775966"]},{"id":"https://openalex.org/I4210160791","display_name":"Yonsei University Health System","ror":"https://ror.org/04sze3c15","country_code":"KR","type":"healthcare","lineage":["https://openalex.org/I193775966","https://openalex.org/I4210160791"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sunghoon Chun","raw_affiliation_strings":["Computer System & Reliable Soc Lab, Yonsei University, Seoul, South Korea","Comput. Syst. & Reliable Soc Lab., Yonsei Univ., Seoul"],"affiliations":[{"raw_affiliation_string":"Computer System & Reliable Soc Lab, Yonsei University, Seoul, South Korea","institution_ids":["https://openalex.org/I4210160791"]},{"raw_affiliation_string":"Comput. Syst. & Reliable Soc Lab., Yonsei Univ., Seoul","institution_ids":["https://openalex.org/I193775966"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111540875","display_name":"G.H. Koo","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Gibum Koo","raw_affiliation_strings":["Samsung Semiconductor Memory Division, Packaging & Test Technologies, Wafer Test Technology Team, South Korea","Semicond. Memory Div., Packaging & Test Technol., Samsung"],"affiliations":[{"raw_affiliation_string":"Samsung Semiconductor Memory Division, Packaging & Test Technologies, Wafer Test Technology Team, South Korea","institution_ids":["https://openalex.org/I2250650973"]},{"raw_affiliation_string":"Semicond. Memory Div., Packaging & Test Technol., Samsung","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113684293","display_name":"Yanggi Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Yanggi Kim","raw_affiliation_strings":["Samsung Semiconductor Memory Division, Packaging & Test Technologies, Wafer Test Technology Team, South Korea","Semicond. Memory Div., Packaging & Test Technol., Samsung"],"affiliations":[{"raw_affiliation_string":"Samsung Semiconductor Memory Division, Packaging & Test Technologies, Wafer Test Technology Team, South Korea","institution_ids":["https://openalex.org/I2250650973"]},{"raw_affiliation_string":"Semicond. Memory Div., Packaging & Test Technol., Samsung","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5002590504","display_name":"Byungsoo Moon","orcid":"https://orcid.org/0000-0003-4625-2425"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Byungsoo Moon","raw_affiliation_strings":["Samsung Semiconductor Memory Division, Packaging & Test Technologies, Wafer Test Technology Team, South Korea","Semicond. Memory Div., Packaging & Test Technol., Samsung"],"affiliations":[{"raw_affiliation_string":"Samsung Semiconductor Memory Division, Packaging & Test Technologies, Wafer Test Technology Team, South Korea","institution_ids":["https://openalex.org/I2250650973"]},{"raw_affiliation_string":"Semicond. Memory Div., Packaging & Test Technol., Samsung","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005684104","display_name":"Jonghyoung Lim","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jonghyoung Lim","raw_affiliation_strings":["Samsung Semiconductor Memory Division, Product Engineering Team, South Korea","Semicond. Memory Div., Product Eng. Team, Samsung"],"affiliations":[{"raw_affiliation_string":"Samsung Semiconductor Memory Division, Product Engineering Team, South Korea","institution_ids":["https://openalex.org/I2250650973"]},{"raw_affiliation_string":"Semicond. Memory Div., Product Eng. Team, Samsung","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Jaehoon Joo","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jaehoon Joo","raw_affiliation_strings":["Samsung Semiconductor Memory Division, Product Engineering Team, South Korea","Semicond. Memory Div., Product Eng. Team, Samsung"],"affiliations":[{"raw_affiliation_string":"Samsung Semiconductor Memory Division, Product Engineering Team, South Korea","institution_ids":["https://openalex.org/I2250650973"]},{"raw_affiliation_string":"Semicond. Memory Div., Product Eng. Team, Samsung","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109236616","display_name":"Sangseok Kang","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]},{"id":"https://openalex.org/I4210160791","display_name":"Yonsei University Health System","ror":"https://ror.org/04sze3c15","country_code":"KR","type":"healthcare","lineage":["https://openalex.org/I193775966","https://openalex.org/I4210160791"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sangseok Kang","raw_affiliation_strings":["Computer System & Reliable Soc Lab, Yonsei University, Seoul, South Korea","Samsung Semiconductor Memory Division, Product Engineering Team, South Korea","Semicond. Memory Div., Product Eng. Team, Samsung"],"affiliations":[{"raw_affiliation_string":"Computer System & Reliable Soc Lab, Yonsei University, Seoul, South Korea","institution_ids":["https://openalex.org/I4210160791"]},{"raw_affiliation_string":"Samsung Semiconductor Memory Division, Product Engineering Team, South Korea","institution_ids":["https://openalex.org/I2250650973"]},{"raw_affiliation_string":"Semicond. Memory Div., Product Eng. Team, Samsung","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111952122","display_name":"Hoonjung Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hoonjung Kim","raw_affiliation_strings":["Samsung Semiconductor Memory Division, Packaging & Test Technologies, Wafer Test Technology Team, South Korea","Semicond. Memory Div., Packaging & Test Technol., Samsung"],"affiliations":[{"raw_affiliation_string":"Samsung Semiconductor Memory Division, Packaging & Test Technologies, Wafer Test Technology Team, South Korea","institution_ids":["https://openalex.org/I2250650973"]},{"raw_affiliation_string":"Semicond. Memory Div., Packaging & Test Technol., Samsung","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026540770","display_name":"Kyeongseon Shin","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Kyeongseon Shin","raw_affiliation_strings":["Samsung Semiconductor Memory Division, Packaging & Test Technologies, Wafer Test Technology Team, South Korea","Semicond. Memory Div., Packaging & Test Technol., Samsung"],"affiliations":[{"raw_affiliation_string":"Samsung Semiconductor Memory Division, Packaging & Test Technologies, Wafer Test Technology Team, South Korea","institution_ids":["https://openalex.org/I2250650973"]},{"raw_affiliation_string":"Semicond. Memory Div., Packaging & Test Technol., Samsung","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033039865","display_name":"Ki-Sang Kang","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Kisang Kang","raw_affiliation_strings":["Samsung Semiconductor Memory Division, Packaging & Test Technologies, Wafer Test Technology Team, South Korea","Semicond. Memory Div., Packaging & Test Technol., Samsung"],"affiliations":[{"raw_affiliation_string":"Samsung Semiconductor Memory Division, Packaging & Test Technologies, Wafer Test Technology Team, South Korea","institution_ids":["https://openalex.org/I2250650973"]},{"raw_affiliation_string":"Semicond. Memory Div., Packaging & Test Technol., Samsung","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5068528309","display_name":"Sungho Kang","orcid":"https://orcid.org/0000-0002-7093-2095"},"institutions":[{"id":"https://openalex.org/I193775966","display_name":"Yonsei University","ror":"https://ror.org/01wjejq96","country_code":"KR","type":"education","lineage":["https://openalex.org/I193775966"]},{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]},{"id":"https://openalex.org/I4210160791","display_name":"Yonsei University Health System","ror":"https://ror.org/04sze3c15","country_code":"KR","type":"healthcare","lineage":["https://openalex.org/I193775966","https://openalex.org/I4210160791"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sungho Kang","raw_affiliation_strings":["Computer System & Reliable Soc Lab, Yonsei University, Seoul, South Korea","Samsung Semiconductor Memory Division, Product Engineering Team, South Korea","Comput. Syst. & Reliable Soc Lab., Yonsei Univ., Seoul"],"affiliations":[{"raw_affiliation_string":"Computer System & Reliable Soc Lab, Yonsei University, Seoul, South Korea","institution_ids":["https://openalex.org/I4210160791"]},{"raw_affiliation_string":"Samsung Semiconductor Memory Division, Product Engineering Team, South Korea","institution_ids":["https://openalex.org/I2250650973"]},{"raw_affiliation_string":"Comput. Syst. & Reliable Soc Lab., Yonsei Univ., Seoul","institution_ids":["https://openalex.org/I193775966"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":12,"corresponding_author_ids":["https://openalex.org/A5088453163"],"corresponding_institution_ids":["https://openalex.org/I193775966","https://openalex.org/I4210160791"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.1236685,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"10"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/dram","display_name":"Dram","score":0.791387140750885},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.7467672824859619},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.662094235420227},{"id":"https://openalex.org/keywords/wafer-fabrication","display_name":"Wafer fabrication","score":0.6032363176345825},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.5777766704559326},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5691315531730652},{"id":"https://openalex.org/keywords/burn-in","display_name":"Burn-in","score":0.5626116394996643},{"id":"https://openalex.org/keywords/wafer-testing","display_name":"Wafer testing","score":0.5615196228027344},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5107314586639404},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2763446569442749},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.1206425130367279}],"concepts":[{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.791387140750885},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.7467672824859619},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.662094235420227},{"id":"https://openalex.org/C35750839","wikidata":"https://www.wikidata.org/wiki/Q7959421","display_name":"Wafer fabrication","level":3,"score":0.6032363176345825},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.5777766704559326},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5691315531730652},{"id":"https://openalex.org/C179707776","wikidata":"https://www.wikidata.org/wiki/Q662895","display_name":"Burn-in","level":2,"score":0.5626116394996643},{"id":"https://openalex.org/C44445679","wikidata":"https://www.wikidata.org/wiki/Q2538844","display_name":"Wafer testing","level":3,"score":0.5615196228027344},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5107314586639404},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2763446569442749},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.1206425130367279},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2008.4700632","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2008.4700632","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 IEEE International Test Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W1501364910","https://openalex.org/W1604992389","https://openalex.org/W1935559079","https://openalex.org/W2044771513","https://openalex.org/W2113338627","https://openalex.org/W2129695765","https://openalex.org/W2141361504","https://openalex.org/W2153299515","https://openalex.org/W2158942937","https://openalex.org/W2162342991","https://openalex.org/W2165849634","https://openalex.org/W2166803207","https://openalex.org/W2167620266","https://openalex.org/W2176997569","https://openalex.org/W2534746101","https://openalex.org/W2623935640","https://openalex.org/W2940616667","https://openalex.org/W6630026570","https://openalex.org/W6679361669"],"related_works":["https://openalex.org/W2123284756","https://openalex.org/W2129695765","https://openalex.org/W2054845823","https://openalex.org/W2540312267","https://openalex.org/W2367528910","https://openalex.org/W2156694894","https://openalex.org/W2031579205","https://openalex.org/W2070188681","https://openalex.org/W2001316072","https://openalex.org/W2075893297"],"abstract_inverted_index":{"Screening":[0],"latent":[1,82],"defects":[2],"in":[3,12,85,132],"a":[4,57,75,96,109,156,166],"wafer":[5,77,87,98],"test":[6,88,123,130,169],"process":[7,136,170],"is":[8],"very":[9],"important":[10],"task":[11],"both":[13],"reducing":[14],"memory":[15],"manufacturing":[16,122,168],"cost":[17,66],"and":[18,30,64,108],"enhancing":[19],"the":[20,35,46,54,81,86,120,133,148],"reliability":[21,153],"of":[22,34,95],"emerging":[23],"package":[24,36,40,129,158],"products":[25,41],"such":[26],"as":[27],"SIP,":[28],"MCP,":[29],"WSP.":[31],"In":[32,142,161],"terms":[33],"assembly":[37],"cost,":[38],"these":[39,70],"are":[42],"required":[43],"to":[44,140,173],"adopt":[45],"KGD":[47,55],"(known":[48],"good":[49],"die)":[50],"quality":[51],"level.":[52],"However,":[53],"requires":[56],"long":[58],"burn-in":[59,78,99,159],"time,":[60,63],"added":[61],"testing":[62],"high":[65,176],"equipments.":[67],"To":[68],"alleviate":[69],"problems,":[71],"this":[72,163],"paper":[73],"presents":[74],"statistical":[76,110],"methodology":[79,93,150,164],"for":[80],"defect":[83],"screen":[84],"process.":[89,124],"The":[90],"newly":[91],"proposed":[92,149],"consists":[94],"defect-based":[97],"(DB-WBI)":[100],"stress":[101,111],"method":[102,113],"based":[103],"on":[104,119],"DRAM":[105,121],"operation":[106],"characteristics":[107],"optimization":[112],"using":[114],"RSM":[115],"(response":[116],"surface":[117],"method)":[118],"Experimental":[125],"data":[126],"shows":[127],"that":[128,147],"yields":[131],"immature":[134],"fabrication":[135],"improved":[137],"by":[138],"up":[139],"6%.":[141],"addition,":[143],"experimental":[144],"results":[145],"show":[146],"can":[151],"guarantee":[152],"requirements":[154],"with":[155,175],"shortened":[157],"time.":[160],"conclusion,":[162],"realizes":[165],"simplified":[167],"supporting":[171],"time":[172],"market":[174],"reliability.":[177]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1}],"updated_date":"2026-04-21T08:09:41.155169","created_date":"2025-10-10T00:00:00"}