{"id":"https://openalex.org/W2105619224","doi":"https://doi.org/10.1109/test.2008.4700619","title":"Optimized Circuit Failure Prediction for Aging: Practicality and Promise","display_name":"Optimized Circuit Failure Prediction for Aging: Practicality and Promise","publication_year":2008,"publication_date":"2008-10-01","ids":{"openalex":"https://openalex.org/W2105619224","doi":"https://doi.org/10.1109/test.2008.4700619","mag":"2105619224"},"language":"en","primary_location":{"id":"doi:10.1109/test.2008.4700619","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2008.4700619","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 IEEE International Test Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5024679466","display_name":"Manu Agarwal","orcid":"https://orcid.org/0000-0001-5083-7384"},"institutions":[{"id":"https://openalex.org/I1311921367","display_name":"Advanced Micro Devices (Canada)","ror":"https://ror.org/02yh0k313","country_code":"CA","type":"company","lineage":["https://openalex.org/I1311921367","https://openalex.org/I4210137977"]}],"countries":["CA"],"is_corresponding":true,"raw_author_name":"M. Agarwal","raw_affiliation_strings":["Advanced Micro Devices, Inc","AMD,#TAB#"],"affiliations":[{"raw_affiliation_string":"Advanced Micro Devices, Inc","institution_ids":["https://openalex.org/I1311921367"]},{"raw_affiliation_string":"AMD,#TAB#","institution_ids":["https://openalex.org/I1311921367"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069670958","display_name":"Varsha Balakrishnan","orcid":null},"institutions":[{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"V. Balakrishnan","raw_affiliation_strings":["Arizona State University, USA","Arizona State University"],"affiliations":[{"raw_affiliation_string":"Arizona State University, USA","institution_ids":["https://openalex.org/I55732556"]},{"raw_affiliation_string":"Arizona State University","institution_ids":["https://openalex.org/I55732556"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016183835","display_name":"Anshuman Bhuyan","orcid":null},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Bhuyan","raw_affiliation_strings":["University of Stanford","Stanford University"],"affiliations":[{"raw_affiliation_string":"University of Stanford","institution_ids":["https://openalex.org/I97018004"]},{"raw_affiliation_string":"Stanford University","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089358333","display_name":"Kyunglok Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kyunglok Kim","raw_affiliation_strings":["University of Stanford","Stanford University"],"affiliations":[{"raw_affiliation_string":"University of Stanford","institution_ids":["https://openalex.org/I97018004"]},{"raw_affiliation_string":"Stanford University","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111972172","display_name":"Bipul C. Paul","orcid":null},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"B.C. Paul","raw_affiliation_strings":["University of Stanford","Stanford University"],"affiliations":[{"raw_affiliation_string":"University of Stanford","institution_ids":["https://openalex.org/I97018004"]},{"raw_affiliation_string":"Stanford University","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100668415","display_name":"Wenping Wang","orcid":"https://orcid.org/0000-0002-1355-5115"},"institutions":[{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Wenping Wang","raw_affiliation_strings":["Arizona State University, USA","Arizona State University"],"affiliations":[{"raw_affiliation_string":"Arizona State University, USA","institution_ids":["https://openalex.org/I55732556"]},{"raw_affiliation_string":"Arizona State University","institution_ids":["https://openalex.org/I55732556"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101987153","display_name":"Bo Yang","orcid":"https://orcid.org/0000-0001-5035-1472"},"institutions":[{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Bo Yang","raw_affiliation_strings":["Arizona State University, USA","Arizona State University"],"affiliations":[{"raw_affiliation_string":"Arizona State University, USA","institution_ids":["https://openalex.org/I55732556"]},{"raw_affiliation_string":"Arizona State University","institution_ids":["https://openalex.org/I55732556"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100740019","display_name":"Yu Cao","orcid":"https://orcid.org/0000-0001-6968-1180"},"institutions":[{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yu Cao","raw_affiliation_strings":["Arizona State University, USA","Arizona State University"],"affiliations":[{"raw_affiliation_string":"Arizona State University, USA","institution_ids":["https://openalex.org/I55732556"]},{"raw_affiliation_string":"Arizona State University","institution_ids":["https://openalex.org/I55732556"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5036312663","display_name":"Subhasish Mitra","orcid":"https://orcid.org/0000-0002-5572-5194"},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Mitra","raw_affiliation_strings":["University of Stanford","Stanford University"],"affiliations":[{"raw_affiliation_string":"University of Stanford","institution_ids":["https://openalex.org/I97018004"]},{"raw_affiliation_string":"Stanford University","institution_ids":["https://openalex.org/I97018004"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5024679466"],"corresponding_institution_ids":["https://openalex.org/I1311921367"],"apc_list":null,"apc_paid":null,"fwci":15.2571,"has_fulltext":false,"cited_by_count":141,"citation_normalized_percentile":{"value":0.99313738,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":100},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"10"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.6920451521873474},{"id":"https://openalex.org/keywords/negative-bias-temperature-instability","display_name":"Negative-bias temperature instability","score":0.6308770179748535},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5883157253265381},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.57328861951828},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5291144251823425},{"id":"https://openalex.org/keywords/accelerated-aging","display_name":"Accelerated aging","score":0.5091332793235779},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.4994800090789795},{"id":"https://openalex.org/keywords/circuit-reliability","display_name":"Circuit reliability","score":0.4846370816230774},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.46097531914711},{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.4569847881793976},{"id":"https://openalex.org/keywords/circuit-design","display_name":"Circuit design","score":0.4164276421070099},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.41383984684944153},{"id":"https://openalex.org/keywords/flip-flop","display_name":"Flip-flop","score":0.41037988662719727},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3670949935913086},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.25255072116851807},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19833332300186157},{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.16860023140907288},{"id":"https://openalex.org/keywords/mosfet","display_name":"MOSFET","score":0.15469199419021606},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.13557669520378113},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.13345810770988464},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.11288824677467346}],"concepts":[{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6920451521873474},{"id":"https://openalex.org/C557185","wikidata":"https://www.wikidata.org/wiki/Q6987194","display_name":"Negative-bias temperature instability","level":5,"score":0.6308770179748535},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5883157253265381},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.57328861951828},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5291144251823425},{"id":"https://openalex.org/C118820876","wikidata":"https://www.wikidata.org/wiki/Q4672283","display_name":"Accelerated aging","level":2,"score":0.5091332793235779},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.4994800090789795},{"id":"https://openalex.org/C2778309119","wikidata":"https://www.wikidata.org/wiki/Q5121614","display_name":"Circuit reliability","level":4,"score":0.4846370816230774},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.46097531914711},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.4569847881793976},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.4164276421070099},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.41383984684944153},{"id":"https://openalex.org/C2781007278","wikidata":"https://www.wikidata.org/wiki/Q183406","display_name":"Flip-flop","level":3,"score":0.41037988662719727},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3670949935913086},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.25255072116851807},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19833332300186157},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.16860023140907288},{"id":"https://openalex.org/C2778413303","wikidata":"https://www.wikidata.org/wiki/Q210793","display_name":"MOSFET","level":4,"score":0.15469199419021606},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.13557669520378113},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.13345810770988464},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.11288824677467346},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2008.4700619","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2008.4700619","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 IEEE International Test Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":18,"referenced_works":["https://openalex.org/W2041424982","https://openalex.org/W2041598550","https://openalex.org/W2056727633","https://openalex.org/W2102729267","https://openalex.org/W2103792078","https://openalex.org/W2108661028","https://openalex.org/W2134111163","https://openalex.org/W2134869654","https://openalex.org/W2141565132","https://openalex.org/W2149263288","https://openalex.org/W2164529645","https://openalex.org/W2170718760","https://openalex.org/W2171156763","https://openalex.org/W3147685595","https://openalex.org/W3150572018","https://openalex.org/W3152393692","https://openalex.org/W6676757766","https://openalex.org/W6680222014"],"related_works":["https://openalex.org/W2184065029","https://openalex.org/W2486596002","https://openalex.org/W1970920853","https://openalex.org/W2099679924","https://openalex.org/W2738622559","https://openalex.org/W1977755957","https://openalex.org/W2115165828","https://openalex.org/W2126834173","https://openalex.org/W2142908374","https://openalex.org/W1982822282"],"abstract_inverted_index":{"Circuit":[0,55],"failure":[1,56,116,147],"prediction":[2,57,148],"is":[3,24,41],"used":[4],"to":[5,98],"predict":[6],"occurrences":[7],"of":[8,44,48,75,78,129,144,154],"circuit":[9,115,146],"failures,":[10],"during":[11],"system":[12,18],"operation,":[13],"before":[14],"errors":[15],"appear":[16],"in":[17],"data":[19],"and":[20,73,142,156],"states.":[21],"This":[22,40,118],"technique":[23,97],"applicable":[25],"for":[26,113],"overcoming":[27],"major":[28],"scaled-CMOS":[29],"reliability":[30],"challenges":[31],"posed":[32],"by":[33],"aging":[34,53,63,83,105,131],"mechanisms":[35],"such":[36,52,101,130],"as":[37],"Negative-Bias-Temperature-Instability":[38],"(NBTI).":[39],"possible":[42],"because":[43],"the":[45,125,140],"gradual":[46],"nature":[47],"degradation":[49],"associated":[50],"with":[51,81,103,149],"mechanisms.":[54],"uses":[58],"special":[59],"on-chip":[60],"circuits":[61],"called":[62],"sensors.":[64,132],"In":[65],"this":[66],"paper,":[67],"we":[68],"experimentally":[69],"demonstrate":[70,139],"correct":[71],"functionality":[72],"practicality":[74,141],"two":[76,135],"flavors":[77],"flip-flop":[79],"designs":[80,138],"built-in":[82,104],"sensors":[84,106],"using":[85],"90":[86,136],"nm":[87,137],"test":[88],"chips.":[89],"We":[90],"also":[91,123],"present":[92],"an":[93],"aging-aware":[94,119],"timing":[95,120],"analysis":[96,121],"strategically":[99],"place":[100],"flip-flops":[102],"at":[107],"selective":[108],"locations":[109],"inside":[110],"a":[111],"chip":[112],"effective":[114],"prediction.":[117],"approach":[122],"minimizes":[124],"chip-level":[126,151],"area":[127,152],"impact":[128,153],"Results":[133],"from":[134],"effectiveness":[143],"optimized":[145],"overall":[150],"2.5%":[155],"0.6%.":[157]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":3},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":4},{"year":2020,"cited_by_count":5},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":8},{"year":2017,"cited_by_count":10},{"year":2016,"cited_by_count":10},{"year":2015,"cited_by_count":14},{"year":2014,"cited_by_count":15},{"year":2013,"cited_by_count":12},{"year":2012,"cited_by_count":11}],"updated_date":"2026-04-04T16:13:02.066488","created_date":"2025-10-10T00:00:00"}