{"id":"https://openalex.org/W2027660975","doi":"https://doi.org/10.1109/test.2008.4700600","title":"DFT Architecture for Automotive Microprocessors using On-Chip Scan Compression supporting Dual Vendor ATPG","display_name":"DFT Architecture for Automotive Microprocessors using On-Chip Scan Compression supporting Dual Vendor ATPG","publication_year":2008,"publication_date":"2008-10-01","ids":{"openalex":"https://openalex.org/W2027660975","doi":"https://doi.org/10.1109/test.2008.4700600","mag":"2027660975"},"language":"en","primary_location":{"id":"doi:10.1109/test.2008.4700600","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2008.4700600","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 IEEE International Test Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5043554445","display_name":"H. Ahrens","orcid":null},"institutions":[{"id":"https://openalex.org/I4210124177","display_name":"STMicroelectronics (Czechia)","ror":"https://ror.org/03c7ss521","country_code":"CZ","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210124177"]},{"id":"https://openalex.org/I4210147507","display_name":"STMicroelectronics (Germany)","ror":"https://ror.org/05hh7s019","country_code":"DE","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210147507"]}],"countries":["CZ","DE"],"is_corresponding":true,"raw_author_name":"H. Ahrens","raw_affiliation_strings":["Freescale Semiconductor, STMicroelectronics, Munchen, Germany","Freescale Semicond./STMicroelectronics, Munich"],"affiliations":[{"raw_affiliation_string":"Freescale Semiconductor, STMicroelectronics, Munchen, Germany","institution_ids":["https://openalex.org/I4210147507"]},{"raw_affiliation_string":"Freescale Semicond./STMicroelectronics, Munich","institution_ids":["https://openalex.org/I4210124177"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063049300","display_name":"Rolf Schlagenhaft","orcid":null},"institutions":[{"id":"https://openalex.org/I4210124177","display_name":"STMicroelectronics (Czechia)","ror":"https://ror.org/03c7ss521","country_code":"CZ","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210124177"]},{"id":"https://openalex.org/I4210147507","display_name":"STMicroelectronics (Germany)","ror":"https://ror.org/05hh7s019","country_code":"DE","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210147507"]}],"countries":["CZ","DE"],"is_corresponding":false,"raw_author_name":"R. Schlagenhaft","raw_affiliation_strings":["Freescale Semiconductor, STMicroelectronics, Munchen, Germany","Freescale Semicond./STMicroelectronics, Munich"],"affiliations":[{"raw_affiliation_string":"Freescale Semiconductor, STMicroelectronics, Munchen, Germany","institution_ids":["https://openalex.org/I4210147507"]},{"raw_affiliation_string":"Freescale Semicond./STMicroelectronics, Munich","institution_ids":["https://openalex.org/I4210124177"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074614677","display_name":"Helmut Lang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210147507","display_name":"STMicroelectronics (Germany)","ror":"https://ror.org/05hh7s019","country_code":"DE","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210147507"]},{"id":"https://openalex.org/I4210124177","display_name":"STMicroelectronics (Czechia)","ror":"https://ror.org/03c7ss521","country_code":"CZ","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210124177"]}],"countries":["CZ","DE"],"is_corresponding":false,"raw_author_name":"H. Lang","raw_affiliation_strings":["Freescale Semiconductor, STMicroelectronics, Munchen, Germany","Freescale Semicond./STMicroelectronics, Munich"],"affiliations":[{"raw_affiliation_string":"Freescale Semiconductor, STMicroelectronics, Munchen, Germany","institution_ids":["https://openalex.org/I4210147507"]},{"raw_affiliation_string":"Freescale Semicond./STMicroelectronics, Munich","institution_ids":["https://openalex.org/I4210124177"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101718449","display_name":"Vijay Srinivasan","orcid":"https://orcid.org/0000-0002-4653-8821"},"institutions":[{"id":"https://openalex.org/I4210147507","display_name":"STMicroelectronics (Germany)","ror":"https://ror.org/05hh7s019","country_code":"DE","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210147507"]},{"id":"https://openalex.org/I4210124177","display_name":"STMicroelectronics (Czechia)","ror":"https://ror.org/03c7ss521","country_code":"CZ","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210124177"]}],"countries":["CZ","DE"],"is_corresponding":false,"raw_author_name":"V. Srinivasan","raw_affiliation_strings":["Freescale Semiconductor, STMicroelectronics, Munchen, Germany","Freescale Semicond./STMicroelectronics, Munich"],"affiliations":[{"raw_affiliation_string":"Freescale Semiconductor, STMicroelectronics, Munchen, Germany","institution_ids":["https://openalex.org/I4210147507"]},{"raw_affiliation_string":"Freescale Semicond./STMicroelectronics, Munich","institution_ids":["https://openalex.org/I4210124177"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5070497540","display_name":"Enrico Bruzzano","orcid":null},"institutions":[{"id":"https://openalex.org/I4210147507","display_name":"STMicroelectronics (Germany)","ror":"https://ror.org/05hh7s019","country_code":"DE","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210147507"]},{"id":"https://openalex.org/I4210124177","display_name":"STMicroelectronics (Czechia)","ror":"https://ror.org/03c7ss521","country_code":"CZ","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210124177"]}],"countries":["CZ","DE"],"is_corresponding":false,"raw_author_name":"E. Bruzzano","raw_affiliation_strings":["Freescale Semiconductor, STMicroelectronics, Munchen, Germany","Freescale Semicond./STMicroelectronics, Munich"],"affiliations":[{"raw_affiliation_string":"Freescale Semiconductor, STMicroelectronics, Munchen, Germany","institution_ids":["https://openalex.org/I4210147507"]},{"raw_affiliation_string":"Freescale Semicond./STMicroelectronics, Munich","institution_ids":["https://openalex.org/I4210124177"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5043554445"],"corresponding_institution_ids":["https://openalex.org/I4210124177","https://openalex.org/I4210147507"],"apc_list":null,"apc_paid":null,"fwci":1.733,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.8571206,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":"7","issue":null,"first_page":"1","last_page":"10"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9952999949455261,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/automatic-test-pattern-generation","display_name":"Automatic test pattern generation","score":0.7181442379951477},{"id":"https://openalex.org/keywords/powerpc","display_name":"PowerPC","score":0.6980605125427246},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.634631335735321},{"id":"https://openalex.org/keywords/vendor","display_name":"Vendor","score":0.605899453163147},{"id":"https://openalex.org/keywords/automotive-industry","display_name":"Automotive industry","score":0.5993999242782593},{"id":"https://openalex.org/keywords/design-for-testing","display_name":"Design for testing","score":0.5925171375274658},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5807271003723145},{"id":"https://openalex.org/keywords/architecture","display_name":"Architecture","score":0.4996521472930908},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.492269903421402},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4759364128112793},{"id":"https://openalex.org/keywords/dual","display_name":"Dual (grammatical number)","score":0.44514837861061096},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.41836875677108765},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24238228797912598},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.16909706592559814},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.1480749547481537},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.09400123357772827},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.09337681531906128},{"id":"https://openalex.org/keywords/testability","display_name":"Testability","score":0.08859485387802124}],"concepts":[{"id":"https://openalex.org/C17626397","wikidata":"https://www.wikidata.org/wiki/Q837455","display_name":"Automatic test pattern generation","level":3,"score":0.7181442379951477},{"id":"https://openalex.org/C56005371","wikidata":"https://www.wikidata.org/wiki/Q209860","display_name":"PowerPC","level":3,"score":0.6980605125427246},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.634631335735321},{"id":"https://openalex.org/C2777338717","wikidata":"https://www.wikidata.org/wiki/Q1762621","display_name":"Vendor","level":2,"score":0.605899453163147},{"id":"https://openalex.org/C526921623","wikidata":"https://www.wikidata.org/wiki/Q190117","display_name":"Automotive industry","level":2,"score":0.5993999242782593},{"id":"https://openalex.org/C190874656","wikidata":"https://www.wikidata.org/wiki/Q5264347","display_name":"Design for testing","level":3,"score":0.5925171375274658},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5807271003723145},{"id":"https://openalex.org/C123657996","wikidata":"https://www.wikidata.org/wiki/Q12271","display_name":"Architecture","level":2,"score":0.4996521472930908},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.492269903421402},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4759364128112793},{"id":"https://openalex.org/C2780980858","wikidata":"https://www.wikidata.org/wiki/Q110022","display_name":"Dual (grammatical number)","level":2,"score":0.44514837861061096},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.41836875677108765},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24238228797912598},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.16909706592559814},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.1480749547481537},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.09400123357772827},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.09337681531906128},{"id":"https://openalex.org/C51234621","wikidata":"https://www.wikidata.org/wiki/Q2149495","display_name":"Testability","level":2,"score":0.08859485387802124},{"id":"https://openalex.org/C142362112","wikidata":"https://www.wikidata.org/wiki/Q735","display_name":"Art","level":0,"score":0.0},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.0},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.0},{"id":"https://openalex.org/C162853370","wikidata":"https://www.wikidata.org/wiki/Q39809","display_name":"Marketing","level":1,"score":0.0},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.0},{"id":"https://openalex.org/C124952713","wikidata":"https://www.wikidata.org/wiki/Q8242","display_name":"Literature","level":1,"score":0.0},{"id":"https://openalex.org/C153349607","wikidata":"https://www.wikidata.org/wiki/Q36649","display_name":"Visual arts","level":1,"score":0.0},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2008.4700600","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2008.4700600","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 IEEE International Test Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.5299999713897705}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W2108162883","https://openalex.org/W2108348488","https://openalex.org/W2126281568","https://openalex.org/W2160218852","https://openalex.org/W4302458519"],"related_works":["https://openalex.org/W1868476908","https://openalex.org/W2102127226","https://openalex.org/W2157212570","https://openalex.org/W2543176856","https://openalex.org/W1897203488","https://openalex.org/W2764440971","https://openalex.org/W1874075800","https://openalex.org/W2616892825","https://openalex.org/W2624668974","https://openalex.org/W1837475237"],"abstract_inverted_index":{"The":[0],"implementation":[1],"and":[2,26,78],"validation":[3],"of":[4,14,42,74],"a":[5,10,30],"common":[6],"DFT":[7],"architecture":[8,36],"for":[9,18],"new":[11,35],"product":[12],"family":[13],"PowerPC":[15],"based":[16,51],"microprocessors":[17],"various":[19],"automotive":[20],"applications":[21],"supporting":[22],"highest":[23],"quality":[24],"levels":[25],"low-cost":[27],"test":[28],"is":[29],"big":[31],"challenge.":[32],"When":[33],"this":[34,75],"has":[37],"to":[38],"satisfy":[39],"the":[40,63,72,80,84],"requirements":[41],"two":[43,47],"semiconductor":[44],"companies":[45],"using":[46],"different":[48,53],"CAD":[49],"flows":[50],"on":[52],"ATPG":[54],"tools":[55],"coming":[56],"with":[57],"incompatible":[58],"on-chip":[59],"scan":[60],"compression":[61],"solutions,":[62],"task":[64],"becomes":[65],"even":[66],"more":[67],"complex.":[68],"This":[69],"paper":[70],"describes":[71],"result":[73],"major":[76],"effort":[77],"shows":[79],"problems":[81],"encountered":[82],"along":[83],"way.":[85]},"counts_by_year":[{"year":2018,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}