{"id":"https://openalex.org/W2168662307","doi":"https://doi.org/10.1109/test.2008.4700596","title":"Detection and Diagnosis of Static Scan Cell Internal Defect","display_name":"Detection and Diagnosis of Static Scan Cell Internal Defect","publication_year":2008,"publication_date":"2008-10-01","ids":{"openalex":"https://openalex.org/W2168662307","doi":"https://doi.org/10.1109/test.2008.4700596","mag":"2168662307"},"language":"en","primary_location":{"id":"doi:10.1109/test.2008.4700596","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2008.4700596","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 IEEE International Test Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5019655330","display_name":"Ruifeng Guo","orcid":"https://orcid.org/0009-0000-9075-1884"},"institutions":[{"id":"https://openalex.org/I4210156212","display_name":"Mentor Technologies","ror":"https://ror.org/05vewsj04","country_code":"US","type":"other","lineage":["https://openalex.org/I4210156212"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Ruifeng Guo","raw_affiliation_strings":["Mentor Graphics Corp., Wilsonville, OR, USA"],"affiliations":[{"raw_affiliation_string":"Mentor Graphics Corp., Wilsonville, OR, USA","institution_ids":["https://openalex.org/I4210156212"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080887026","display_name":"Liyang Lai","orcid":"https://orcid.org/0000-0003-1041-8980"},"institutions":[{"id":"https://openalex.org/I4210156212","display_name":"Mentor Technologies","ror":"https://ror.org/05vewsj04","country_code":"US","type":"other","lineage":["https://openalex.org/I4210156212"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Liyang Lai","raw_affiliation_strings":["Mentor Graphics Corp., Wilsonville, OR, USA"],"affiliations":[{"raw_affiliation_string":"Mentor Graphics Corp., Wilsonville, OR, USA","institution_ids":["https://openalex.org/I4210156212"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101775144","display_name":"Yu Huang","orcid":"https://orcid.org/0000-0003-2619-4686"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Huang Yu","raw_affiliation_strings":["Mentor Graphics Corp. Wilsonville, OR 97070"],"affiliations":[{"raw_affiliation_string":"Mentor Graphics Corp. Wilsonville, OR 97070","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5020407423","display_name":"Wu-Tung Cheng","orcid":"https://orcid.org/0000-0001-6327-2394"},"institutions":[{"id":"https://openalex.org/I4210156212","display_name":"Mentor Technologies","ror":"https://ror.org/05vewsj04","country_code":"US","type":"other","lineage":["https://openalex.org/I4210156212"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Wu-Tung Cheng","raw_affiliation_strings":["Mentor Graphics Corp., Wilsonville, OR, USA"],"affiliations":[{"raw_affiliation_string":"Mentor Graphics Corp., Wilsonville, OR, USA","institution_ids":["https://openalex.org/I4210156212"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5019655330"],"corresponding_institution_ids":["https://openalex.org/I4210156212"],"apc_list":null,"apc_paid":null,"fwci":0.9988,"has_fulltext":false,"cited_by_count":17,"citation_normalized_percentile":{"value":0.79546144,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":"q1","issue":null,"first_page":"1","last_page":"10"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9855999946594238,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/scan-chain","display_name":"Scan chain","score":0.7047325372695923},{"id":"https://openalex.org/keywords/spice","display_name":"Spice","score":0.6296262741088867},{"id":"https://openalex.org/keywords/boundary-scan","display_name":"Boundary scan","score":0.470462441444397},{"id":"https://openalex.org/keywords/fault","display_name":"Fault (geology)","score":0.44972091913223267},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.42254653573036194},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.17165958881378174},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.11221843957901001},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.1103670597076416}],"concepts":[{"id":"https://openalex.org/C150012182","wikidata":"https://www.wikidata.org/wiki/Q225990","display_name":"Scan chain","level":3,"score":0.7047325372695923},{"id":"https://openalex.org/C2780077345","wikidata":"https://www.wikidata.org/wiki/Q16891888","display_name":"Spice","level":2,"score":0.6296262741088867},{"id":"https://openalex.org/C992767","wikidata":"https://www.wikidata.org/wiki/Q895156","display_name":"Boundary scan","level":3,"score":0.470462441444397},{"id":"https://openalex.org/C175551986","wikidata":"https://www.wikidata.org/wiki/Q47089","display_name":"Fault (geology)","level":2,"score":0.44972091913223267},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.42254653573036194},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17165958881378174},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.11221843957901001},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.1103670597076416},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C165205528","wikidata":"https://www.wikidata.org/wiki/Q83371","display_name":"Seismology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2008.4700596","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2008.4700596","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 IEEE International Test Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.5199999809265137,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":32,"referenced_works":["https://openalex.org/W1487528602","https://openalex.org/W1600468096","https://openalex.org/W1835662651","https://openalex.org/W1971016512","https://openalex.org/W2009698782","https://openalex.org/W2037589385","https://openalex.org/W2054963492","https://openalex.org/W2096366760","https://openalex.org/W2102372015","https://openalex.org/W2102556246","https://openalex.org/W2117253172","https://openalex.org/W2119205109","https://openalex.org/W2123072391","https://openalex.org/W2134998505","https://openalex.org/W2139664386","https://openalex.org/W2142308491","https://openalex.org/W2149546205","https://openalex.org/W2152489029","https://openalex.org/W2153336129","https://openalex.org/W2153923571","https://openalex.org/W2157200201","https://openalex.org/W2167258210","https://openalex.org/W2171012943","https://openalex.org/W3115008418","https://openalex.org/W3151279858","https://openalex.org/W4300938752","https://openalex.org/W6675364870","https://openalex.org/W6675373693","https://openalex.org/W6682357834","https://openalex.org/W6682481907","https://openalex.org/W6787767654","https://openalex.org/W6845537742"],"related_works":["https://openalex.org/W2117171289","https://openalex.org/W2102314186","https://openalex.org/W256629098","https://openalex.org/W2233209732","https://openalex.org/W2105797754","https://openalex.org/W1592537894","https://openalex.org/W2128260177","https://openalex.org/W4254647022","https://openalex.org/W2127184179","https://openalex.org/W2163124097"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"we":[3,62,84],"study":[4,46],"the":[5,11,38,47,129,132],"impact,":[6],"detection":[7],"and":[8,49,73],"diagnosis":[9,92,110,138],"of":[10,40,51,131],"defect":[12,36,56,117],"inside":[13],"a":[14,32,41,52,58,69,108],"scan":[15,20,33,43,53,64,80,90,101,114,121,134],"cell,":[16],"which":[17],"is":[18],"called":[19],"cell":[21,34,54,65,102,115,122,135],"internal":[22,35,55,66,103,116,123,136],"defect.":[23,104],"We":[24,105],"first":[25],"use":[26],"SPICE":[27],"simulation":[28,76],"to":[29,112],"understand":[30],"how":[31,86],"impacts":[37],"operation":[39],"single":[42],"cell.":[44],"To":[45],"detectability":[48],"diagnosability":[50],"in":[57],"production":[59,79],"test":[60,81],"environment,":[61],"inject":[63],"defects":[67],"into":[68],"scan-based":[70],"industrial":[71],"design":[72],"perform":[74],"fault":[75,97,124,137],"by":[77],"using":[78,120],"patterns.":[82],"Next,":[83],"evaluate":[85],"effective":[87],"an":[88],"existing":[89],"chain":[91],"technique":[93],"based":[94],"on":[95],"traditional":[96],"models":[98],"can":[99],"diagnose":[100],"finally":[106],"propose":[107],"new":[109],"algorithm":[111],"improve":[113],"diagnostic":[118],"resolution":[119],"model.":[125],"Experimental":[126],"results":[127],"show":[128],"effectiveness":[130],"proposed":[133],"technique.":[139]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":2},{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":3},{"year":2013,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}