{"id":"https://openalex.org/W1529163972","doi":"https://doi.org/10.1109/test.2004.1387450","title":"Diagnosis meets physical failure analysis: what is needed to succeed?","display_name":"Diagnosis meets physical failure analysis: what is needed to succeed?","publication_year":2005,"publication_date":"2005-03-21","ids":{"openalex":"https://openalex.org/W1529163972","doi":"https://doi.org/10.1109/test.2004.1387450","mag":"1529163972"},"language":"en","primary_location":{"id":"doi:10.1109/test.2004.1387450","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2004.1387450","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2004 International Conferce on Test","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"S. Venkataraman","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"S. Venkataraman","raw_affiliation_strings":["Intel Corporation, Hillsboro, OR","Intel Corporation, , Hillsboro, OR, USA"],"affiliations":[{"raw_affiliation_string":"Intel Corporation, Hillsboro, OR","institution_ids":["https://openalex.org/I1343180700"]},{"raw_affiliation_string":"Intel Corporation, , Hillsboro, OR, USA","institution_ids":["https://openalex.org/I1343180700"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I1343180700"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.04817119,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1442","last_page":"1442"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10923","display_name":"Force Microscopy Techniques and Applications","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/root-cause","display_name":"Root cause","score":0.7520431280136108},{"id":"https://openalex.org/keywords/root-cause-analysis","display_name":"Root cause analysis","score":0.7172579765319824},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.6870356202125549},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6368733048439026},{"id":"https://openalex.org/keywords/root","display_name":"Root (linguistics)","score":0.6006930470466614},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.5083109736442566},{"id":"https://openalex.org/keywords/risk-analysis","display_name":"Risk analysis (engineering)","score":0.47254276275634766},{"id":"https://openalex.org/keywords/work-in-process","display_name":"Work in process","score":0.42175182700157166},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.33491671085357666},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.292763352394104},{"id":"https://openalex.org/keywords/operations-management","display_name":"Operations management","score":0.15704664587974548},{"id":"https://openalex.org/keywords/business","display_name":"Business","score":0.1042027473449707}],"concepts":[{"id":"https://openalex.org/C84945661","wikidata":"https://www.wikidata.org/wiki/Q7366567","display_name":"Root cause","level":2,"score":0.7520431280136108},{"id":"https://openalex.org/C130963320","wikidata":"https://www.wikidata.org/wiki/Q1401207","display_name":"Root cause analysis","level":2,"score":0.7172579765319824},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.6870356202125549},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6368733048439026},{"id":"https://openalex.org/C171078966","wikidata":"https://www.wikidata.org/wiki/Q111029","display_name":"Root (linguistics)","level":2,"score":0.6006930470466614},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.5083109736442566},{"id":"https://openalex.org/C112930515","wikidata":"https://www.wikidata.org/wiki/Q4389547","display_name":"Risk analysis (engineering)","level":1,"score":0.47254276275634766},{"id":"https://openalex.org/C174998907","wikidata":"https://www.wikidata.org/wiki/Q357662","display_name":"Work in process","level":2,"score":0.42175182700157166},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.33491671085357666},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.292763352394104},{"id":"https://openalex.org/C21547014","wikidata":"https://www.wikidata.org/wiki/Q1423657","display_name":"Operations management","level":1,"score":0.15704664587974548},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.1042027473449707},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2004.1387450","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2004.1387450","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2004 International Conferce on Test","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.49000000953674316,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1864256460","https://openalex.org/W2138551793","https://openalex.org/W2171012943","https://openalex.org/W3110687601","https://openalex.org/W6786571830"],"related_works":["https://openalex.org/W2030594396","https://openalex.org/W2535098331","https://openalex.org/W2202104725","https://openalex.org/W4255366506","https://openalex.org/W2056250485","https://openalex.org/W4280640835","https://openalex.org/W2885334669","https://openalex.org/W2111856191","https://openalex.org/W4230518569","https://openalex.org/W4230900947"],"abstract_inverted_index":{"The":[0],"process":[1,25],"of":[2],"root-causing":[3,24],"failures":[4],"is":[5],"necessary":[6],"and":[7,15,28],"critical":[8],"for":[9],"ICs":[10],"given":[11],"both":[12],"aggressive":[13],"designs":[14],"new":[16],"manufacturing":[17],"processes.":[18],"Economic":[19],"considerations":[20],"makes":[21],"the":[22,40],"whole":[23,41],"better,":[26],"faster":[27],"cheaper.":[29],"Progress":[30],"requires":[31],"development":[32],"not":[33],"just":[34],"on":[35,39],"individual":[36],"tools":[37],"but":[38],"global":[42],"process.":[43]},"counts_by_year":[],"updated_date":"2026-04-16T08:26:57.006410","created_date":"2025-10-10T00:00:00"}