{"id":"https://openalex.org/W1535069151","doi":"https://doi.org/10.1109/test.2003.1271101","title":"Infrastructure IP for back-end yield improvement","display_name":"Infrastructure IP for back-end yield improvement","publication_year":2004,"publication_date":"2004-07-08","ids":{"openalex":"https://openalex.org/W1535069151","doi":"https://doi.org/10.1109/test.2003.1271101","mag":"1535069151"},"language":"en","primary_location":{"id":"doi:10.1109/test.2003.1271101","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2003.1271101","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Test Conference, 2003. Proceedings. ITC 2003.","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5051712738","display_name":"L. Forli","orcid":null},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]},{"id":"https://openalex.org/I4210116669","display_name":"Ch\u00e2teau Gombert","ror":"https://ror.org/02kspbq18","country_code":"FR","type":"other","lineage":["https://openalex.org/I4210116669"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"L. Forli","raw_affiliation_strings":["L2MP-Polytech-UMR CNR 6137 1MT - Technopole de Chateau Gombert, Marseille, France","ST-Microelectronics ZI de Rousset BP 2 131 06 Rousset, France","STMicroelectronics, Rousset, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"L2MP-Polytech-UMR CNR 6137 1MT - Technopole de Chateau Gombert, Marseille, France","institution_ids":["https://openalex.org/I4210116669"]},{"raw_affiliation_string":"ST-Microelectronics ZI de Rousset BP 2 131 06 Rousset, France","institution_ids":["https://openalex.org/I4210104693"]},{"raw_affiliation_string":"STMicroelectronics, Rousset, France","institution_ids":["https://openalex.org/I4210104693"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111841559","display_name":"J.M. Portal","orcid":null},"institutions":[{"id":"https://openalex.org/I4210116669","display_name":"Ch\u00e2teau Gombert","ror":"https://ror.org/02kspbq18","country_code":"FR","type":"other","lineage":["https://openalex.org/I4210116669"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"J.M. Portal","raw_affiliation_strings":["L2MP-Polytech-UMR CNR 6137 1MT - Technopole de Chateau Gombert, Marseille, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"L2MP-Polytech-UMR CNR 6137 1MT - Technopole de Chateau Gombert, Marseille, France","institution_ids":["https://openalex.org/I4210116669"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077872963","display_name":"D. Nec","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"D. Nec","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5083619989","display_name":"B. Borot","orcid":null},"institutions":[{"id":"https://openalex.org/I4210104693","display_name":"STMicroelectronics (France)","ror":"https://ror.org/01c74sd89","country_code":"FR","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210104693"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"B. Borot","raw_affiliation_strings":["ST-Microelectronics 850 rue Jean Monnet, France","STMicroelectronics, Crolles, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ST-Microelectronics 850 rue Jean Monnet, France","institution_ids":["https://openalex.org/I4210104693"]},{"raw_affiliation_string":"STMicroelectronics, Crolles, France","institution_ids":["https://openalex.org/I4210104693"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":"1","issue":null,"first_page":"1129","last_page":"1134"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.996999979019165,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/end-to-end-principle","display_name":"End-to-end principle","score":0.6012067198753357},{"id":"https://openalex.org/keywords/yield","display_name":"Yield (engineering)","score":0.5358216762542725},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5325267314910889},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.3052550256252289},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.08442544937133789}],"concepts":[{"id":"https://openalex.org/C74296488","wikidata":"https://www.wikidata.org/wiki/Q2527392","display_name":"End-to-end principle","level":2,"score":0.6012067198753357},{"id":"https://openalex.org/C134121241","wikidata":"https://www.wikidata.org/wiki/Q899301","display_name":"Yield (engineering)","level":2,"score":0.5358216762542725},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5325267314910889},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.3052550256252289},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.08442544937133789},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2003.1271101","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2003.1271101","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Test Conference, 2003. Proceedings. ITC 2003.","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.5699999928474426}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W1792362277","https://openalex.org/W1967967217","https://openalex.org/W1985238821","https://openalex.org/W2046280094","https://openalex.org/W2054971791","https://openalex.org/W2117314013","https://openalex.org/W2148172069","https://openalex.org/W2181842310"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W3179968364","https://openalex.org/W2390279801","https://openalex.org/W2358668433","https://openalex.org/W2376932109","https://openalex.org/W1999612375","https://openalex.org/W2001405890","https://openalex.org/W2382290278","https://openalex.org/W2938107654","https://openalex.org/W2478288626"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}