{"id":"https://openalex.org/W2101603079","doi":"https://doi.org/10.1109/test.2002.1041805","title":"Physical principles of interface design","display_name":"Physical principles of interface design","publication_year":2003,"publication_date":"2003-06-25","ids":{"openalex":"https://openalex.org/W2101603079","doi":"https://doi.org/10.1109/test.2002.1041805","mag":"2101603079"},"language":"en","primary_location":{"id":"doi:10.1109/test.2002.1041805","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2002.1041805","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings. International Test Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5063222696","display_name":"T. Sargent","orcid":null},"institutions":[{"id":"https://openalex.org/I4210151920","display_name":"HeidelbergCement (United States)","ror":"https://ror.org/04d8f4804","country_code":"US","type":"company","lineage":["https://openalex.org/I4210097355","https://openalex.org/I4210151920"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"T. Sargent","raw_affiliation_strings":["For Intest Corporation, Sunnyvale, CA, USA","Intest Corp., Sunnyvale, CA, USA"],"affiliations":[{"raw_affiliation_string":"For Intest Corporation, Sunnyvale, CA, USA","institution_ids":[]},{"raw_affiliation_string":"Intest Corp., Sunnyvale, CA, USA","institution_ids":["https://openalex.org/I4210151920"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5063222696"],"corresponding_institution_ids":["https://openalex.org/I4210151920"],"apc_list":null,"apc_paid":null,"fwci":0.6955,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.72555029,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"549","last_page":"554"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9817000031471252,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9817000031471252,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9519000053405762,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12971","display_name":"Material Properties and Processing","score":0.9498000144958496,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.7899348139762878},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.6986600160598755},{"id":"https://openalex.org/keywords/dielectric","display_name":"Dielectric","score":0.6886627078056335},{"id":"https://openalex.org/keywords/conductor","display_name":"Conductor","score":0.6204470992088318},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5509039759635925},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.550540566444397},{"id":"https://openalex.org/keywords/interface-model","display_name":"Interface model","score":0.425019234418869},{"id":"https://openalex.org/keywords/filter","display_name":"Filter (signal processing)","score":0.4223731756210327},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.32932645082473755},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2986559569835663},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.24430984258651733},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24394819140434265},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.19761693477630615},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.1496383547782898},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.07089442014694214}],"concepts":[{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.7899348139762878},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.6986600160598755},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.6886627078056335},{"id":"https://openalex.org/C34800285","wikidata":"https://www.wikidata.org/wiki/Q5159395","display_name":"Conductor","level":2,"score":0.6204470992088318},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5509039759635925},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.550540566444397},{"id":"https://openalex.org/C2988635477","wikidata":"https://www.wikidata.org/wiki/Q28130211","display_name":"Interface model","level":2,"score":0.425019234418869},{"id":"https://openalex.org/C106131492","wikidata":"https://www.wikidata.org/wiki/Q3072260","display_name":"Filter (signal processing)","level":2,"score":0.4223731756210327},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.32932645082473755},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2986559569835663},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.24430984258651733},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24394819140434265},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.19761693477630615},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1496383547782898},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.07089442014694214},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0},{"id":"https://openalex.org/C107457646","wikidata":"https://www.wikidata.org/wiki/Q207434","display_name":"Human\u2013computer interaction","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2002.1041805","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2002.1041805","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings. International Test Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.4699999988079071}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W1482626706","https://openalex.org/W1532219419","https://openalex.org/W2159701060"],"related_works":["https://openalex.org/W3044879782","https://openalex.org/W2384814135","https://openalex.org/W4241044836","https://openalex.org/W2068090532","https://openalex.org/W2085062582","https://openalex.org/W1991052233","https://openalex.org/W2365762807","https://openalex.org/W268054971","https://openalex.org/W1815006996","https://openalex.org/W2170435352"],"abstract_inverted_index":{"In":[0],"the":[1,3,23,48,51,55,66,78,97,115],"past,":[2],"test":[4,56],"interface":[5,24,57],"did":[6],"not":[7],"need":[8],"to":[9,26,30,118,123],"be":[10,27],"modeled":[11,28],"well,":[12],"operating":[13],"at":[14],"low":[15],"speed.":[16],"As":[17,104],"bandwidth":[18,119],"increases":[19],"past":[20],"1":[21],"GHz,":[22],"needs":[25],"according":[29],"its":[31],"distributed":[32],"properties.":[33],"By":[34],"comparing":[35],"S-parameters":[36],"of":[37,53,69,96],"a":[38,121],"correct":[39],"model":[40],"with":[41],"an":[42],"ostensibly":[43],"similar":[44],"RC":[45],"filter":[46],"model,":[47],"author":[49],"critiques":[50],"suitability":[52],"oversimplifying":[54],"model.":[58],"Bandwidth":[59],"limitation":[60],"in":[61,127],"PCBs,":[62],"as":[63,77],"caused":[64],"by":[65],"physical":[67],"properties":[68],"materials":[70],"and":[71,88,94,99,130],"characteristic":[72],"trace":[73],"geometry,":[74],"is":[75,109,133],"examined":[76],"central":[79],"theme.":[80],"The":[81],"two":[82],"most":[83],"significant":[84],"material":[85,126],"effects,":[86],"conductor":[87],"dielectric":[89,125],"losses,":[90],"are":[91,102,106],"isolated,":[92],"modeled,":[93],"derivations":[95],"frequency":[98],"step":[100],"responses":[101],"presented.":[103],"mismatches":[105],"reduced,":[107],"it":[108],"shown":[110],"that":[111],"these":[112],"losses":[113],"become":[114],"dominant":[116],"limitations":[117],"until":[120],"change":[122],"superior":[124],"load":[128],"boards":[129],"probe":[131],"cards":[132],"made.":[134]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}