{"id":"https://openalex.org/W1817484964","doi":"https://doi.org/10.1109/test.2002.1041790","title":"Realistic spring probe testing methods and results","display_name":"Realistic spring probe testing methods and results","publication_year":2003,"publication_date":"2003-06-25","ids":{"openalex":"https://openalex.org/W1817484964","doi":"https://doi.org/10.1109/test.2002.1041790","mag":"1817484964"},"language":"en","primary_location":{"id":"doi:10.1109/test.2002.1041790","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2002.1041790","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings. International Test Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5010538218","display_name":"David Jacob Gessel","orcid":"https://orcid.org/0000-0003-1682-1754"},"institutions":[{"id":"https://openalex.org/I22113271","display_name":"Teradyne (United States)","ror":"https://ror.org/02b00gr50","country_code":"US","type":"company","lineage":["https://openalex.org/I22113271"]},{"id":"https://openalex.org/I4210100046","display_name":"Integra (United States)","ror":"https://ror.org/00ynqbp15","country_code":"US","type":"company","lineage":["https://openalex.org/I4210100046"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"D. Gessel","raw_affiliation_strings":["Teradyne Integra Test Division, Bedford, MA, USA"],"affiliations":[{"raw_affiliation_string":"Teradyne Integra Test Division, Bedford, MA, USA","institution_ids":["https://openalex.org/I22113271","https://openalex.org/I4210100046"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042726858","display_name":"A. Slcoum","orcid":null},"institutions":[{"id":"https://openalex.org/I4210110987","display_name":"IIT@MIT","ror":"https://ror.org/01wp8zh54","country_code":"US","type":"facility","lineage":["https://openalex.org/I30771326","https://openalex.org/I4210110987"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Slcoum","raw_affiliation_strings":["Department of Mechanical Engineering, MIT, Cambridge, MA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, MIT, Cambridge, MA, USA","institution_ids":["https://openalex.org/I4210110987"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042012589","display_name":"Alexander D. Sprunt","orcid":null},"institutions":[{"id":"https://openalex.org/I4210110987","display_name":"IIT@MIT","ror":"https://ror.org/01wp8zh54","country_code":"US","type":"facility","lineage":["https://openalex.org/I30771326","https://openalex.org/I4210110987"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Sprunt","raw_affiliation_strings":["Department of Mechanical Engineering, MIT, Cambridge, MA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, MIT, Cambridge, MA, USA","institution_ids":["https://openalex.org/I4210110987"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5037165066","display_name":"Stefan Ziegenhagen","orcid":null},"institutions":[{"id":"https://openalex.org/I22113271","display_name":"Teradyne (United States)","ror":"https://ror.org/02b00gr50","country_code":"US","type":"company","lineage":["https://openalex.org/I22113271"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S. Ziegenhagen","raw_affiliation_strings":["Teradyne Connection Systems, Inc., Nashua, NH, USA"],"affiliations":[{"raw_affiliation_string":"Teradyne Connection Systems, Inc., Nashua, NH, USA","institution_ids":["https://openalex.org/I22113271"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5010538218"],"corresponding_institution_ids":["https://openalex.org/I22113271","https://openalex.org/I4210100046"],"apc_list":null,"apc_paid":null,"fwci":0.3477,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.59405422,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"417","last_page":"423"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.983299970626831,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.983299970626831,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12564","display_name":"Sensor Technology and Measurement Systems","score":0.9825000166893005,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9750000238418579,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/spring","display_name":"Spring (device)","score":0.832782506942749},{"id":"https://openalex.org/keywords/selection","display_name":"Selection (genetic algorithm)","score":0.583153486251831},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.582024335861206},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.264067679643631},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.23268216848373413},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.2244778871536255}],"concepts":[{"id":"https://openalex.org/C2778712887","wikidata":"https://www.wikidata.org/wiki/Q102836","display_name":"Spring (device)","level":2,"score":0.832782506942749},{"id":"https://openalex.org/C81917197","wikidata":"https://www.wikidata.org/wiki/Q628760","display_name":"Selection (genetic algorithm)","level":2,"score":0.583153486251831},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.582024335861206},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.264067679643631},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.23268216848373413},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.2244778871536255}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/test.2002.1041790","is_oa":false,"landing_page_url":"https://doi.org/10.1109/test.2002.1041790","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings. International Test Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W1512932400","https://openalex.org/W1514484039","https://openalex.org/W4237716869","https://openalex.org/W6630989429"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2808213426","https://openalex.org/W2016759238","https://openalex.org/W2807711811","https://openalex.org/W2808279233","https://openalex.org/W1978394698","https://openalex.org/W4247955010","https://openalex.org/W2390279801","https://openalex.org/W2294789132","https://openalex.org/W2606062946"],"abstract_inverted_index":{"A":[0],"tester":[1],"was":[2],"developed":[3],"to":[4,17],"accurately":[5],"reproduce":[6],"spring":[7],"probe":[8,23],"operating":[9],"environments,":[10],"enabling":[11],"the":[12],"selection":[13],"of":[14],"probing":[15],"parameters":[16],"maintain":[18],"electrical":[19],"performance":[20],"while":[21],"extending":[22],"life.":[24]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}