{"id":"https://openalex.org/W7130335958","doi":"https://doi.org/10.1109/tencon66050.2025.11375079","title":"An Electrical Behavior Analysis Method of Esd Protection Structure in Chip Based on Spice","display_name":"An Electrical Behavior Analysis Method of Esd Protection Structure in Chip Based on Spice","publication_year":2025,"publication_date":"2025-10-27","ids":{"openalex":"https://openalex.org/W7130335958","doi":"https://doi.org/10.1109/tencon66050.2025.11375079"},"language":null,"primary_location":{"id":"doi:10.1109/tencon66050.2025.11375079","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tencon66050.2025.11375079","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"TENCON 2025 - 2025 IEEE Region 10 Conference (TENCON)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111955512","display_name":"Siyuan Shen","orcid":"https://orcid.org/0000-0002-4131-3607"},"institutions":[{"id":"https://openalex.org/I82880672","display_name":"Beihang University","ror":"https://ror.org/00wk2mp56","country_code":"CN","type":"education","lineage":["https://openalex.org/I82880672"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Siyuan Shen","raw_affiliation_strings":["School of Reliability and Systems Engineering, Beihang University,Beijing,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Reliability and Systems Engineering, Beihang University,Beijing,China","institution_ids":["https://openalex.org/I82880672"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075088978","display_name":"X.Y. Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I82880672","display_name":"Beihang University","ror":"https://ror.org/00wk2mp56","country_code":"CN","type":"education","lineage":["https://openalex.org/I82880672"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiangfen Wang","raw_affiliation_strings":["School of Reliability and Systems Engineering, Beihang University,Beijing,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Reliability and Systems Engineering, Beihang University,Beijing,China","institution_ids":["https://openalex.org/I82880672"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5002971959","display_name":"Bo Wan","orcid":"https://orcid.org/0000-0003-1460-3614"},"institutions":[{"id":"https://openalex.org/I82880672","display_name":"Beihang University","ror":"https://ror.org/00wk2mp56","country_code":"CN","type":"education","lineage":["https://openalex.org/I82880672"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Bo Wan","raw_affiliation_strings":["School of Reliability and Systems Engineering, Beihang University,Beijing,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Reliability and Systems Engineering, Beihang University,Beijing,China","institution_ids":["https://openalex.org/I82880672"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5070547032","display_name":"Guicui Fu","orcid":"https://orcid.org/0000-0001-6295-3454"},"institutions":[{"id":"https://openalex.org/I82880672","display_name":"Beihang University","ror":"https://ror.org/00wk2mp56","country_code":"CN","type":"education","lineage":["https://openalex.org/I82880672"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Guicui Fu","raw_affiliation_strings":["School of Reliability and Systems Engineering, Beihang University,Beijing,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Reliability and Systems Engineering, Beihang University,Beijing,China","institution_ids":["https://openalex.org/I82880672"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I82880672"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.70524864,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"659","last_page":"663"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11005","display_name":"Radiation Effects in Electronics","score":0.0003000000142492354,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12122","display_name":"Physical Unclonable Functions (PUFs) and Hardware Security","score":0.00019999999494757503,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/spice","display_name":"Spice","score":0.8744999766349792},{"id":"https://openalex.org/keywords/electrostatic-discharge","display_name":"Electrostatic discharge","score":0.5745999813079834},{"id":"https://openalex.org/keywords/human-body-model","display_name":"Human-body model","score":0.5313000082969666},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4851999878883362},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.45730000734329224},{"id":"https://openalex.org/keywords/transmission-line","display_name":"Transmission line","score":0.4381999969482422},{"id":"https://openalex.org/keywords/key","display_name":"Key (lock)","score":0.41019999980926514},{"id":"https://openalex.org/keywords/workflow","display_name":"Workflow","score":0.4075999855995178},{"id":"https://openalex.org/keywords/electric-power-transmission","display_name":"Electric power transmission","score":0.38999998569488525}],"concepts":[{"id":"https://openalex.org/C2780077345","wikidata":"https://www.wikidata.org/wiki/Q16891888","display_name":"Spice","level":2,"score":0.8744999766349792},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.6273000240325928},{"id":"https://openalex.org/C205483674","wikidata":"https://www.wikidata.org/wiki/Q3574961","display_name":"Electrostatic discharge","level":3,"score":0.5745999813079834},{"id":"https://openalex.org/C2781089380","wikidata":"https://www.wikidata.org/wiki/Q5936753","display_name":"Human-body model","level":2,"score":0.5313000082969666},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4851999878883362},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.46369999647140503},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.45730000734329224},{"id":"https://openalex.org/C33441834","wikidata":"https://www.wikidata.org/wiki/Q693004","display_name":"Transmission line","level":2,"score":0.4381999969482422},{"id":"https://openalex.org/C26517878","wikidata":"https://www.wikidata.org/wiki/Q228039","display_name":"Key (lock)","level":2,"score":0.41019999980926514},{"id":"https://openalex.org/C177212765","wikidata":"https://www.wikidata.org/wiki/Q627335","display_name":"Workflow","level":2,"score":0.4075999855995178},{"id":"https://openalex.org/C140311924","wikidata":"https://www.wikidata.org/wiki/Q200928","display_name":"Electric power transmission","level":2,"score":0.38999998569488525},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3824000060558319},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.37790000438690186},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.3513000011444092},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.3483000099658966},{"id":"https://openalex.org/C121922863","wikidata":"https://www.wikidata.org/wiki/Q180805","display_name":"Thyristor","level":3,"score":0.3450999855995178},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.3449000120162964},{"id":"https://openalex.org/C198352243","wikidata":"https://www.wikidata.org/wiki/Q37105","display_name":"Line (geometry)","level":2,"score":0.34450000524520874},{"id":"https://openalex.org/C177264268","wikidata":"https://www.wikidata.org/wiki/Q1514741","display_name":"Set (abstract data type)","level":2,"score":0.3352000117301941},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3109000027179718},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.29440000653266907},{"id":"https://openalex.org/C99844830","wikidata":"https://www.wikidata.org/wiki/Q102441924","display_name":"Scaling","level":2,"score":0.2712000012397766},{"id":"https://openalex.org/C761482","wikidata":"https://www.wikidata.org/wiki/Q118093","display_name":"Transmission (telecommunications)","level":2,"score":0.2612999975681305},{"id":"https://openalex.org/C50100734","wikidata":"https://www.wikidata.org/wiki/Q7303176","display_name":"Rectifier (neural networks)","level":5,"score":0.25699999928474426},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.2563000023365021},{"id":"https://openalex.org/C28285623","wikidata":"https://www.wikidata.org/wiki/Q176110","display_name":"Insulated-gate bipolar transistor","level":3,"score":0.2549000084400177},{"id":"https://openalex.org/C79635011","wikidata":"https://www.wikidata.org/wiki/Q175805","display_name":"Semiconductor device","level":3,"score":0.2517000138759613}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tencon66050.2025.11375079","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tencon66050.2025.11375079","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"TENCON 2025 - 2025 IEEE Region 10 Conference (TENCON)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W2004168604","https://openalex.org/W2063429112","https://openalex.org/W2538830844","https://openalex.org/W2565121823","https://openalex.org/W2901492807","https://openalex.org/W2913322624","https://openalex.org/W4285099971","https://openalex.org/W4285820060","https://openalex.org/W4298001743","https://openalex.org/W4376624519","https://openalex.org/W4389988566","https://openalex.org/W4390574186","https://openalex.org/W4392152130"],"related_works":[],"abstract_inverted_index":{"With":[0],"the":[1,25,48,55,82,106,124],"continued":[2],"scaling":[3],"of":[4,27,110,128],"integrated":[5],"circuits":[6],"(ICs),":[7],"strong":[8],"electrostatic-discharge":[9],"(ESD)":[10],"protection":[11,29,84,112,126],"is":[12,35,79],"increasingly":[13],"essential":[14],"for":[15,23,87,100,138,149],"device":[16,78,153],"reliability.":[17],"This":[18],"paper":[19],"presents":[20],"a":[21,97,135,146],"method":[22],"analyzing":[24],"behavior":[26,50],"SCR-based":[28],"structures":[30],"using":[31],"SPICE.":[32,73],"The":[33,74,93,131],"workflow":[34],"driven":[36],"by":[37],"Transmission":[38],"Line":[39],"Pulse":[40],"(TLP)":[41],"measurements,":[42],"which":[43],"are":[44,67,120],"used":[45,80],"to":[46,52,122],"characterize":[47],"electrical":[49],"and":[51,65,72,90,102,108,140,154],"set":[53],"up":[54],"simulations.":[56],"Key":[57],"metrics":[58],"such":[59],"as":[60,81],"triggering":[61],"voltage,":[62,64],"holding":[63],"snap-back":[66],"examined":[68],"through":[69],"both":[70],"experiments":[71],"SiliconControlled":[75],"Rectifier":[76],"(SCR)":[77],"representative":[83],"structure,":[85],"known":[86],"its":[88],"reliable":[89,147],"efficient":[91],"performance.":[92],"proposed":[94],"methodology":[95],"provides":[96],"practical":[98],"framework":[99],"simulation":[101],"experimental":[103],"verification,":[104],"supporting":[105],"design":[107],"optimization":[109,150],"ESD":[111,143],"in":[113,151],"ICs.":[114],"In":[115],"particular,":[116],"hybrid":[117],"SPICE":[118],"models":[119],"shown":[121],"capture":[123],"overall":[125],"performance":[127],"SCR":[129],"structures.":[130],"analysis":[132],"also":[133],"offers":[134],"systematic":[136],"process":[137],"comparing":[139],"balancing":[141],"alternative":[142],"solutions,":[144],"providing":[145],"basis":[148],"semiconductor":[152],"packaging":[155],"design.":[156]},"counts_by_year":[],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2026-02-19T00:00:00"}