{"id":"https://openalex.org/W7130383691","doi":"https://doi.org/10.1109/tencon66050.2025.11374966","title":"Real-Time Vision Inspection with AI-Based Edge Processor for Printed Circuit Board Assembly Quality Control","display_name":"Real-Time Vision Inspection with AI-Based Edge Processor for Printed Circuit Board Assembly Quality Control","publication_year":2025,"publication_date":"2025-10-27","ids":{"openalex":"https://openalex.org/W7130383691","doi":"https://doi.org/10.1109/tencon66050.2025.11374966"},"language":null,"primary_location":{"id":"doi:10.1109/tencon66050.2025.11374966","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tencon66050.2025.11374966","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"TENCON 2025 - 2025 IEEE Region 10 Conference (TENCON)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5126302279","display_name":"Lai Jun Le","orcid":null},"institutions":[{"id":"https://openalex.org/I96413208","display_name":"Swinburne University of Technology Sarawak Campus","ror":"https://ror.org/014cjmc76","country_code":"MY","type":"education","lineage":["https://openalex.org/I57093077","https://openalex.org/I96413208"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"Lai Jun Le","raw_affiliation_strings":["Swinburne University of Technology,Faculty of Engineering, Computer & Science,Sarawak,Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Swinburne University of Technology,Faculty of Engineering, Computer & Science,Sarawak,Malaysia","institution_ids":["https://openalex.org/I96413208"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5012799969","display_name":"Hudyjaya Siswoyo Jo","orcid":"https://orcid.org/0000-0001-7386-238X"},"institutions":[{"id":"https://openalex.org/I96413208","display_name":"Swinburne University of Technology Sarawak Campus","ror":"https://ror.org/014cjmc76","country_code":"MY","type":"education","lineage":["https://openalex.org/I57093077","https://openalex.org/I96413208"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"Hudyjaya Siswoyo Jo","raw_affiliation_strings":["Swinburne University of Technology,Faculty of Engineering, Computer & Science,Sarawak,Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Swinburne University of Technology,Faculty of Engineering, Computer & Science,Sarawak,Malaysia","institution_ids":["https://openalex.org/I96413208"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I96413208"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.72484221,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1078","last_page":"1082"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9611999988555908,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9611999988555908,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10036","display_name":"Advanced Neural Network Applications","score":0.004699999932199717,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12549","display_name":"Image and Object Detection Techniques","score":0.0031999999191612005,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/automated-optical-inspection","display_name":"Automated optical inspection","score":0.8898000121116638},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.8522999882698059},{"id":"https://openalex.org/keywords/flexibility","display_name":"Flexibility (engineering)","score":0.7402999997138977},{"id":"https://openalex.org/keywords/enhanced-data-rates-for-gsm-evolution","display_name":"Enhanced Data Rates for GSM Evolution","score":0.6151999831199646},{"id":"https://openalex.org/keywords/adaptability","display_name":"Adaptability","score":0.5475999712944031},{"id":"https://openalex.org/keywords/quality","display_name":"Quality (philosophy)","score":0.45910000801086426},{"id":"https://openalex.org/keywords/automated-x-ray-inspection","display_name":"Automated X-ray inspection","score":0.4422999918460846},{"id":"https://openalex.org/keywords/surface-mount-technology","display_name":"Surface-mount technology","score":0.4108000099658966},{"id":"https://openalex.org/keywords/software-deployment","display_name":"Software deployment","score":0.4081000089645386},{"id":"https://openalex.org/keywords/control-system","display_name":"Control system","score":0.39590001106262207}],"concepts":[{"id":"https://openalex.org/C164830781","wikidata":"https://www.wikidata.org/wiki/Q787330","display_name":"Automated optical inspection","level":2,"score":0.8898000121116638},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.8522999882698059},{"id":"https://openalex.org/C2780598303","wikidata":"https://www.wikidata.org/wiki/Q65921492","display_name":"Flexibility (engineering)","level":2,"score":0.7402999997138977},{"id":"https://openalex.org/C162307627","wikidata":"https://www.wikidata.org/wiki/Q204833","display_name":"Enhanced Data Rates for GSM Evolution","level":2,"score":0.6151999831199646},{"id":"https://openalex.org/C177606310","wikidata":"https://www.wikidata.org/wiki/Q5674297","display_name":"Adaptability","level":2,"score":0.5475999712944031},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4805000126361847},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.47429999709129333},{"id":"https://openalex.org/C2779530757","wikidata":"https://www.wikidata.org/wiki/Q1207505","display_name":"Quality (philosophy)","level":2,"score":0.45910000801086426},{"id":"https://openalex.org/C146920229","wikidata":"https://www.wikidata.org/wiki/Q2278114","display_name":"Automated X-ray inspection","level":4,"score":0.4422999918460846},{"id":"https://openalex.org/C2776584680","wikidata":"https://www.wikidata.org/wiki/Q191042","display_name":"Surface-mount technology","level":3,"score":0.4108000099658966},{"id":"https://openalex.org/C105339364","wikidata":"https://www.wikidata.org/wiki/Q2297740","display_name":"Software deployment","level":2,"score":0.4081000089645386},{"id":"https://openalex.org/C17500928","wikidata":"https://www.wikidata.org/wiki/Q959968","display_name":"Control system","level":2,"score":0.39590001106262207},{"id":"https://openalex.org/C106436119","wikidata":"https://www.wikidata.org/wiki/Q836575","display_name":"Quality assurance","level":3,"score":0.35740000009536743},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3529999852180481},{"id":"https://openalex.org/C5339829","wikidata":"https://www.wikidata.org/wiki/Q1425977","display_name":"Machine vision","level":2,"score":0.3434000015258789},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.33230000734329224},{"id":"https://openalex.org/C2775924081","wikidata":"https://www.wikidata.org/wiki/Q55608371","display_name":"Control (management)","level":2,"score":0.3237000107765198},{"id":"https://openalex.org/C191281628","wikidata":"https://www.wikidata.org/wiki/Q977971","display_name":"Solder paste","level":3,"score":0.3093999922275543},{"id":"https://openalex.org/C39736607","wikidata":"https://www.wikidata.org/wiki/Q5071834","display_name":"Change control board","level":2,"score":0.3091999888420105},{"id":"https://openalex.org/C17511633","wikidata":"https://www.wikidata.org/wiki/Q830694","display_name":"SMT placement equipment","level":3,"score":0.29919999837875366},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.29580000042915344},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.287200003862381},{"id":"https://openalex.org/C2776214188","wikidata":"https://www.wikidata.org/wiki/Q408386","display_name":"Inference","level":2,"score":0.2863999903202057},{"id":"https://openalex.org/C168820333","wikidata":"https://www.wikidata.org/wiki/Q448889","display_name":"Visual inspection","level":2,"score":0.2808000147342682},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.2784000039100647},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.27549999952316284},{"id":"https://openalex.org/C115901376","wikidata":"https://www.wikidata.org/wiki/Q184199","display_name":"Automation","level":2,"score":0.27410000562667847},{"id":"https://openalex.org/C90673727","wikidata":"https://www.wikidata.org/wiki/Q901718","display_name":"Product (mathematics)","level":2,"score":0.2671999931335449},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.266400009393692},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.2644999921321869},{"id":"https://openalex.org/C188198153","wikidata":"https://www.wikidata.org/wiki/Q1613840","display_name":"Limiting","level":2,"score":0.2628999948501587},{"id":"https://openalex.org/C26517878","wikidata":"https://www.wikidata.org/wiki/Q228039","display_name":"Key (lock)","level":2,"score":0.25859999656677246},{"id":"https://openalex.org/C2780407802","wikidata":"https://www.wikidata.org/wiki/Q6146499","display_name":"Inspection time","level":2,"score":0.25839999318122864},{"id":"https://openalex.org/C2779304628","wikidata":"https://www.wikidata.org/wiki/Q3503480","display_name":"Face (sociological concept)","level":2,"score":0.25040000677108765}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tencon66050.2025.11374966","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tencon66050.2025.11374966","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"TENCON 2025 - 2025 IEEE Region 10 Conference (TENCON)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.515286922454834}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W3114273261","https://openalex.org/W3167277963","https://openalex.org/W3198979465","https://openalex.org/W3203234901","https://openalex.org/W4297089455","https://openalex.org/W4323045956","https://openalex.org/W4361829816","https://openalex.org/W4366816008","https://openalex.org/W4385521700","https://openalex.org/W4389352643","https://openalex.org/W4399039794","https://openalex.org/W4409637830","https://openalex.org/W4410154245"],"related_works":[],"abstract_inverted_index":{"In":[0],"modern":[1],"electronic":[2],"manufacturing,":[3],"particularly":[4],"in":[5,112,128,140],"printed":[6],"circuit":[7],"board":[8,43],"(PCB)":[9],"assembly,":[10],"ensuring":[11],"product":[12],"quality":[13,148],"through":[14],"automated":[15,21,147],"inspection":[16,23,58],"is":[17,73,97,110],"essential.":[18],"While":[19],"traditional":[20],"optical":[22],"(AOI)":[24],"systems":[25],"are":[26,38],"effective,":[27],"they":[28],"often":[29],"face":[30],"limitations":[31],"when":[32],"dealing":[33],"with":[34,68],"complex":[35],"assemblies":[36,119],"and":[37,47,90,124,144],"typically":[39],"designed":[40],"for":[41,60,126],"specific":[42],"types,":[44],"limiting":[45],"flexibility":[46,143],"scalability.":[48],"This":[49],"research":[50],"presents":[51],"the":[52,134,142],"development":[53],"of":[54,136,146],"a":[55,76],"universal,":[56],"real-time":[57],"system":[59,72,109],"PCB":[61,81,118],"assembly":[62,82],"using":[63,116],"artificial":[64],"intelligence":[65],"(AI)":[66],"integrated":[67],"edge":[69,105,138],"computing.":[70],"The":[71,107],"trained":[74],"on":[75,103],"diverse":[77],"dataset":[78],"containing":[79],"common":[80],"defects,":[83],"such":[84],"as":[85],"missing":[86],"components,":[87],"solder":[88],"bridging,":[89],"insufficient":[91],"solder.":[92],"A":[93],"lightweight":[94],"AI":[95],"model":[96],"developed":[98],"to":[99,120],"enable":[100],"efficient":[101],"inference":[102],"low-power":[104],"processors.":[106],"proposed":[108],"evaluated":[111],"real-world":[113],"testing":[114],"scenarios":[115],"different":[117],"validate":[121],"its":[122],"adaptability":[123],"feasibility":[125],"deployment":[127],"practical":[129],"manufacturing":[130],"environments.":[131],"Results":[132],"demonstrate":[133],"potential":[135],"AI-based":[137],"solutions":[139],"enhancing":[141],"performance":[145],"control":[149],"processes.":[150]},"counts_by_year":[],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2026-02-19T00:00:00"}