{"id":"https://openalex.org/W4408258545","doi":"https://doi.org/10.1109/tencon61640.2024.10902751","title":"Artificial Intelligence to Expedite Thermal Index Testing and Accelerate Polymer Regulatory Approvals","display_name":"Artificial Intelligence to Expedite Thermal Index Testing and Accelerate Polymer Regulatory Approvals","publication_year":2024,"publication_date":"2024-12-01","ids":{"openalex":"https://openalex.org/W4408258545","doi":"https://doi.org/10.1109/tencon61640.2024.10902751"},"language":"en","primary_location":{"id":"doi:10.1109/tencon61640.2024.10902751","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tencon61640.2024.10902751","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"TENCON 2024 - 2024 IEEE Region 10 Conference (TENCON)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5110963397","display_name":"S Wang","orcid":null},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Shirley Xue Wang","raw_affiliation_strings":["TE Connectivity,AI Hub,Singapore"],"affiliations":[{"raw_affiliation_string":"TE Connectivity,AI Hub,Singapore","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033315032","display_name":"Jessica Hemond","orcid":null},"institutions":[{"id":"https://openalex.org/I4210140621","display_name":"TE Connectivity (United States)","ror":"https://ror.org/034frgp20","country_code":"US","type":"company","lineage":["https://openalex.org/I136150977","https://openalex.org/I4210140621"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jessica Hemond","raw_affiliation_strings":["TE Connectivity,Corporate Technology, Additive Manufacturing,Harrisburg,PA,USA"],"affiliations":[{"raw_affiliation_string":"TE Connectivity,Corporate Technology, Additive Manufacturing,Harrisburg,PA,USA","institution_ids":["https://openalex.org/I4210140621"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071015273","display_name":"Charles Chen","orcid":"https://orcid.org/0000-0002-2203-0433"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Charles Chen","raw_affiliation_strings":["TE Connectivity,AI Hub,Singapore"],"affiliations":[{"raw_affiliation_string":"TE Connectivity,AI Hub,Singapore","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5040721193","display_name":"Rachel Martens","orcid":"https://orcid.org/0000-0002-2716-6495"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Rodney Martens","raw_affiliation_strings":["TE Connectivity,AI Hub,Singapore"],"affiliations":[{"raw_affiliation_string":"TE Connectivity,AI Hub,Singapore","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5110963397"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.17245649,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1706","last_page":"1709"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11948","display_name":"Machine Learning in Materials Science","score":0.8636999726295471,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11948","display_name":"Machine Learning in Materials Science","score":0.8636999726295471,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/index","display_name":"Index (typography)","score":0.5564219355583191},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.43777209520339966}],"concepts":[{"id":"https://openalex.org/C2777382242","wikidata":"https://www.wikidata.org/wiki/Q6017816","display_name":"Index (typography)","level":2,"score":0.5564219355583191},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.43777209520339966},{"id":"https://openalex.org/C136764020","wikidata":"https://www.wikidata.org/wiki/Q466","display_name":"World Wide Web","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tencon61640.2024.10902751","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tencon61640.2024.10902751","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"TENCON 2024 - 2024 IEEE Region 10 Conference (TENCON)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W4391913857","https://openalex.org/W2358668433","https://openalex.org/W4396701345","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W4396696052"],"abstract_inverted_index":{"With":[0],"the":[1,32,38,46,133,137,172,194,199,217,241,250,254],"increasing":[2],"focus":[3],"on":[4,183],"sustainability,":[5],"industries":[6],"are":[7],"rapidly":[8],"adopting":[9],"technologies":[10],"such":[11,51],"as":[12,52],"3D":[13],"printing":[14],"and":[15,45,64,84,95,115,140,245],"making":[16],"significant":[17,127],"investments":[18],"to":[19,71,136,153,164,179,192,215,239],"achieve":[20],"their":[21,99],"environmental":[22],"goals.":[23],"This":[24,121,156],"technological":[25],"shift":[26],"is":[27,92,112,190,213],"driving":[28],"a":[29,113,126,150],"surge":[30],"in":[31,74,81,253],"development":[33],"of":[34,40,48,89,145,174,201,219],"new":[35,55,130,236],"polymers,":[36],"including":[37],"revival":[39],"materials":[41],"like":[42,61,106],"aliphatic":[43],"polyketone":[44],"creation":[47],"innovative":[49,228],"resins":[50,91,131],"polyacrylates.":[53],"These":[54],"materials,":[56],"targeting":[57],"at":[58,210,223],"specific":[59],"properties":[60,88],"flame":[62],"retardancy":[63],"heat":[65],"stabilization,":[66],"require":[67],"rigorous":[68],"regulatory":[69,233],"approval":[70],"be":[72,162],"used":[73,214],"applications":[75],"with":[76,249],"strict":[77],"safety":[78],"standards,":[79],"especially":[80],"electrical":[82],"connectors":[83],"components.":[85],"Validating":[86],"short-term":[87],"these":[90],"relatively":[93],"quick":[94],"straightforward.":[96],"However,":[97],"assessing":[98],"long-term":[100,166],"thermal":[101,167,202],"stability,":[102],"particularly":[103],"through":[104],"tests":[105],"UL's":[107],"Relative":[108],"Thermal":[109],"Index":[110],"(RTI),":[111],"complex":[114],"time-consuming":[116],"process,":[117],"often":[118],"taking":[119],"months.":[120],"lengthy":[122],"testing":[123,176,208,221],"period":[124],"poses":[125],"challenge":[128],"for":[129],"entering":[132],"market,":[134],"due":[135],"high":[138],"time":[139],"cost":[141],"involved.":[142],"The":[143],"advancement":[144],"artificial":[146],"intelligence":[147],"(AI)":[148],"offers":[149],"transformative":[151],"solution":[152],"this":[154,227],"problem.":[155],"paper":[157],"explores":[158],"how":[159],"AI":[160,230],"can":[161],"utilized":[163],"predict":[165,216],"performance":[168],"accurately,":[169],"effectively":[170],"reducing":[171],"duration":[173],"RTI":[175,195],"by":[177,197],"up":[178],"50%":[180],"without":[181],"compromising":[182],"reliability.":[184],"More":[185],"specifically,":[186],"An":[187],"AI-based":[188],"methodology":[189],"proposed":[191],"estimate":[193],"temperature":[196],"incorporating":[198],"physics":[200],"degradation,":[203],"where":[204],"data":[205],"from":[206],"shorter":[207],"periods":[209],"higher":[211],"temperatures":[212],"results":[218],"longer":[220],"durations":[222],"lower":[224],"temperatures.":[225],"Through":[226],"approach,":[229],"enables":[231],"faster":[232],"approvals,":[234],"allowing":[235],"polymer":[237],"developments":[238],"reach":[240],"market":[242],"more":[243],"quickly":[244],"efficiently,":[246],"keeping":[247],"pace":[248],"dynamic":[251],"advancements":[252],"field.":[255]},"counts_by_year":[],"updated_date":"2025-12-23T23:11:35.936235","created_date":"2025-10-10T00:00:00"}